Find your technical solution below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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HSD470T Half-Slim SSDs
SATA III 6Gb/s interface, a powerful controller, and state-of-the-art 112-layer 3D NAND flash
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DS3604 - LoRaWAN IoT E-Ink Display
DS3604- Reflective Electrophoretic Display 4.2 Inch 5 Year Battery
Key Features:
- 4.2-inch three-color e-ink screen
- 400 × 300 pixels display with high contrast and ultra-wide viewing angle
- Enables quickly modifying of the displayed content including text, picture and QR code remotely and
locally - Support multiple characters to display up to 150 languages
- Support multicast feature for remote configurations in bulk
- Provide API for management platform integration or development
- Support display template customization
- Ultra-low power consumption with up to 5-year battery life
- Adapting to multiple scenarios with flexible installation methods
- Equipped with NFC for easy configuration
- Compliant with standard LoRaWAN® gateways
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MTE672A PCIe M.2 SSD
PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)