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7 Items

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  1. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  2. NISE-70 Celeron/Core Fanless System
    NISE-70 Celeron/Core Fanless System

    Intel Celeron 6305E Processor Dual Core Fanless System

    Key Features:

    • Onboard Intel Celeron 6305E Processor
    • 4 x HDMI
    • 3 x USB 3.0, 1 x USB 2.0
    • 1 x RS232/422/485, 1 x RS232
    • 3 x GbE LAN ports; support WoL, teaming and PXE
    • Onboard TPM 2.0 chip
    • 1 x M.2 socket for storage/4G LTE/5G modules
    • 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
    • Support operating temperature from-5 to 55 Celsius degree
    • Support+12V to 24VDC input; support ATX power mode
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Tekdis offers custom built solutions for your application

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