aROK5510 - EN50155 2U 8/9th Gen CPU Rail Server

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Brand: Nexcom

AI Rail 2U Computer, Intel® Core™ 8/9th Gen. CPU, EN50155-2


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aROK 5510, a powerful and dependable Artificial Intelligent (AI) platform, is specifically designed for rolling stock applications such as track obstacle inspection, traffic light and sign recognition, pantograph inspection, and graphic performance that is high. It has an Intel® Coffee Lake S/Refresh 8th/9th-Gen Core/Xeon desktop CPU and an optional discrete graphics card, which ensures graphic performance and meets the majority of the Automated Intelligent (AI) requirements. With dual SIM card support per modem, it allows eight SIM cards to backup each other for improved connectivity quality via software. The aROK 5510 maintains the flexibility to meet the demand for various rolling stock applications such as infotainment, dispatching, transportation cellular router, video server, and video surveillance.

Key Features:

  • Intel Coffee Lake S/Refresh 8th/9th-Gen Core/Xeon LGA1151 socket-type CPU
  • 100W power consumption graphics card support
  • Eight SIM cards + four WWAN modules support
  • LTE/5G WWAN module support
  • 6 x External SSD for RAID 0, 1, 5, 10
  • PCle 3.0 x4 NVMe 1.3 high-performance SSD support
  • EN 50155, class OT4 conformity
  • 3 x mini-PCIe + 3 x M.2 socket expansion
  • Smart fan design with temperature-based RPMs
  • Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+
  • Rackmount platform

This product is listed in Mining, Transport, Nexcom, Mobile Computing, Vehicle PCs
CPU Support 8th/9th generation Intel® Core™ i7/i5/i3 / Xeon® LGA1151 socket
- Intel® Core™ i7-9700TE/i7-8700T, TDP 35W
- Intel® Core™ i5-9500TE/i5-8500T, TDP 35W
- Intel® Core™ i3-9100TE/i3-8100T, TDP 35W
- Intel® Xeon® E-2278GEL, TDP 35W
- Intel® Celeron® G4900T, TDP 35W
Chipset Intel® C246 platform controller hub
Memory 4 x 260-pin 2400MHz DDR4 SO-DMIM sockets up to 32GB/channel (128GB for four channels)ECC memory to support: i3-9100TE/i3-8100T, E-2278GEL, G4900T
Video Output Chipset Intel® UHD graphics 6301 x HDMI 1.4b up to 4096 x 2160 @ 30Hz1 x VGA up to 1920 x 1200 @ 60Hz
Discrete Graphics Card (optional) NVIDIA® GEFORCE® GTX 1650 SUPER up to 100W, 1280 CUDA® cores, 4GB GDDR6
Storage 6 x 2.5” SATA external SSD (compatible with 9.5mm drive)1 x mSATA1 x M.2 2280/2242/2260 Key M socket for SATA 3.0 or PCle 3.0 x4 NVMe 1.31 x Removable SD 3.0
Expansion 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0)1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0), BOM optional full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM1 x Full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen1/PCIe 3.0 (BOM optional), PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM3 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2) for LTE/5G NR module with 2 x external SIM
GNSS and Onboard Sensor 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/BeidouG Sensor (3-axis, 10-bit resolution)
LAN and Power over Ethernet 2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (support iAMT) GbE2-Port LAN 10GbE SFP+ (optional)4-Port LAN M12 X-coded, 10/100/1000 Mbps, PoE 802.3af/at, max. 60W (optional)
Security TPM 2.0: Infineon SLB9665TT2.0FW5.62
I/O Interface-Front 12 x LED indicators (including 2 x programmable LED)1 x HDMI 1.4b1 x VGA1 x M12 A-coded connector for 2 x USB2.03 x USB 3.1 Gen 2 type A (5V/1A)1 x USB 3.1 Gen 1 type A (5V/1A)8 x Externally accessible SIM card sockets with cover6 x 2.5” removable SSD tray (with locker)1 x SD with cover1 x Reset button1 x Power button20 x SMA antenna2 x LAN M12 X-coded, Intel® I210/I219 (support iAMT) 10/100/1000 Mbps1 x DB9 (AUDIO) for1 x Mic-in, 2 x Line-out2 x DB9 (COM1/COM2) for full RS232 (isolation)2 x DB9 (COM3/COM4) for full RS232/422/485 (isolation)1 x DB15 (CAN/DIO)
- 1 x Isolated CANBus 2.0B
- 4 x DI and 4 x DO (isolation)
- Power in for DIO isolation, 9~48VDC
1 x Waterproof DC input connector with ignition
- 24VDC input with 2.5KVDC isolation
- 110VDC input with 2.5KVDC isolation
I/O Interface-Rear 4 x Smart fan (swappable) for system cooling
Power Management Power input 24VDC/110VDC w/ isolationSelectable boot-up & shut-down voltage for low power protection by softwareSetting 8-level power on/off delay time by softwareSupport S3/S4 suspend mode0~255 seconds WDT support, setup by softwareSDK (Windows/Linux) including utility and sample code
Operating System Windows 10/Linux
Dimensions 483 x 400 x 95 (W x D x H) (mm)
*Please reserve total 3U height for aROK 5510 in rack
Weight 8.5kg
Environment Operating temperatures: EN 50155, class OT4 (-40~70°C), 85°C for 10 minutes (w/ 35W TDP CPU, 100W TDP GPU, industrial SSD) with air flowStorage temperatures: -40°C~80°CRelative humidity: 90% (non-condensing)Vibration (random)
- 2g@5~500 Hz (in operation, SSD)
Vibration (SSD)
- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test
Shock (SSD)
- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
Certifications CEFCC Class AEN 50155: 2017
- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1
- Supply change over class C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request)
EN 45545-2: 2013+A1:2015 (PCB)