Find your technical solution below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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MTE662A PCIe M.2 SSD
PCI Express (PCIe) Gen 3 x4 interface and compatible with NVM Express (NVMe), 3D NAND technology
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MTE662P & MTE662P-I PCIe M.2 SSDs
PCI Express (PCIe) Gen 3 x4 interface, compatible with NVM Express (NVMe) 1.3, 3D NAND technology
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MTE712A & MTE712A-I M.2 SSD
Features the 112-layer 3D NAND flash and the PCI Express (PCIe) Gen 4 x4 interface
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mSATA SSD MSA370 & MSA370I
Industrial SATA III M.2 SSD
- Advanced Global Wear-leveling and Block management for reliability
- DDR3 DRAM cache
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M.2 SSD MTE652T
MTE652T – PCIe Gen 3 x4 M.2 SSD
Power Supply: 3.3V±5%
Fully compatible with devices and OS that support the PCIe Gen 3 standard
Compliant with M.2 standards
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MTE460T & MTE460T-I PCIe M.2 SSDs
128GB/256GB/512GB/1TB PCIe M.2 SSD PCIe Gen 3x2 112-layer 3D NAND flash
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MSM362M & MSM362I mSATA mini SSD
16/32/64/128GB mSATA mini SSD
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with JEDEC MO-300B
- MLC NAND flash
- Supports Transcend Scope Pro software
- Promised operational reliability in a wide temperature range (from -40° to 85°C)
- Built-in BCH ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
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MTE672A PCIe M.2 SSD
PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)