Q326 Update: DRAM, SSD and Intel CPU Pricing and Lead Times
Update: Memory and Intel CPUs Pricing and Lead Times

aROK8120-AC4F Rail AI Edge Computer with Intel Core

SKU: aROK8120-AC4F


Intel® Core™ Processor (Series 2) with AI Inference Accelerator for Autonomous and Machine Vision

Key Features:

  • Powered by an AI inference accelerator for railway applications
  • Configurable for up to 600W discrete graphics card
  • Built-in high-performance Intel® Core™ Processor (Series 2)
  • Support up to 4 PCIe 5.0/4.0 x16/x8/x4 slots for graphics card, GigE frame grabbers
  • Ultra speed M.2 Key M NVMe & 4 x 2.5” SSD for data integrity
  • RAID 0/1/5/10 configurable for data security
  • DC 24V non-isolated power input with ignition control
  • 4 x 2.5GbE PoE, up to PoE++ (IEEE 802.3bt) support
  • Rich communication ports: 6 x USB 3.2, 2 x CAN FD, and 4 x UART
  • Telemetric functionality with 2 x WWAN/5G NR, 1 x WLAN, and GNSS/DR/RTK support
  • Military standard of MIL-STD-810H for anti-vibration/shock
  • CE/FCC, UKCA, EN 50155, and EN 45545-2 certified

Description

Product Overview

The NEXCOM aROK 8120-AC4F is a heavy-duty edge-AI telematics computer tailored for railway, transport and industrial applications. It combines a high-performance Intel® Core™ Series 2 CPU with the ability to accommodate a discrete GPU (up to 600 W) for demanding AI inference, video analytics, sensor fusion, and real-time machine-vision workloads. The system supports extensive storage, networking, and I/O options — making it a versatile, scalable platform for modern rail, fleet or autonomous-system deployments.

Key Features

High-Performance Computing & GPU Acceleration

  • Supports Intel Core Series 2 processors (up to 65 W TDP) for general compute tasks

  • Configurable for a discrete graphics card up to 600 W to enable GPU-accelerated AI inference, neural networks, video processing and deep-learning workloads

  • Four PCIe expansion slots (PCIe 5.0/4.0 x16 / x8 / x4) for GPU cards, frame grabbers or other high-bandwidth peripherals

Robust Storage & Data Integrity

  • One M.2 Key M NVMe SSD slot (PCIe 4.0 x4) for high-speed storage or OS drive

  • Four 2.5″ SATA SSD bays for high-capacity storage or data logging

  • Configurable RAID 0/1/5/10 across SATA drives for redundancy, performance or data security — ideal for continuous video recording or sensor data archival

Networking & PoE for Sensor Integration

  • Four 2.5 GbE ports with PoE / PoE++ (IEEE 802.3bt) support — able to power PoE devices such as IP cameras, LiDAR sensors or network devices directly, simplifying installation and power distribution

  • Additional rich I/O including multiple USB 3.2 ports, dual CAN-FD, serial ports (RS-232/422/485), DI/DO, and dual HDMI outputs — enabling integration with legacy systems, sensors and displays

Vehicle and Rail-Ready Power & Connectivity

  • Uses DC 24 V (non-isolated) power input with ignition control, overcurrent and undervoltage protection — suitable for rolling stock, buses, trucks or mobile deployments

  • Supports dual WWAN/5G NR modules, WLAN, GNSS (with optional dead-reckoning/RTK) — enabling telematics, fleet tracking, real-time data transmission and edge AI connectivity

Rugged Design & Certifications

  • Designed to meet railway and transportation environmental requirements: compliant with EN 50155 and EN 45545-2 standards

  • Built to withstand vibration and shock per MIL-STD-810H, ensuring reliability under harsh transport conditions

  • Operating temperature range from –30 °C to +70 °C (depending on configuration and power load), and storage tolerance from –40 °C to +85 °C, supporting deployment in extreme climates

Dimensions Drawings

 

 

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More Information

Brand Nexcom
Specifications

Specification

Details

Processor

Intel Core 7/5/3 processor 251E/221E/201E, TDP up to 65W

Chipset

Intel R680E

Memory

2 x DDR5 SO-DIMM, ECC, up to 96GB, 48GB per DIMM, default 8GB

Storage

4 x 2.5” SATA 3.0 SSD (15mm height), removable

1 x M.2 Key M 2280 NVMe SSD PCIe 4.0 x4

Expansion Slot

1 x Full size Mini PCIe 3.0 x2 slot USB 3.2, USB 2.0

Option for M.2 Key B 2 x nano SIM

1 x M.2 Key E PCIe 3.0 x1, USB 2.0

Support Wi Fi 5/6 module

2 x M.2 Key B 3042/3052 USB 3.2, USB 2.0

Support LTE/5G NR module

1 x PCIe 5.0 x16 3.5 slot width

For discrete graphics card

2 x PCIe 4.0 x8 slot

1 x PCIe 4.0 x4 slot

Dedicated GPU (optional)

Up to NVIDIA GeForce RTX 5090, 600W

Sensor

GNSS: u blox NEO M9N module for GPS, GLONASS, QZSS, Galileo, Beidou

Optional modules with dead reckoning or RTK

MEMS: 3D accelerometer and 3D gyroscope, ST LSM6DSLTR

System Capabilities

TPM 2.0 Infineon SLB 9672VU2.0 FW15.23

Display Interface

1 x VGA up to 1920x1200 at 60Hz

2 x HDMI 2.1 up to 4096x2304 at 60Hz

CAN bus (isolation)

2 x CAN FD compatible with CAN 2.0A and 2.0B

Up to 5Mb per second transmit, 2.5KV isolated

IEC 61000 4 2 ESD ± 6KV contact, ± 8KV air

ISO 11898 1 and 11898 2

ESD ± 8KV contact, ± 15KV air, 2.5KV isolated

DI/DO (isolation)

4 Bit input

Source DC 9V to 36V (12V at 1.1mA / 24V at 2.2mA)

External DC 0V to 33V pull high, high level DC 3.3V to 33V, low level DC 0V to 2V

4 Bit output

Source DC 9V to 36V (nominal 35mA at 24V)

External DC 5V to 27V pull high, sink current 220mA each bit, 500mA max at 25C

Source or external selectable by software default source

Serial Port

2 x COM DB9 COM1 COM2 RS 232 422 485

2 x COM DB9 COM3 COM4 RS 232

RS 232 ± 9V, baud up to 115.2kb per second

RS 485 2 wire or 4 wire baud 300 to 115.2kb per second

1 x UART for RTK signal wafer reserved

Power Management

DC 24V non isolated input

8 level power on and off delay by software

Reverse protection, OCP, UVP

Ignition control and delay timer

Connector: 4 x K coded, separate 2 pin for IGN

I/O Interface Front

4 x K coded connector for DC 24V input

1 x 2 pin mini fit for IGN control

ATX power button

Reset button

8 x LED indicator

4 x 2.5 inch SSD tray

2 x USB 3.2 Gen 2 Type A 5V 900mA, lock hole reserved

2 x COM DB9 COM1 COM2

2 x COM DB9 COM3 COM4

1 x VGA DB15

1 x DC out 12V 3A terminal block

6 x SMA antenna hole

2 x USB 2.0 wafer reserved 5V 500mA

I/O Interface Rear

4 x USB 3.2 Gen 2 Type A 5V 900mA, lock hole reserved

2 x HDMI

1 x MULTI port DI/DO + CAN FD DB15

4 x 2.5GbE M12 X coded PoE LAN1 to LAN4, 1 x 1GbE M12 X coded LAN5

IEEE 802.3af at bt LAN1 to LAN4, LAN1 supports bt

9K jumbo frame

Support PTP IEEE 1588

Intel I226 I LAN1 to LAN4, Intel I219 LM LAN5

Support vPro iAMT and WoL LAN5

1 x PCIe x16 slot

2 x PCIe x8 slot

1 x PCIe x4 slot

1 x GNSS antenna

4 x SMA hole

1 x 6-pin M8 for mic in and line out

I/O Interface Top

2 x nano SIM slot, one extra optional

Vibration and Shock

Operating: MIL STD 810H 514.8C Proc 6 Cat 4

IEC 60068 2 64: 2.0g 5Hz to 500Hz

Storage: MIL STD 810H 514.8E Proc 1 Cat 24 7.7g

Shock: MIL STD 810H 516.8 Proc I trucks 40g

Crash hazard Proc V ground 75g

Mechanical

Dimensions 296mm W x 220mm D x 435mm H with bracket

Weight 8kg bare bone

Environment

Operating temp minus 30C to 70C (80W PoE, fan kit, no GPU)

Operating temp minus 30C to 55C (80W PoE, fan kit, 600W GPU)

Storage temp minus 40C to 85C

Humidity 10 to 95 percent non-condensing

Certifications

CE, FCC Class A, EN 50155, EN 45545 2

Operating System

Windows 11

Windows 10 64-bit

Windows 10 IoT 64-bit

Linux Ubuntu 22.04, Linux 5.19

 

Ordering Information

aROK 8120-AC4F (P/N: 10A20812000X0)
System bare-bone, fan-kit, Intel® Core™ 7/5/3 processor, 2 x DDR5 SO-DIMM, 4 x PoE, 1 x LAN, 6 x USB 3.2, 4 x serial, 4 x PCIe slot, DC 24V

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