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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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TANK-880-Q370 High-Performance 8th/9th Gen PC
Ruggedized Fanless embedded system with Intel® i7-9700TE 1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS
Key Features:
- 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
- Dual independent displays with high-resolution support
- Rich high-speed I/O interfaces
- On-board internal power connector for providing power to add-on cards
- Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
- Great flexibility for hardware expansion
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TANK-870-Q170 High-Performance 6th/7th Gen PC
Ruggedized fanless embedded system with High-Performance 6th/7th Generation Intel® Core™ Processor
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AFL3-W22C-ADLP 21.5” Fanless Touch Panel PC
Wide 21.5" 350cd/m² 1920x1080 Panel PC with 12th Gen. Intel Core ion-board processor, PCAP touch, 2M camera, microphone
Key Features:
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12th Gen Intel Core Mobile i7/i5/i3 Processors
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Full HD capacitive touchscreen
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Anti-AG and Anti-UV PCAP
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One E-Window that supports an additional connector interface
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Support WiFi 6E and Bluetooth 5.2
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