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CPU  
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Intel Gen.  
DIN-Mountable  
Fanless  
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2 Items

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  1. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  2. PSD330 2.5" PATA SSDs
    PSD330 2.5" PATA SSDs

    Offers high-speed UDMA Mode 6, and offers installation flexibility for desktops, laptops or portable devices built around the 2.5" PATA (IDE) storage device standard

    Key Features:

    • Based on Ultra DMA Mode 4
    • Built-in ECC (Error Correction Code) functionality
    • Advanced Global Wear-Leveling and Block management for reliability
    • Static Data Refresh
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • Security Command
    • Compliant with RoHS 2.0 standards
    • MLC NAND flash
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Tekdis offers custom built solutions for your application

Tell us what you need