Find your technical solution below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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MTE662A PCIe M.2 SSD
PCI Express (PCIe) Gen 3 x4 interface and compatible with NVM Express (NVMe), 3D NAND technology
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MTE662P & MTE662P-I PCIe M.2 SSDs
PCI Express (PCIe) Gen 3 x4 interface, compatible with NVM Express (NVMe) 1.3, 3D NAND technology
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MTE560I PCIe M.2 SSD
80GB/160GB/320GB/640GB PCIe M.2 SSD PCIe Gen 4x4 interface 112 layers of 3D NAND flash SLC Mode technology
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MTS952P & MTS952P-I SATA III M.2 SSDs
SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C
Key Features:
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Power-saving DevSleep (Device Sleep) mode
- Compliant with RoHS 2.0 standards
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
- Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
- Supports Transcend Scope Pro software
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MTE712A & MTE712A-I M.2 SSD
Features the 112-layer 3D NAND flash and the PCI Express (PCIe) Gen 4 x4 interface
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MTE470A PCIe M.2 SSD
128GB/256GB/512GB/1TB PCIe M.2 SSD TCG Opal 2.0 standards PCIe Gen 3 x4 30µ" PCB gold finger
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MTE720T PCIe M.2 SSD
512GB/1TB/2TB/4TB PCIe M.2 SSD 112-layer 3D NAND flash PCIe Gen 4x4 compatible with NVM Express
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MTS970T & MTS970T-I SATA III M.2 SSD
128GB/256GB/512GB/1TB/2TB/4TB SATA III M.2 SSD 112 layers of 3D NAND flash 30µ" gold finger
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MTS200I SATA III M.2 SSD
20GB/40GB/80GB/160GB/320GB SATA III M.2 SSD 112-layer 3D NAND flash and SLC Mode technology
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MTS260I SATA III M.2 SSD
40GB/80GB/160GB/320GB/640GB/1280GB SATA III M.2 SSD 6Gb/s 112-layer 3D NAND flash built-in DRAM cache
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MTS210I SATA III M.2 SSD
40GB/80GB/160GB/320GB SATA III M.2 SSD 6Gb/s 112-layer 3D NAND flash built-in DRAM cache
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MTE460T & MTE460T-I PCIe M.2 SSDs
128GB/256GB/512GB/1TB PCIe M.2 SSD PCIe Gen 3x2 112-layer 3D NAND flash
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MTE672A PCIe M.2 SSD
PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)
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MTS970P SATA III M.2 PLP SSD
Transcend's MTS970P M.2 SSD combines Power Loss Protection (PLP) with a SATA III 6Gb/s interface, 3D NAND technology at 112 layers, and various durability features for enhanced storage efficiency and reliability in mission-critical applications.
Key Features:
- Compliant with RoHS 2.0 standards
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)