In-Vehicle & Railway AI Computers

Tekdis provides a wide range of mobile solutions for AI and deep learning applications, offering options from low to high-end, including Intel x86 systems with accelerator cards and NVIDIA Jetson-based platforms. We also offer various communication modules and accessories, like LTE, WLAN, GPS, Untethered Dead Reckoning GPS, CAN Bus, Tyre Pressure Monitoring, and models with integrated Power-Over-Ethernet (POE). Our solutions support mobile NVRs, ANPR systems, telematics, and vehicle health monitoring. We have EN50155-certified models for railway applications. Contact our expert team to find the right vehicle PC for your needs.

AI In-Vehicle Computers
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  1. Products 19 items
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  1. In-Vehicle Computers 8 items
  2. Railway Computers (EN50155) 1 item
  3. AI In-Vehicle Computers 6 items
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6 Items

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  1. AIE510-ONX Fanless Edge AI System with NVIDIA Jetson Orin NX
    AIE510-ONX Fanless Edge AI System with NVIDIA Jetson Orin NX

    NVIDIA Jetson Orin NX 16GB, 1 HDMI, 1 GbE PoE, 1 2.5 GbE PoE, 2 USB, 1 COM/CAN, and 8-CH DIO for AMR & Robotics

    Key Features:

    • NVIDIA Jetson Orin NX (100 TOPS)
    • Seamless speed: 5G, Wi-Fi 6E, and 2.5 GbE combined
    • Easily manage: USB and PoE device power control
    • Supports dual PoE for camera & sensor connectivity
    • -25°C to +60°C operating temperature range
    • Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
  2. AV600X-CH Military IP66 Mission GPU Computer
    AV600X-CH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
    • Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
    • NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
    • MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 55°C
    • Optional with External GPU Turbo Kit
    • Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
  3. AV600-THT Military IP66 Mission GPU Computer
    AV600-THT Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
    • Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
    • Soldered 64 GB NVMe
    • IP65 2 x 2.5” SATA SSD Easy Swap Tray
    • MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 70°C
    • Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
  4. AV600TH Military IP66 Mission GPU Computer
    AV600TH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
    • 64GB DDR4 SO-DIMM ECC or non ECC support
    • NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
    • 2.5” SATA SSD
    • 1x 3G-SDI Capture Card (Options)
    • MIL-STD-461 18V~36V DC-Input
    • Extreme Temperature: -20 to 55°C degrees
  5. AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
    AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin

    Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications

    Key Features:

    • NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
    • 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
    • 24 VDC with ignition power control
    • Supports eight PoE for IP cameras and LiDAR connectivity
    • -30°C to +50°C operating temperature range
    • Supports device management and optional OTA deployment powered by Allxon
  6. ATC8110/8110-F i7 Mobile Expandable AI PC
    ATC8110/8110-F i7 Mobile Expandable AI PC

    Intel Coffee Lake S/Refresh + Inference Accelerator AI Powered for Autonomous and Machine Vision

    Key Features:

    • In-vehicle AI recognition and machine vision applications
    • Fanless/fan flexibility design
    • Up to 8-core Intel® Coffee Lake S/Refresh processing power
    • 3 x PCIe 3.0 slots for Discrete Graphics/Inference/Frame Grabber cards
    • Ultra-fast U.2/M.2 NVMe media for high-speed multi-cameras image capture
    • RAID 0/1/5/10 configurable for data secure and integrity
    • Wide-range 9~36VDC input with Ignition management
    • Rich communication ports, 5 x USB 3.1, 2 x GbE and 4 x RS232/422/485
    • Telemetric functionality of WWAN/5G NR, WLAN and GNSS with up to 4 x 4 MIMO and 4 SIM slots
    • Compliant with E-mark, CE/FCC ClassA and MIL-STD-810G for anti-vibration/shock w/ graphics card installed
    • Realize M-2-M through CAT-M (NB-IoT & eMTC)
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