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  1. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  2. NUC-APL-SLIM Fanless NUC Slim System J3455/N3350
    NUC-APL-SLIM Fanless NUC Slim System J3455/N3350

    Intel Apollo Lake J3455/N3350 Up to 8GB DDR3

    Key Features:

    • Onboard Intel Celeron Processor J3455/N3350
    • Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
    • Rich I/O, 1 x COM, 2 x HDMI, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
    • Expansion Slot,  M.2 Key-B,  M.2 Key-E
    • Fanless Operating from 0°C ~ 50°C
    • DC Power Input +12V
    • Compact Size, 115mm x 111mm x 45mm
    • Supports VESA/Din-Rail Kit
    • TPM 2.0 (Factory Option)
  3. NUC-APL Fanless NUC System J3455/N3350
    NUC-APL Fanless NUC System J3455/N3350

    Intel Apollo Lake Celeron Processor J3455/N3350 Up to 8GB DDR3

    Key Features:

    • Onboard Intel Celeron Processor J3455/N3350
    • Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
    • Rich I/O, 2 x COM, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
    • Triple Display, 2 x HDMI, 1 x DP (DVI-I/VGA Factory Option)
    • Expansion Slot,  M.2 Key-B,  M.2 Key-E
    • Fanless Operating from 0°C ~ 60°C
    • DC Power Input +12V
    • Compact Size, 115mm x 111mm x 58mm
    • Supports VESA/Din-Rail Kit
    • TPM 2.0 (Factory Option)
  4. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  5. AirLink RV55 Rugged LTE-A Pro Router
    AirLink RV55 Rugged LTE-A Pro Router

    The industry's most rugged, compact, LTE-A Pro router, designed for connecting critical remote assets & infrastructure, and vehicles.

    Key Features:

    • LTE-A PRO up to 600/150Mps
    • Dual SIM automatic network failover
    • High performance GNSS
    • 1 x GbE, 2 x RS232 (DB9), 1 x Digital inputs
    • Optional Dual-Band – Dual Chipset Wi-Fi
    • -30 ~ +70°C operation
    • MIL 810-G, IP64 rated
    • 7~36VDC input
    • Remote, secure network management: Cloud – ALMS, Hosted – AMM
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Tekdis offers custom built solutions for your application

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Tekdis offers custom built solutions for your application

Tell us what you need