Find your technical solution below

Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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  1. Products 26 items
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  8. Storage & Memory 26 items
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  1. MTE672A PCIe M.2 SSD
    MTE672A PCIe M.2 SSD

    PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Compliant with NVM Express specification 1.3
    • Compliant with PCI Express specification 3.1
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • PCIe Gen 3 x4 interface
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Anti-sulfur technology implemented to prevent sulfurization in the environment
    • Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
    • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
  2. MTS970P SATA III M.2 PLP SSD
    MTS970P SATA III M.2 PLP SSD

    Transcend's MTS970P M.2 SSD combines Power Loss Protection (PLP) with a SATA III 6Gb/s interface, 3D NAND technology at 112 layers, and various durability features for enhanced storage efficiency and reliability in mission-critical applications.

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • DDR3 DRAM Cache embedded
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Anti-sulfur technology implemented to prevent sulfurization in the environment
    • Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
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