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1-24 of 162 Items

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  1. eBOX671A Fanless Embedded System with LGA1200 Socket 11th/10th Gen
    eBOX671A Fanless Embedded System with LGA1200 Socket 11th/10th Gen

    With LGA1200 Socket 11th/10th Gen Intel Xeon, Core i9/i7/i5/i3 or Celeron Processor, Intel W480E, 2 HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 48 VDC

    Key Features:

    • LGA1200 11th/10th gen Intel® Xeon®, Core™ i9/i7/i5/i3 or Celeron® with Intel® W480E chipset (Comet Lake-S)
    • 4 GbE LAN with optional PoE supported
    • Dual 2.5" SATA HDD drive bays with RAID 0 & 1
    • 2 HDMI and 1 DisplayPort for triple-view
    • -40°C to +70°C wide range operation temperature
    • Wide range power input from 9 to 48 VDC
    • Flexible I/O window supported via mPCIe modules
  2. D613 Intel 13th Gen with vPro Technology
    D613 Intel 13th Gen with vPro Technology

    Giada D613 Intel 13th Gen vPro 5G Simultaneous 4K

    Key Features:

    • Intel® 13th Gen. Raptor Lake Processors provide high computing performance and efficiency.
    • Giada D613 supports four display outputs, allowing for simultaneous 4K video playback.
    • Intel® vPro Technology offers integrated hardware-based PC protection, including below-the-OS security and advanced threat detection.
    • The D613 is compatible with a 5G cellular network, providing significantly faster speeds, low latency, and increased capacity.
    • The combination of high-performance cores and efficient cores in the processors optimizes power consumption without sacrificing processing power.
  3. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  4. GOT317B-ADL-TRD 17" Fanless Touch Panel PC 13th/12th Gen
    GOT317B-ADL-TRD 17" Fanless Touch Panel PC 13th/12th Gen

    17" SXGA Fanless Touch Panel Computer with LGA1700 Socket 13th/12th Gen Intel® Core™ i7/i5/i3 or Pentium® Processor

    Key Features:

    • 17” SXGA LCD with 350 nits of brightness
    • 5-wire resistive touch
    • Supports one 2.5” SATA HDD/SSD
    • Flat front panel touch screen with rugged IP65 front bezel
    • Fanless design
    • Supports WLAN module and antenna (optional)
    • Supports 4 USB and 2COM ports
    • TPM 2.0 onboard
    • Swappable HDD Tray
    • Supports panel mount, VESA mount, desktop stand, and wall mount
  5. FPC-1736 17" 8th/9th Gen CPU Rugged Multi-touch Panel PC
    FPC-1736 17" 8th/9th Gen CPU Rugged Multi-touch Panel PC

    17" 8th/9th Gen Intel Generation Core Pentium i7/ i5/ i3 Processors Full-falt Rugged Multi-touch Panel PC With Active Cooling and Expansion Slot

    Key Features:

    • Intel LGA1151 Socket Supports 8th /9th refresh Generation Core™ Pentium /i7/ i5/ i3 Processors (Max. TDP at 65W)
    • 2 x Memory Socket, Max. Up to 64GB DDR4 2133/2400/2666 MHz
    • 4 x USB3.0, 1 x USB2.0(Internal for dongle)
    • 3 x RS232, 2 x LAN,1 x HDMI 1.4b, 1 x VGA
    • 1 x Storage, 2.5” Drive Bay, 1 x M.2 SSD
    • 1 x M.2 Key-E for Wi-Fi, Bluetooth
    • Support 1 x PCIex4 Expansion Slot (option for 2 x PCI slot)
    • Wide Voltage DC input +12V ~ +24V
    • Front IP65, Panel Mounting Kits
    • CE, FCC Class A, CCC
  6. Neu-X304 Edge Computer System 13/12th Gen CPU
    Neu-X304 Edge Computer System 13/12th Gen CPU

    Unleash the potential of multiple AI and edge applications with the Neu-X304

    Key Features:

    • 13/12th Gen Intel® Core™ i9/i7/i5/i3 processors, up to 35W
    • Dual channel DDR5 SO-DIMM, max up to 64GB
    • Support 3 x HDMI 2.0 output, 4K@60Hz
    • Dual Intel® LAN ports
    • Rich Interface : 2 x COM ports, 8 x USB port, Mic-in, Line-out
    • TPM 2.0 onboard
    • Support Intel® AMT technology (Q670E only)
    • Multiple expansion slots: M.2 2280 Key M for storage, M. 2 2230 Key E for Wi-Fi module,
    • M.2 3052 Key B for LTE/5G module
    • Power Input:12V DC or 12~24V DC (Q670E only)
  7. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
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Tekdis offers custom built solutions for your application

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