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11th
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+50°C
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Nexcom
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XPPC 24-200A 23.8” Fanless Panel PC IP65 Front 11th Gen CPU
23.8” TFT FHD 16:9 Slim Bezel, Multi-touch screen Powered by 11th Generation Intel Core Processor
Key Features:
- 23.8” TFT FHD 16:9 panel
- PCAP 10-point multi-touch with slim bezel design
- IP65-rated front panel
- Support: VESA/panel/open frame mount
- 11th Gen Intel® CoreTM processor (Tiger Lake UP3)
- 1 x 260-pin DDR4 SO-DIMM up to 32G
- On-board M.2 2280 Key M PCIe x4 for storage module
- Support power input 12 VDC
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NISE-70 Celeron/Core Fanless System
Intel Celeron 6305E Processor Dual Core Fanless System
Key Features:
- Onboard Intel Celeron 6305E Processor
- 4 x HDMI
- 3 x USB 3.0, 1 x USB 2.0
- 1 x RS232/422/485, 1 x RS232
- 3 x GbE LAN ports; support WoL, teaming and PXE
- Onboard TPM 2.0 chip
- 1 x M.2 socket for storage/4G LTE/5G modules
- 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
- Support operating temperature from-5 to 55 Celsius degree
- Support+12V to 24VDC input; support ATX power mode
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NDiS-B360 11th Gen Core Slim Wide Temp Embedded Computer
11th Gen Core Wide Temp -20~60°C embedded PC
Key Features:
- 11th Generation Intel Tiger Lake-UP3 Core processor SoC
- Dual 4K@60Hz display output, DP++, HDMI 2.0
- Support 4K@60Hz eDP display output
- Compact and slim design (H: 36mm)
- Dual LAN ports and USB3.0 ports for easy connection
- On-board M.2 Key M 2280 with PCIex4/SATA signal for storage module
- On-board M.2 Key E 2230 for optional WiFi modules
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