vROK3030 10.4” Railway Open Frame Panel Computer

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SKU:
vROK3030-A
Brand: Nexcom

10.4” Railway Open Frame Panel Computer with Intel Atom x6414RE Processor


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The 10.4-inch, all-in-one vROK 3030 railway open frame panel computer is intended for passenger information systems and human-machine interface (HMI) for use in railway applications. It uses the most recent Intel Atom x6414RE processor under Linux and Windows. For security purposes, it can support up to four analogue cameras or two PoE cameras (using an optional capture card). A 1,200 nit LCD panel ensures sunlight legibility. Triple displays with passenger information, advertising, or onboard entertainment, LCD monitor, 1 HDMI, 1 DP video output. In order to support mSATA/capture cards and WLAN/WWAN wireless connectivity for data transmission, mini-PCIe slots x 1 and M.2 slots x 2 have been designed.

Key Features:

  • Intel Atom x6414RE quad-core processor, 9W
  • 10.4” TFT LCD monitor with PCAP touch (BOM optional)
  • IPS LCD with wide viewing angle and resolution 1024 x 768
  • Sunlight readable capability: 1,200nits LCD brightness
  • LCD monitor, 1 x HDMI, 1 x DP video outputs for triple displays
  • Isolated CANBus 2.0 x 1
  • CVBS input for analog camera x 4 (work with optional capture card)
  • PoE supported for IP camera x 2 (optional)
  • Open frame design for a wide variety of form factors
  • EN 50155, class OT3 (-30°C~70°C) certificated for railway

This product is listed in Industries, Partners, Transport, Nexcom, Mobile Computing
LCD Panel

10.4-inch TFT LCD panel with LED backlight

1024 x 768 pixels

Brightness: 1200 cd/m² (typical)

Viewing angle: 170° (H)/170°(V)

Contrast ratio: 900:1 (typical)

Touch Screen (BOM optional)

Projected capacitive

Anti-glare coating surface

Transmission rate: 85 ± 3%

CPU Intel Atom x6414RE quad-core processor, 1.5 GHz, TDP 9W
Memory

1 x 260-pin DDR4 SO-DIMM socket support 3200MHz up to 32GB. default 2666MHz, 4GB

With In-Band ECC (IBECC)

Video Output

1 x HDMI 1.4b up to 3840 x 2160@30 Hz

1 x DP 1.4 up to 4096 x 2160@60 Hz

Storage

1 x M.2 2280 Key M socket (SATA 3.0 or PCle 3.0 x1)

1 x mSATA (occupied mini-PCIe slot)

Expansion

1 x M.2 2230 Key E socket (USB 2.0, PCIe 3.0 x2)

1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0)

1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen2) for LTE/5G NR module, BOM optional 1 x Full size mini-PCIe socket (USB 2.0, USB 3.2 Gen2 (BOM optional)) for LTE module, with 1 x external micro-SIM slot, 1 x internal micro-SIM slot

GNSS and Onboard Sensor

1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS /Glonass/Galileo/Beidou

M8U modules with dead reckoning available

1 x 3D accelerometer and 3D gyroscope

LAN and Power over Ethernet 2-Port LAN M12 X-coded, 10/100/1000/2500 Mbps, Intel® I225-IT (optional PoE 802.3af/at, max. 30W, w/ VIOD-POE2-01)
Security TPM 2.0: Infineon SLB9670VQ2.0 FW7.62
I/O Interface-Lateral Right Side
- 1 x System reset button
- 1 x USB 3.2 Gen2 type A connector
- 1 x Micro-SIM slot w/ cover
I/O Interface-Rear

2 x DB9 (COM1/COM2) for full RS232/RS422/RS485 (w/ isolation)

1 x Power connector, M12 A-coded 5-pin

2 x 10/100/1000/2500 Mbps LAN, M12 X-coded 8-pin

1 x M12 A-coded 8-pin for 2 x USB 2.0

1 x Line-in (stereo), 2 x Line-out (stereo) (AUDIO, DB9, female)

1 x HDMI output1 x DP output1 x M12 (MULTI PORT1, A-coded 17-pin)
- 4 x DI (w/ isolation)
- 2 x DO (w/ isolation)
- Power in for DIO isolation, 14~48VDC
- 1 x Isolated CANBus 2.0B
- 1 x Power button
- 4 x Composite video input

1 x RP-SMA connector hole for Bluetooth

3 x RP-SMA connector hole for WLAN

2 x SMA connector hole for WWAN

1 x SMA connector for GNSS1 x Ground connector

Mechanical

Cooling system: fanless

Enclosure: metal

Mounting: open frame mount, VESA 75 mount

Dimension: 309 x 230.6 x 67.7 mm

Cutout dimension: 212.2 x 159.4 mm

Weight: 3.0 kg

Power Management

24/36V DC (14 ~ 48VDC) in, w/o isolation

24/110V DC in, w/ isolation (BOM optional)

Reverse protection, OCP & UVP

Selectable boot-up & shut-down voltage for low power protection by software

Setting 8-level power on/off delay time by software

10~255 seconds WDT support, setup by software

SDK (Windows/Linux) including utility and sample code

Environment

Operating temperatures
- EN 50155, class OT3 (-30°C~70°C), 85°C for 10 minutes (w/ 9W TDP CPU, industrial SSD) with airflow

Storage temperatures: -40°C to 80°C

Relative humidity: 10% to 90% (non-condensing)

Vibration (random) 2g@5~500 Hz (in operation, SSD)

Vibration
- Operating: MIL-STD-810H, 514.8C Procedure 1, Category 4
- Storage: MIL-STD-810H, 514.8E Procedure 1, Category 24
Shock
- Operating: MIL-STD-810H, Method 516.6, Procedure I, trucks and semi-trailers = 40g
- Crash hazard: MIL-STD-810H, Method 516.6, Procedure V, ground equipment = 75g

Operating System

Windows 10/Windows 11

Linux

Standards/Certifications CEFCC Class AEN 50155: 2017
- Ambient temperature EN 50155, Class OT3 (-30°C~70°C)
- Interruptions of voltage supply class S1
- Supply change over class C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request)
EN 45545-2: 2020 (PCB)