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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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NISE-109 Compact Fanless Embedded System
Celeron Processor J6412 Quad Core, 2.0GHz/Atom Processor x6211E Dual Core, 1.3GHZ
Key Features:
- Onboard Intel Celeron processor J6412 2.0Ghz or Atom processor x6211E 1.3Ghz
- Dual display port: 1 x HDMI & 1 x DP
- 2 x Intel I210-IT GbE LAN ports; support WoL, teaming, PXE, and Ethercat
- 3 x USB 3.0 & 3 x USB 2.0
- 2 x RS232 & 2 x RS232/422/485
- Support 1 x 2.5” SSD & 1 x M.2 Key B storage
- Support 9~30V DC input; support ATX power mode
- Operation temperature
- Intel Celeron J6412: -10°C to 60°C
- Intel Atom x6211E: -20°C to 70°C - Support 1 x M.2 & 1 x mini-PCIe expansion slot
- Support TPM 2.0
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NIFE 101 Atom E3826 Dual Core Factory Automation Fanless System
Intel® Atom™ E3826 Dual Core Factory Automation Fanless System