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VTC7270 Fanless AI Powered Vehicle Computer

SKU: VTC7270

12/13th Gen Intel Core CPU 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE

Key Features:

  • Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
  • Rich I/Os, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE (option)
  • 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
  • Up to 4 WWAN/WLAN combinations for mobile router applications
  • Up to two Hailo AI accelerator (26TOPS workload each) computing power in option
  • 9~36V DC-IN with ignition control & OCP/OVP
  • Wide range operating temperature of -40°C~70°C (fanless@35W CPU)
  • Military standard for anti-vibration/shock
  • CE/FCC, UKCA, Emark Certified

Description

The VTC 7270 is an in-vehicle telematics computer that uses artificial intelligence and has 30% more processing capacity than its predecessor thanks to its Intel® 12/13th Gen processor. Any in-vehicle application, including fleet management, logistics/AMR, ITS, construction, ANPR, and security surveillance of public transit, among others, can be satisfied by its 10-year lifespan support.

The VTC 7270 can be installed widely in small spaces, can withstand harsh environments, and has a fanless design that greatly lowers maintenance expenses for continuous operation. The VTC 7270 is a complex AI-aided telemetric computer that also includes a variety of peripherals, such as triple displays, a wide-range 9–36VDC with IGN control, 2.5GbE, 6 USB 3.2, 2 isolation CAN FD, 4 serial ports, NVMe storage, and 5 extension slots.

The user can set up LTE/5G modems, Wi-Fi 5/6 modules, and one or two Hailo AI accelerators (26TOPS) to function as the edge AI and implement AI services that collaborate with cloud SaaS. The VTC 7270 also complies with MIL-STD-810H military standards for vibration and shock resistance and can work in harsh environments with temperatures ranging from -40°C to 65°C. The VTC 7270 conforms with CE/FCC classA, UKCA, and Emark regulations in terms of compliance. (E13).

Key Features:

  • Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
  • Rich I/Os, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE (option)
  • 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
  • Up to 4 WWAN/WLAN combinations for mobile router applications
  • Up to two Hailo AI accelerator (26TOPS workload each) computing power in option
  • 9~36V DC-IN with ignition control & OCP/OVP
  • Wide range operating temperature of -40°C~70°C (fanless@35W CPU)
  • Military standard for anti-vibration/shock
  • CE/FCC, UKCA, Emark Certified

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More Information

Brand Nexcom
Specifications
CPU
  • 12/13th Gen Intel® Core™ i, Intel® R680E chipset
  • Graphics:
    - Intel® UHD Graphics 770, 1.55GHz
    - Max resolution: 4096 x 2160@60Hz (HDMI)
    - DirectX: 12, OpenGL: 4.5
Memory
  • 2 x SO-DIMM, DDR5-4800MHz
  • 8GB (default) 64GB in (max.), ECC & dual-channel support
Storage
  • 2 x 2.5” SSD (15mm height, removable)
  • 1 x M.2 2280 Key M (PCIe4.0 x4), NVMe SSD in default, Hailo AI card (optional)
Expansion Slots
  • 1 x mPCIe slot (PCIe 3.0, SATA 3.0, USB 2.0), Wi-Fi (default), optional for mSATA
  • 1 x mPCIe slot (USB 3.2, PCIe 3.0, SATA 3.0), SIMs support, LTE modem (default), optional for Wi-Fi/mSATA by DIP S/W setting
  • 1 x M.2 3042/50/52 Key B socket (USB 3.2/2.0), SIMs support for LTE/5G modem
  • 1 x M.2 3030 Key E socket (PCIe 3.0 x 2 & USB 2.0), Wi-Fi (default), Hailo AI card in option
Display
  • 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz
  • 1 x VGA, up to 1920 x 1200@60Hz; 1 x DP, 4096x2304@60Hz
2.5GbE
  • 2-port independent 2.5GbE, RJ45 connector
    - 9Kbyte Jumbo frame
    - PTP (IEEE 1588) support
    - Controller: Intel® I226-IT
  • Additional 4-port 2.5GbE PoE+, PSE 60W in max (options)
GbE/MGT
  • 1-port independent GbE, RJ45 connector
    - vPro (iAMT)
    - 9KB Jumbo frame
    - PTP (IEEE 1588) support
    - Wake-up function (WoL)
    - Boot from PXE (Legacy & UEFI)
USB
  • 6 x USB 3.2 Gen 2:
    - Host Type-A connector
    - 5V@900mA each
    - Up to 10Gbit/s link speed & compliance with USB 2.0 (LS/FS/HS link speed)
Serial Port
  • 2 x Full RS232/422/485
  • 2 x Full RS232
  • RS232 working voltage, +- 9V, baud rate up to 115.2kb/s
  • 2-wire/4-wire RS-485 (Baud rate: 300~115.2Kbps)
Security
  • TPM 2.0: Infineon SLB9670VQ2.0 FW7.62
Audio & DC-OUT
  • Line-out, unbalance stereo, left & right channel
  • Line-in & MIC-in, stereo
  • DC-OUT: 12VDC@2A
MEMS Sensor
  • 3D accelerometer and 3D gyroscope, ST LSM6DSLTR
DI/DO
  • 4-bit input
    - Source: 9~36VDC ([email protected]/[email protected])
    - External: 0~33VDC pull-high, high-level, 3.3 - 33 VDC; low-level, 0 - 2 VDC
  • 4-bit output
    - Source: 9~36VDC (nominal 35mA@24V)
    - External: 5~27VDC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C)
  • Source or external can be selected by DIP S/W (default: source type)
CAN Bus
  • 2 x CAN FD, compatible with CAN2.0A/2.0B
  • Up to 5Mb/s in data transmit
  • IEC 61000-4-2 Electrostatic Discharge (ESD): ± 4KV/8KV (contact/air)
GNSS
  • u-blox NEO-M9N GNSS module for GPS/Gloness/QZSS/Galileo/Beidou
  • Optional DR (Dead Reckoning) function, NEO-M9V/M8L
Power Supply
  • Nominal voltage: 9~36V
  • Cranking voltage: 6V~9V (less than 20 sec)
  • OCP & UVP (shut down once exceeding 37V)
  • Ignition on/off control & programmable on/off delay timer
  • Optional for remote power on/off control
I/O Ports, Front-Plate
  • ATX power & reset button
  • 9 x LED Indicators
  • 4 x Nano SIM slots (SIM1-1, SIM1-2, SIM2-1, SIM2-2)
  • 2 x USB3.2 Type A
  • 1 x HDMI, 1 x DP
  • Fan power connector
  • 4 x 2.5GbE (RJ45), 1 x GbE (RJ45)
  • 2 x Removable 2.5” SSD bay
  • 1 x Multi-port DB15 (4 x DI, 4 x DO, 2 x CAN FD)
  • 1 x PR-SMA for GNSS, 2/4 x SMA for LTE/5G ant.
I/O Ports, Rear-Plate
  • 2 x RS232 (DB9), 2 x RS232/422/485 (DB9)
  • 4 x USB 3.2 type A
  • Audio jack for Line-in, Line-out, MIC-in
  • 1 x VGA
  • 1 x Mini-fit connector (DR signal & DC-OUT)
  • 5-pin Phoenix for 9~36VDC-in
  • 2/4 x PR-SMA for Wi-Fi ant.
Dimensions & Weight
  • 260.0mm x 210.0mm x 81.0mm (w/o mount bracket)
  • 293.0mm x 210mm x 90.0mm (w/ mount bracket)
  • 5.7kg, 6.8kg (w/ fan kit)
Environment
  • Operating temperatures: -40°C~65°C (35W CPU, fanless)
  • Operating temperatures: -40°C~70°C (65W CPU, w/ fan)
  • Storage temperatures: -40°C~85°C
  • Relative humidity: 10%~95% (non-condensing)
Vibration & Shock
  • Vibration in operating:
    - MIL-STD-810H, 514.8C Procedure 6, Category 4
    - IEC 60068-2-64: 2.0g@5~500 Hz
  • Vibration in storage:
    - MIL-STD-810H, 514.8E Procedure 1, Category 24, 7.7g
  • Shock:
    - MIL-STD-810H, 516.8 Procedure I, trucks and semi-trailers=40g
    - Crash hazard: Procedure V, ground equipment=75g
Certifications
  • CE approval, FCC Class A, UKCA, E13 Certified
Operating System
  • Windows 10 64-bit/ Windows 10 IOT 64-bit, Windows 11
  • Linux (Ubuntu 18.04)
Options
  • CPU:
    - Intel® Core™ i9-12900E/12900TE, Core: 16c, Freq.: 3.2/2.1GHz, TDP: 60W/35W
    - Intel® Core™ i7-12700E/12700TE, Core: 12c, Freq.: 3.0/1.9GHz, TDP: 60W/35W
    - Intel® Core™ i5-12500E/12500TE, Core: 6c, Freq.: 2.1/1.4GHz, TDP: 60W/35W
    - Intel® Core™ i3-12100E/12100TE, Core: 4c, Freq.: 2.3/1.1GHz, TDP: 60W/35W
  • SO-DIMM DDR5-4800MHz-DIMM DDR5-4800MH:
    - CPU: 64GB (in the future), Core: 32GB, Freq.: 16GB, TDP: 8GB
FAN Kit
- Model No.: VTK FAN120-01, Description: 120mmx120mm, 60W heat dissipate

Ordering Information

VTC7270 (P/N: 10V00727000X0)
12/13th Gen Intel® Core™ , 2 x 2.5GbE + 1 x GbE, 6 x USB 3.2, 4 x Serial,2 x 2.5”SSD, 2 x CAN FD, 9~36VDC/IGN

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