| LCD Panel |
10.4-inch TFT LCD panel with LED backlight
1024 x 768 pixels
Brightness: 1200 cd/m² (typical)
Viewing angle: 170° (H)/170°(V)
Contrast ratio: 900:1 (typical)
|
| Touch Screen (BOM optional) |
Projected capacitive
Anti-glare coating surface
Transmission rate: 85 ± 3%
|
| CPU |
Intel Atom x6414RE quad-core processor, 1.5 GHz, TDP 9W |
| Memory |
1 x 260-pin DDR4 SO-DIMM socket support 3200MHz up to 32GB. default 2666MHz, 4GB
With In-Band ECC (IBECC)
|
| Video Output |
1 x HDMI 1.4b up to 3840 x 2160@30 Hz
1 x DP 1.4 up to 4096 x 2160@60 Hz
|
| Storage |
1 x M.2 2280 Key M socket (SATA 3.0 or PCle 3.0 x1)
1 x mSATA (occupied mini-PCIe slot)
|
| Expansion |
1 x M.2 2230 Key E socket (USB 2.0, PCIe 3.0 x2)
1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0)
1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen2) for LTE/5G NR module, BOM optional 1 x Full size mini-PCIe socket (USB 2.0, USB 3.2 Gen2 (BOM optional)) for LTE module, with 1 x external micro-SIM slot, 1 x internal micro-SIM slot
|
| GNSS and Onboard Sensor |
1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS /Glonass/Galileo/Beidou
M8U modules with dead reckoning available
1 x 3D accelerometer and 3D gyroscope
|
| LAN and Power over Ethernet |
2-Port LAN M12 X-coded, 10/100/1000/2500 Mbps, Intel® I225-IT (optional PoE 802.3af/at, max. 30W, w/ VIOD-POE2-01) |
| Security |
TPM 2.0: Infineon SLB9670VQ2.0 FW7.62 |
| I/O Interface-Lateral |
Right Side
- 1 x System reset button
- 1 x USB 3.2 Gen2 type A connector
- 1 x Micro-SIM slot w/ cover |
| I/O Interface-Rear |
2 x DB9 (COM1/COM2) for full RS232/RS422/RS485 (w/ isolation)
1 x Power connector, M12 A-coded 5-pin
2 x 10/100/1000/2500 Mbps LAN, M12 X-coded 8-pin
1 x M12 A-coded 8-pin for 2 x USB 2.0
1 x Line-in (stereo), 2 x Line-out (stereo) (AUDIO, DB9, female)
1 x HDMI output1 x DP output1 x M12 (MULTI PORT1, A-coded 17-pin)
- 4 x DI (w/ isolation)
- 2 x DO (w/ isolation)
- Power in for DIO isolation, 14~48VDC
- 1 x Isolated CANBus 2.0B
- 1 x Power button
- 4 x Composite video input
1 x RP-SMA connector hole for Bluetooth
3 x RP-SMA connector hole for WLAN
2 x SMA connector hole for WWAN
1 x SMA connector for GNSS1 x Ground connector
|
| Mechanical |
Cooling system: fanless
Enclosure: metal
Mounting: open frame mount, VESA 75 mount
Dimension: 309 x 230.6 x 67.7 mm
Cutout dimension: 212.2 x 159.4 mm
Weight: 3.0 kg
|
| Power Management |
24/36V DC (14 ~ 48VDC) in, w/o isolation
24/110V DC in, w/ isolation (BOM optional)
Reverse protection, OCP & UVP
Selectable boot-up & shut-down voltage for low power protection by software
Setting 8-level power on/off delay time by software
10~255 seconds WDT support, setup by software
SDK (Windows/Linux) including utility and sample code
|
| Environment |
Operating temperatures
- EN 50155, class OT3 (-30°C~70°C), 85°C for 10 minutes (w/ 9W TDP CPU, industrial SSD) with airflow
Storage temperatures: -40°C to 80°C
Relative humidity: 10% to 90% (non-condensing)
Vibration (random) 2g@5~500 Hz (in operation, SSD)
Vibration
- Operating: MIL-STD-810H, 514.8C Procedure 1, Category 4
- Storage: MIL-STD-810H, 514.8E Procedure 1, Category 24Shock
- Operating: MIL-STD-810H, Method 516.6, Procedure I, trucks and semi-trailers = 40g
- Crash hazard: MIL-STD-810H, Method 516.6, Procedure V, ground equipment = 75g
|
| Operating System |
Windows 10/Windows 11
Linux
|
| Standards/Certifications |
CEFCC Class AEN 50155: 2017
- Ambient temperature EN 50155, Class OT3 (-30°C~70°C)
- Interruptions of voltage supply class S1
- Supply change over class C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request)EN 45545-2: 2020 (PCB) |
