eBOX671-521-FL Fanless Embedded System

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Fanless Embedded System with LGA1151 9th/8th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor, 4-CH PoE and MXM 3.1 Type A


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For applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence of things, the eBOX671-521-FL is a GPU computing embedded system with 4-CH PoE and MXM 3.1 Type-A slot. The excellent eBOX671-521-FL with increased GPU computing capability is powered by a 9th/8th generation Intel CoreTM i7/i5/i3 CPU with up to six cores, Intel Pentium processor, or Intel Celeron processor, and comes with either an Intel Q370 or an optional Intel C246 chipset. Dual DDR4 ECC/non-ECC SO-DIMM slots for up to 64GB of system memory are included in the fanless integrated GPU-based system. This embedded vision computer may be placed on a wall or on a DIN-rail for usage in a variety of settings.


  • 9th/8th gen Intel Core i7/i5/i3 & Celeron with Intel Q370 chipset (Coffee Lake/Coffee Lake Refresh-S)
  • 4-CH PoE (IEEE802.3at compliance)
  • Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1
  • Supports MXM 3.1 type A graphics module (optional)
  • DVI-I, HDMI, and DisplayPort with triple-view supported
  • AMS.AXView intelligent remote monitoring software for IIoT

This product is listed in Industrial Computing, Embedded Computers
  • LGA1151 9th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W)
  • LGA1151 8th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W/65W)
  • Intel® Q370
  • Intel® C246 (optional)
System Memory
  • 2 x 260-pin DDR4-2666 SO-DIMM, up to 64GB (ECC supported by Intel® C246 PCH)
  • AMI
  • 2 x RS-232/422/485
  • 4 x USB 3.1 Gen2
  • 2 x USB 3.1 Gen1
  • 2 x 10/100/1000 Mbps (Intel® i210-IT & i219-LM)
  • 4 x Power over Ethernet (IEEE802.2at), up to 60W
  • 2 x DisplayPort via optional MXM kit
  • 1 x HDMI
  • 1 x DisplayPort
  • 1 x DVI-I
Digital I/O
  • N/A
  • N/A
  • 2 x 2.5" HDD drive bay (max. up 9.5 mm height)
  • 1 x mSATA (enabled in BIOS setting)
  • 2 x Full-size PCI Express Mini Card slot (USB + PCIe signal)
  • 2 x SIM slot
  • 1 x MXM3.1 type A connector
  • 1 x Flexible I/O window (Default: 2 x DB9 half-cut bracket)
  • 4 x SMA-type antenna connector
  • TPM 2.0
  • 24 VDC
Watchdog Timer
  • 255 levels, 1 to 255 sec.
  • Aluminium extrusion and heavy-duty steel, IP40
Operating Temperature
  • Without MXM module:
    -40°C to +60°C (-40°F to +140°F) (with W.T. DRAM & SSD, CPU TDP 35W)
    -40°C to +50°C (-40°F to +122°F) (with W.T. DRAM & SSD, CPU TDP 65W)
  • With MXM module:
    -40°C to +50°C (-40°F to +122°F) (with W.T. DRAM & SSD & MXM Kit, CPU TDP 35W)
Relative Humidity
  • 10% to 90%, non-condensing
  • IEC 60068-2-27 (w/ SSD: 50G, half-sine, 11 ms duration)
  • IEC 60068-2-64 (w/ SSD: 3Grms STD, random, 5 - 500 Hz, 1 hr/axis)
(W x D x H)
  • 280 x 210 x 80.5 mm (11.02" x 8.26" x 3.16")
Weight (net/gross)
  • 4.8 kg (10.58 lb)/5.6 kg (12.34 lb)
  • CE, FCC Class A
EOS Support
  • Win 10 IoT, Linux
Software Support
  • AMS.AXView
  • Wall mount kit
  • DIN-rail kit