aROK8110 8th/9th Core/Xeon CPU + AI for ADAS and Machine Vision

In stock
Brand: Nexcom

AI Rail 2U Computer, Intel® Core™ 8/9th Gen. CPU, PCI-E CPU EN50155-2


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With built-in high-performance Intel Coffee-Lake S/Refresh or Xeon processing power and the powerful NVIDIA GeForce RTX 2080 Ti graphics engine with 4,352 CUDA cores, the aROK 8110 can satisfy a wide range of rolling stock applications, including track obstacle inspection, traffic light, traffic sign recognition, pantograph inspection, and graphics-intensive applications.

Key Features:

  • Rolling stock AI recognition and machine vision applications
  • Up to 8-core Intel 8th/9th Gen Core/Xeon CPU processing power
  • 4 x PCIe 3.0 slots for discrete graphics/inference/frame grabber cards
  • Ultra-fast NVMe M.2/U.2 media for high-speed multi-cameras image capture
  • RAID 0/1/5/10 configurable for data security and integrity
  • 24/36 VDC input with ignition management
  • Special fixture design avoids vibration issues with GPU and PCIe cards
  • The functionality of WWAN/5G NR, WLAN and GNSS with up to 4 SIM slots
  • Compliant with EN 50155 OT4 and MIL-STD-810G for anti-vibration/shock w/ graphics card and PCIe card installed
  • Smart fan design with temperature-based RPMs

This product is listed in Mining, Transport, Nexcom, Mobile Computing, Vehicle PCs
  • Intel® Coffee-Lake S/Refresh Core™/Xeon® i7/i5/i3/Pentium®/Celeron® processor (LGA1151)
PCH Intel® chipset C246
Memory Two 260-pin DDR4 SO-DMIM socketsUp to 32GB+32GB in size, 2400/2666 MHzECC memory to support: i3-8100/8100T, i3-9100T/9100TE, E-2124G, E-2278GE/2278GEL, G5400/5400T, G4900/4900
Storage 4 x 2.5” SATA 3.0 SSD/HDD (15mm height), or 3 x 2.5” SATA 3.0 SSD/HDD + 2 x M.2 2242/2260/2280 Key M NVMe SSD (PCIe 3.0 x2), or 3 x 2.5” SATA 3.0 SSD/HDD + 1 x U.2 NVMe SSD (PCIe 3.0 x2/SATA 3.0)1 x CFast (externally accessible)
Expansion 1 x Full size mPCIe socket (USB 2.0, PCIe 3.0)1 x Full size mPCIe socket (USB 2.0) for LTE module, BOM optional M.2 3042 Key B socket (USB 2.0) for LTE module with 1 x external, 1 x internal SIM1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 1 x external, 1 x internal SIM1 x PCIe 3.0 x16 slot for discrete graphics card, up to 321mm in length3 x PCIe 3.0 x4 slot, up to 240mm in length
GigE/Frame Grabber (optional) 4 Port independent GbE w/ 802.3af/at, max. 60W, M12 X-coded
Discrete Graphics Card (optional) Up to NVIDIA® RTX 3090, 450W or more advanced in the future
GPS and Sensor 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/BeidouBuilt-in G-sensor
LAN 2-Port independent GbE LAN, M12 X-coded9K byte jumbo framePTP (IEEE 1588) supportController: Intel® i210-T1, PHY: Intel® I219LMvPro (iAMT) & WOL support
Security TPM 2.0: Infineon SLB9660TT1.2-FW4.40
I/O Ports, Front-Plate Waterproof DC input connector with ignition for 24/36 VDC-INPower buttonReset button6 x LED indicators for power/IGN/WLAN/WWAN/LAN status4 x LED indicators for storage/fan control5 x LED indicators for user to program1 x USB 3.1 Gen2 + 1 x USB 2.0, type A1 x DB15 (CAN/DIO, 4 x DI/4 x DO + 1 x CAN 2.0B)1 x DB15 (EXT.), reserved for expansion7 x SMA antenna holes2 x DB9 (COM3/COM4) for RS232/RS422/RS485 selectable (isolation)
I/O Ports, Rear-Plate 2 x USB 3.1 Gen2, type A1 x M12 A-coded connector for 2 x USB 2.02 x GbE (M12 X-coded)1 x VGA + 1 x HDMI2 x DB9 (COM1/COM2) for RS232/RS422/RS485 selectable (isolation)2 x SIM slots1 x SMA antenna hole for GNSS6 x SMA antenna holes1 x PCIe x16 lane slot3 x PCIe x4 lane slots1 x DB9 (AUDIO, female) for 1 x Mic-in (stereo), 2 x Line-out (stereo)
Display 1 x VGA port, up to 1920 x 1200@60Hz1 x HDMI v1.4, up to 4096 x 2160@30Hz
DI/DO (isolation) 4-Bit input
- Source: 9~48V-IN (12V@1.1mA/24V@2.2mA)
- External: 0~33VDC pull-high, high-level, 3.3 - 33 VDC; low-level, 0-2 VDC
4-Bit output
- Source: 9~48V-IN (nominal 35mA@24V)
- External: 5~27VDC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C)
Source or external can be selected by software (default: source type)
Fan 1 x CPU fan1 x System fan
CAN 2.0B (isolation) CAN 2.0B (isolation)Controller: SJA1000Bit rate up to 1Mbit/sSocket CAN supported11-bit & 29-bit identifiers, ISO 11898-1, ISO 11898-2ESD: ± 8KV/15KV (contact/air)2.5KV isolated
Power Management 24/36 VDC-INCranking voltage: 6V~9V (< 30 seconds)Reverse protection, OCP & UVPIgnition on/off control/programmable on/off delay timer
Operating System Windows 10/Linux
Dimensions 215 x 385 x 205 (W x D x H) (mm)
Weight 10.5 kg
Environment Operating temperatures
- EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (w/ 35W TDP CPU, industrial SSD) with air flow
Storage temperatures: -40°C~85°CRelative humidity: 10%~95% (non-condensing)Vibration (random)
- IEC 60068-2-64 1.0g@5~500Hz (in operating, HDD), 1.6g for HDD w/ damping brackets
- IEC 60068-2-64 2.0g@5~500Hz (in operating, SSD + graphics card)
Vibration (SSD + graphics card)
- Operating: MIL-STD-810G, 514.6C, category 4
- Storage: MIL-STD-810G, 514.6, category 24, minimum integrity test
Shock (SSD + graphics card)
- Operating: MIL-STD-810G, Method 516.6, procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, procedure V, crash hazard shock test=75g
Certifications CEFCC Class AEN 50155: 2017
- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1
- Supply change over class C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request)
EN 45545-2: 2013+A1:2015