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HSD470T Half-Slim SSDsSATA III 6Gb/s interface, a powerful controller, and state-of-the-art 112-layer 3D NAND flash
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EMS-TGL Fanless Rugged Embedded System 11th Gen11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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PSD330 2.5" PATA SSDsOffers high-speed UDMA Mode 6, and offers installation flexibility for desktops, laptops or portable devices built around the 2.5" PATA (IDE) storage device standard
Key Features:
- Based on Ultra DMA Mode 4
- Built-in ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Static Data Refresh
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Security Command
- Compliant with RoHS 2.0 standards
- MLC NAND flash
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EPD-2501 Public Information e-Ink DisplayOnboard Intel Celeron SoC BGA Processor N3350
Key Features:
- 25.3” E Ink Black/White/Red/Yellow
- 25.3” E Ink Gallery Plus Full colour 55K (Typ.)
- 25.3" E Ink Kaleido with colour 4096
- Onboard Intel® Celeron® SoC BGA Processor N3350
- DDR3L 1866MTs SO-DIMM up to 8GB,
- 2.5” SATA3 SSD 64GB
- 2 x HDMI, 1 x COM, 2 x LAN, 4 x USB 3.1(Gen1)
- Front Cover Glass, Optional PMMA, support IP54
- Super Slim Bezel Design
- E Ink SDK / API support
- Optional WiFi Module
- Operating Temp 0~40C
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FPC-1736 17" 8th/9th Gen CPU Rugged Multi-touch Panel PC17" 8th/9th Gen Intel Generation Core Pentium i7/ i5/ i3 Processors Full-falt Rugged Multi-touch Panel PC With Active Cooling and Expansion Slot
Key Features:
- Intel LGA1151 Socket Supports 8th /9th refresh Generation Core™ Pentium /i7/ i5/ i3 Processors (Max. TDP at 65W)
- 2 x Memory Socket, Max. Up to 64GB DDR4 2133/2400/2666 MHz
- 4 x USB3.0, 1 x USB2.0（Internal for dongle）
- 3 x RS232, 2 x LAN,1 x HDMI 1.4b, 1 x VGA
- 1 x Storage, 2.5” Drive Bay, 1 x M.2 SSD
- 1 x M.2 Key-E for Wi-Fi, Bluetooth
- Support 1 x PCIex4 Expansion Slot (option for 2 x PCI slot)
- Wide Voltage DC input +12V ~ +24V
- Front IP65, Panel Mounting Kits
- CE, FCC Class A, CCC
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OFT-15W04 15.6" Open Frame Tablet15.6" Open Frame Tablet
Key Features:
- Intel Celeron Processor J3455
- 4GB RAM
- 32GB eMMC
- Projective Capacitive Touch
- 10/100/1000 Ethernet
- M.2 B-Key(3042) connector socket
- 802.11 a/b/g/n/ac Wireless LAN
- Windows 10 supported
- DC 12~24V Input
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CAXA0 10.1" Semi-Rugged Tablet with Celeron N335010.1" Semi-Rugged Tablet with Intel Celeron Processor N3350
Key Features:
- Semi-rugged design with Intel Celeron N3350
- Medical certified
- MIL-STD-810G & IP65 certified, 4-feet drop resistance
- 10.1” TFT color LCD 1280 x 800 HD
- Corning Gorilla Glass, 10-point projected capacitive multi-touch panel
- High mobility with multiple connectivities including WLAN, Bluetooth, NFC
- Light Design, Weight only 1Kg with Battery
- G-sensor, light sensor, 2M/8M Camera
- Option SCR, 1D/2D Barcode scanner
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SID-10W03 10.1" Semi Industrial Panel PC with Atom 835010.1" Wide Semi-Ind Ultra Slim Panel PC with ATOM Z3735F CPU
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VNS-15W01 15.6" Ultra Slim Panel PC15.6" Venus Panel PC
Key Features:
- Intel Atom x5-Z8350 Processor: 2M Cache, up to 1.92 GHz
- 2GB / 4GB RAM, 32GB / 64G eMMC
- PCAP Touch
- 10/100/1000 Ethernet (PXE Boot)
- Touch button (Power/ Brightness/ Volume/ LED)
- DC 12~24V Input or Powered LAN 802.3AT
- NFC Reader
- Smart Card Reader
- AMIC
- 2.0MP Camera
- Speak 4Ω 2.0W/2.5W(MAX)
- LED Indicating Light Bar (Light colour: Green and Red, Illuminating area: 70*8mm(front),70*5mm(side))
- 75 x 75mm VESA Mount
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MTE672A PCIe M.2 SSDPCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)
Tekdis offers custom built solutions for your application
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Tekdis offers custom built solutions for your application
Tell us what you need