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NDiS-B562 Fanless Duro Edge Computer with Intel Core Series 2 & 14th Gen

SKU: NDiS-B562

Duro Edge Computer Powered by Intel® Core™ Processor (Series 2)/Intel® Core™ i Processor

Key Features:

  • Intel® Core™ processor (Series 2)/14/13/12th Gen Intel® Core™ i processor
  • Support Intel® AMT technology
  • 2 x DDR5 SO-DIMM, up to 96GB
  • 1 x HDMI® 2.0 output, up to 4096 x2160@60Hz
  • 3 x Intel® LAN port
  • 3 x USB 3.2 Gen 1x1, 2 x USB 2.0, 2 x DP 1.2
  • Support PCIe 4.0 1x16/PCIe 4.0 2x8 expansion card/2 x 2.5” SSD swap bay
  • TPM 2.0 for security
  • 1 x M.2 Key B 3052/3042 for an optional 5G/LTE module
  • 1 x M.2 Key E 2230 for an optional Wi-Fi module
  • 1 x M.2 Key M 2280 for an optional SSD
  • Support DC +12V~24V power input

Description

Product Overview

The NEXCOM NDiS B562 is a high-performance edge computer from the DURO Edge family, built for AI, IoT gateway and industrial computing tasks. It supports 12th, 13th, and 14th-Gen Intel® Core™ i processors (socket type) and features dual DDR5 SO-DIMM slots supporting up to 96 GB of memory. The unit offers three Intel LAN ports, multiple USB ports, HDMI and DisplayPort outputs, and PCIe 4.0 expansion slots (x16 or dual x8). Storage flexibility is included with two 2.5″ SSD swap bays and M.2 slots for SSD, Wi-Fi and 5G/LTE modules. With a wide DC power input of +12 V to +24 V, it is engineered for reliable operation in varied industrial or mobile environments.

Key Features

High Performance Computing

  • Supports 14th/13th/12th Gen Intel Core i processors and Intel AMT technology

  • Up to 96 GB DDR5 memory via 2 SO-DIMM slots

  • PCIe 4.0 x16 or dual x8 expansion options for external GPU, capture or compute cards

  • Two 2.5″ SSD swap bays for easy storage deployment

Connectivity & I/O

  • 1 HDMI 2.0 output with up to 4096 × 2160 @ 60 Hz

  • 2 DisplayPort 1.2 outputs

  • 3 Intel LAN ports for robust network interfaces

  • 3 USB 3.2 Gen1 ports, 2 USB 2.0 ports

  • M.2 Key B slot (for optional 5G/LTE module), M.2 Key E slot (for optional Wi-Fi module), M.2 Key M slot (for NVMe SSD)

  • Supports RS-232/RS-422/RS-485 COM ports for sensor or legacy device integration

Rugged and Reliable Design

  • Wide DC input range: +12 V to +24 V, designed for industrial and embedded applications

  • Compact chassis designed for edge deployments such as self-service kiosks, smart parking systems or transport technology

  • RAID-0 and RAID-1 capability via dual internal SATA SSDs to protect critical data

Expansion-Ready & Future-Proof

  • Optional external GPU or accelerator card via PCIe slots

  • Modular design supports Wi-Fi, 5G/LTE connectivity, NVMe high-speed storage

  • Designed with lifecycle flexibility and high uptime in mind

Certifications & Compliance

  • Built for industrial-grade deployment environments

  • Designed with long-life support and serviceability in mind


Dimensions Drawings

 

 

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More Information

Brand Nexcom
Specifications

Processor

Intel Core Series 2: Core 7 251TE 45W

Intel Core 5 221TE 45W

Intel Core 5 211TE 45W

Intel Core 3 201TE 45W

14th Gen Intel Core i: i9 14900T 35W

i7 14700T 35W

i5 14500T 35W

i3 14100T 35W

Chipset

Intel PCH Q670E or H610E

Memory

2 x DDR5 5200 SO DIMM, non ECC, up to 96GB

Display Interface

Intel UHD Graphics

1 x HDMI 2.0 up to 4096x2160 at 60Hz

2 x DP 1.2 up to 4096x2160 at 60Hz

Storage

1 x M.2 Key M 2280 PCIe 3.0 x4

Expansion Slots

M.2 Key E 2230 for Wi Fi module PCIe 3.0 x1, USB 2.0

M.2 Key B 2242 or 3042 or 3052 for 5G or LTE module PCIe 3.0 x1, USB 3.2

Front I/O

Power button with LED

HDD LED

2 x USB 2.0 onboard

Line out

3 x antenna hole

Rear I/O

3 x USB 3.2 Gen 1x1 Type A

1 x 1GbE RJ45 Intel I219 LM

2 x 1GbE RJ45 Intel I226V

1 x HDMI 2.0 output

2 x DP 1.2 output

2 x COM RS 232 or 422 or 485

5 pin terminal for 180W DC input

3 x antenna hole

Internal I/O

2 x 6 pin header for four USB 2.0 (Q670E)

1 x 6 pin header for two USB 2.0 (H610E)

4 pin speaker header 2.5W 4Ω

9 pin mic in header

4 x COM RS 232 reserved

2 x SATA 3.0 + 2 x SATA power

8 x GPIO (4 DI, 4 DO)

Environment

Operating temp minus 20 to 60 C

With graphics card 0 to 45 C

Storage temp minus 20 to 80 C

Humidity 10 to 95 percent non condensing

System Capabilities

TPM 2.0

Mechanical

Dimensions B562: 268 x 190.6 x 75.4 mm

B562 with DockInfinity: 388.3 x 190.6 x 75.4 mm

Weight B562: 3kg

With DockInfinity R8 or F R16: 3.73kg

With DockInfinity D: 4.05kg

Package Information

Box size 476 x 355 x 206 mm

Gross weight B562: 4.01kg

With R8 or F R16: 4.79kg

With D: 5.11kg

Power Supply

DC 12 to 24V, 180W

Certifications

CE EN 50035 and EN 50032

FCC Class A Part 15B

LVD EN 62368 1

Operating System

Windows 11

Windows 10 64-bit

Linux

 

Ordering Information

NDiS B562-H (P/N: 10W00B56200X0)
Duro Edge computer, Intel® Core™ processor (Series 2)/Intel® Core™ i processor, Intel® PCH H610E, 1 x HDMI® 2.0, 2 x DP 1.2

NDiS B562-Q (P/N: 10W00B56203X0)
Duro Edge computer, Intel® Core™ processor (Series 2)/Intel® Core™ i processor, Intel® PCH Q670E, 1 x HDMI® 2.0, 2 x DP 1.2

NDiS B562-DIF-Q-R8 (P/N: 10W00B56201X0)
Duro Edge computer, Intel® Core™ processor (Series 2)/Intel® Core™ i processor, Intel® PCH Q670E, 1 x HDMI® 2.0, 2 x DP 1.2, w/ dual PCIe x8 expansion kit (DockInfinity-R8)

NDiS B562-DIF-F (P/N: 10W00B56204X0)
Duro Edge computer, Intel® Core™ processor (Series 2)/Intel® Core™ i processor, Intel® PCH H610E, 1 x HDMI® 2.0, 2 x DP 1.2, w/ one PCIe x16 expansion kit, fan and ventilation holes (DockInfinity-F-R16)

NDiS B562-DIF-D (P/N: 10W00B56205X0)
Duro Edge computer, Intel® Core™ processor (Series 2)/Intel® Core™ i processor, Intel® PCH Q670E, 1 x HDMI® 2.0, 2 x DP 1.2, w/ dual SSD bay kit (DockInfinity-D)

DockInfinity-R8 (P/N: 10W00DOCK02X0)
Dual PCIe x8 expansion kit for Duro Edge computer

DockInfinity-F-R16 (P/N: 10W00DOCK00X0)
One PCIe x16 expansion kit with two-slot space for Duro Edge computer, w/ fan and ventilation holes

DockInfinity-D (P/N: 10W00DOCK03X0)
Dual SSD bay kit for Duro Edge computer

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