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5 Items

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  1. VTC7270-C8 GEN 12/13 Fanless 8 x POE AI Vehicle Computer
    VTC7270-C8 GEN 12/13 Fanless 8 x POE AI Vehicle Computer

    12/13th Gen Intel Core CPU 8 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 4 x Serial, 2 x 2.5” SSD, 2 x CAN FD, 9~36VDC/IGN

    Key Features:

    • Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
    • Rich I/Os, 8 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials
    • Up to 4 WWAN/WLAN combinations for mobile router Applications
    • 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
    • Up to two Hailo AI accelerators (26TOPS workload each) in option
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -40°C~65°C (fanless@35W CPU)
    • Military standard for anti-vibration/shock
    • CE/FCC, UKCA, Emark Certified
  2. NDiS-B561 12th Gen Fanless Edge PC PoE Option
    NDiS-B561 12th Gen Fanless Edge PC PoE Option

    Visual Edge PC 12th Gen Core Processor -20~60°C 1 x HDMI 2.1 2 x HDMI 2.0 8 x USB 3.2 4 x COM

    Key Features:

    • Support 12th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
    • Intel Q670E
    • Intel integrated UHD graphic engine driven by Xe architecture
    • Support 3 independent 4K2K@60Hz display outputs. HDMI 2.1 resolution can be up to 8K@60Hz
    • 1 x HDMI 2.1, 2 x HDMI 2.0
    • 8 x USB 3.2, 4 x COM,
    • 1 x GbE LAN, 2 x 2.5G GbE LAN (PoE for B561-PoE)
    • Support M.2 Key B/E/M
    • Support extended temperature -20~60°C (B561 only)
    • Fanless design
  3. ATC8010-7  - 8 x POE, T1000 MXM Kit Option
    ATC8010-7 - 8 x POE, T1000 MXM Kit Option

    Intel Core 8th Gen. CPU Powerful Intelligent Platform for ADAS and ANPR/AFR

    Key Features:

    • Intel Core 8th Gen. i7-8700T, 2.4GHz, 6 Core
    • 8 x Independent Intel I210-IT 10/100/1000 PoE 802.3af/at
    • AI accelerator MXM module supported
    • ultraONE+ for 10-Meter video + audio output
    • 2 x External SSD and 2 x mSATA for RAID 0, 1, 5, 10
    • 2 x WWAN module and 3 x SIM socket with eSIM option
    • Fanless design
    • 3 x mini-PCIe and 1 x M.2
    • CE/FCC/E mark
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Tekdis offers custom built solutions for your application

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