AV600TH Military IP66 Mission GPU Computer

In stock
Brand: 7StarLake Co, Ltd.

MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

Key Features:

  • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
  • IP66 Chassis with D38999 connectors
  • Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
  • 64GB DDR4 SO-DIMM ECC or non ECC support
  • NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
  • 2.5” SATA SSD
  • 1x 3G-SDI Capture Card (Options)
  • MIL-STD-461 18V~36V DC-Input
  • Extreme Temperature: -20 to 55°C degrees

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The AV600TH-A20-PA1 is powered by Intel® 11th Gen Tiger Lake-H Processors, which include integrated Intel® UHD Graphics based on the Xe architecture. The Tiger Lake H processor is built using 10nm SuperFin Technology and boasts up to 8 CPU cores, operating at a frequency of 4.5 GHz. This processor offers high computing performance and flexibility, making it suitable for demanding IoT workloads. Compared to previous generations, this platform delivers significant performance improvements, with a remarkable 32 per cent increase in single-thread performance. Additionally, it offers high-speed I/O capabilities for expansion and peripheral connectivity.

The AV600TH-A20-PA1 stands out due to its rugged design and extensive functionality. It is equipped with MIL-STD Amphenol type connectors and boasts full IP66 protection, making it capable of withstanding harsh environmental conditions. Furthermore, the AV600TH-A20-PA1 supports an extended temperature range, from -40°C to 70°C, and features a MIL-STD-461 18V~36V DC-input power supply. This power supply safeguards the system against voltage surges, ensuring the reliability of critical components and the system itself.


ARINC 429 is a globally recognized standard for data transmission in aircraft electronics. It is primarily used in commercial and transport aircraft for various communication and guidance purposes, such as altitude reference and flight management. To achieve a successful flight, these systems must work in harmony. The physical connections in ARINC 429 involve twisted pairs of wires that carry balanced differential signalling.

The unit of transmission in ARINC 429 is a fixed-length 32-bit frame, referred to as a 'word' in the standard. The individual bits within an ARINC 429 word are sequentially labelled from Bit Number 1 to Bit Number 32.


Intel® 11th  Gen. Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics

- Intel® Xeon® W-11865MLE, 25W Tiger Lake 11th Gen, 8C, Freq. 1.5/4.5 GHz, 24MB cache

Memory type

Up to 96GB DDR4 SO-DIMM, non-ECC and ECC


Intel® RM590E (support ECC, with Xeon CPU) /QM580E


NVIDIA RTX™ A1000/A2000

4GB/8GB GDDR6 memory, 2048/2560 CUDA cores

Expansion Slot

2x Full-size mini PCIe (1 with mSATA supported)

-1 with mSATA/USB2.0/PCIeX1 support

-1 with SIM/USB2.0/PCIeX1 support

1x 2280 M key (SATA only)



1x 2.5” SSD, Hot Swappable SSD/HDD slot


1x 2280 M key (SATA only)


Ethernet (Internal)

2x 10/100/1000 Ethernet Ports

Front I/O


2x GbE LAN + 2x USB2.0 + 1x COM(RS232) with D38999 connector 


1x VGA+ 4x DI/4x DO +3x RS422, with D38999 connector 


1x USB3.0 , with D38999 connector  


1x USB3.0 , with D38999 connector  


1x DC-in, with D38999 connector   


1x SSD/HDD LED indicator


1x IP65 power button, with LED indicator


2x 2.5” Easy swap SSD Tray


Power input

MIL-STD -461 18V~36V DC-Input

Application, Operating System


Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.

Operating System

Windows® 10 64-bit / Linux (support by request)



250 x 325 x 100 mm (LxWxH)


11 KG


Aluminum Alloy


Heatsink Aluminum Alloy, Corrosion Resistant


Green Product

RoHS, WEEE compliance

Operating Temp.

-20 to 55°C

Storage Temp.

-40 to 85°C

Relative Humidity

5% to 95%, non-condensing


Method 507.5, Procedure II ( Temperature & Humidity )

Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )

Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )

Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )

Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )

Method 501.5, Procedure I ( Storage/High Temperature )

Method 501.5, Procedure II ( Operation/High Temperature )

Method 502.5, Procedure I ( Storage/Low Temperature )

Method 502.5, Procedure II ( Operation/Low Temperature )

Method 503.5, Procedure I ( Temperature shock )


No Moving Parts; Passive Cooling.

Designed and manufactured using ISO 9001 / 2000 Certified Quality Program.


CE102: 10 KHz - 10 MHz

RE102-4: 1.5 MHz -30 MHz - 5 GHz

RS103: 200 MHz - 3.0 GHz - 5.0 GHz, 50 V/m equal for all frequencies

Designed to Meet Items (Options)

CS101, CS114, CS115, CS116

CE106, RE103, RS101



Steady State



Surge Low



Surge High