In-Vehicle & Railway AI Computers
Tekdis provides a wide range of mobile solutions for AI and deep learning applications, offering options from low to high-end, including Intel x86 systems with accelerator cards and NVIDIA Jetson-based platforms. We also offer various communication modules and accessories, like LTE, WLAN, GPS, Untethered Dead Reckoning GPS, CAN Bus, Tyre Pressure Monitoring, and models with integrated Power-Over-Ethernet (POE). Our solutions support mobile NVRs, ANPR systems, telematics, and vehicle health monitoring. We have EN50155-certified models for railway applications. Contact our expert team to find the right vehicle PC for your needs.
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AV600X-CH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
- Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
- NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
- MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 55°C
- Optional with External GPU Turbo Kit
- Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
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AV600-THT Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
- Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
- Soldered 64 GB NVMe
- IP65 2 x 2.5” SATA SSD Easy Swap Tray
- MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 70°C
- Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
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AV600TH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
- 64GB DDR4 SO-DIMM ECC or non ECC support
- NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
- 2.5” SATA SSD
- 1x 3G-SDI Capture Card (Options)
- MIL-STD-461 18V~36V DC-Input
- Extreme Temperature: -20 to 55°C degrees
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ATC8110/8110-F i7 Mobile Expandable AI PC
Intel Coffee Lake S/Refresh + Inference Accelerator AI Powered for Autonomous and Machine Vision
Key Features:
- In-vehicle AI recognition and machine vision applications
- Fanless/fan flexibility design
- Up to 8-core Intel® Coffee Lake S/Refresh processing power
- 3 x PCIe 3.0 slots for Discrete Graphics/Inference/Frame Grabber cards
- Ultra-fast U.2/M.2 NVMe media for high-speed multi-cameras image capture
- RAID 0/1/5/10 configurable for data secure and integrity
- Wide-range 9~36VDC input with Ignition management
- Rich communication ports, 5 x USB 3.1, 2 x GbE and 4 x RS232/422/485
- Telemetric functionality of WWAN/5G NR, WLAN and GNSS with up to 4 x 4 MIMO and 4 SIM slots
- Compliant with E-mark, CE/FCC ClassA and MIL-STD-810G for anti-vibration/shock w/ graphics card installed
- Realize M-2-M through CAT-M (NB-IoT & eMTC)