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Screen Size  
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DIN-Mountable  
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19 Items

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  1. VNS-15W01 15.6" Ultra Slim Panel PC
    VNS-15W01 15.6" Ultra Slim Panel PC

    15.6" Venus Panel PC

    Key Features:

    • Intel Atom x5-Z8350 Processor: 2M Cache, up to 1.92 GHz
    • 2GB / 4GB RAM, 32GB / 64G eMMC
    • PCAP Touch
    • 10/100/1000 Ethernet (PXE Boot)
    • Touch button (Power/ Brightness/ Volume/ LED)
    • DC 12~24V Input or Powered LAN 802.3AT
    • NFC Reader
    • Smart Card Reader
    • AMIC
    • 2.0MP Camera
    • Speak 4Ω 2.0W/2.5W(MAX)
    • LED Indicating Light Bar (Light colour: Green and Red, Illuminating area: 70*8mm(front),70*5mm(side))
    • 75 x 75mm VESA Mount
  2. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  3. FPC-1736 17" 8th/9th Gen CPU Rugged Multi-touch Panel PC
    FPC-1736 17" 8th/9th Gen CPU Rugged Multi-touch Panel PC

    17" 8th/9th Gen Intel Generation Core Pentium i7/ i5/ i3 Processors Full-falt Rugged Multi-touch Panel PC With Active Cooling and Expansion Slot

    Key Features:

    • Intel LGA1151 Socket Supports 8th /9th refresh Generation Core™ Pentium /i7/ i5/ i3 Processors (Max. TDP at 65W)
    • 2 x Memory Socket, Max. Up to 64GB DDR4 2133/2400/2666 MHz
    • 4 x USB3.0, 1 x USB2.0(Internal for dongle)
    • 3 x RS232, 2 x LAN,1 x HDMI 1.4b, 1 x VGA
    • 1 x Storage, 2.5” Drive Bay, 1 x M.2 SSD
    • 1 x M.2 Key-E for Wi-Fi, Bluetooth
    • Support 1 x PCIex4 Expansion Slot (option for 2 x PCI slot)
    • Wide Voltage DC input +12V ~ +24V
    • Front IP65, Panel Mounting Kits
    • CE, FCC Class A, CCC
  4. EPD-2501 Public Information e-Ink Display
    EPD-2501 Public Information e-Ink Display

     

    Onboard Intel Celeron SoC BGA Processor N3350

     

    Key Features: 

    • 25.3” E Ink Black/White/Red/Yellow
    • 25.3” E Ink Gallery Plus Full colour 55K (Typ.)
    • ​25.3" E Ink Kaleido with colour 4096
    • Onboard Intel® Celeron® SoC BGA Processor N3350
    • DDR3L 1866MTs SO-DIMM up to 8GB,
    • 2.5” SATA3 SSD 64GB  
    • 2 x HDMI, 1 x COM, 2 x LAN, 4 x USB 3.1(Gen1)
    • Front Cover Glass, Optional PMMA, support IP54
    • Super Slim Bezel Design
    • E Ink SDK / API support
    • Optional WiFi Module
    • Operating Temp 0~40C
  5. NUC-APL Fanless NUC System J3455/N3350
    NUC-APL Fanless NUC System J3455/N3350

    Intel Apollo Lake Celeron Processor J3455/N3350 Up to 8GB DDR3

    Key Features:

    • Onboard Intel Celeron Processor J3455/N3350
    • Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
    • Rich I/O, 2 x COM, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
    • Triple Display, 2 x HDMI, 1 x DP (DVI-I/VGA Factory Option)
    • Expansion Slot,  M.2 Key-B,  M.2 Key-E
    • Fanless Operating from 0°C ~ 60°C
    • DC Power Input +12V
    • Compact Size, 115mm x 111mm x 58mm
    • Supports VESA/Din-Rail Kit
    • TPM 2.0 (Factory Option)
  6. NUC-APL-SLIM Fanless NUC Slim System J3455/N3350
    NUC-APL-SLIM Fanless NUC Slim System J3455/N3350

    Intel Apollo Lake J3455/N3350 Up to 8GB DDR3

    Key Features:

    • Onboard Intel Celeron Processor J3455/N3350
    • Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
    • Rich I/O, 1 x COM, 2 x HDMI, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
    • Expansion Slot,  M.2 Key-B,  M.2 Key-E
    • Fanless Operating from 0°C ~ 50°C
    • DC Power Input +12V
    • Compact Size, 115mm x 111mm x 45mm
    • Supports VESA/Din-Rail Kit
    • TPM 2.0 (Factory Option)
  7. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
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Tekdis offers custom built solutions for your application

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