Search results for: 'FABS/ip66'
-
AV600TH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
- 64GB DDR4 SO-DIMM ECC or non ECC support
- NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
- 2.5” SATA SSD
- 1x 3G-SDI Capture Card (Options)
- MIL-STD-461 18V~36V DC-Input
- Extreme Temperature: -20 to 55°C degrees
-
AV600-THT Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
- Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
- Soldered 64 GB NVMe
- IP65 2 x 2.5” SATA SSD Easy Swap Tray
- MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 70°C
- Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
-
AV600X-CH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
- Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
- NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
- MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 55°C
- Optional with External GPU Turbo Kit
- Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
-
AV600-RH Military IP66 AI Edge GPU Computer
Military IP66 with D38999 connectors VIDIA RTX A1000/A2000, 2048/2560 CUDA
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel 13th Gen. Raptor Lake (H) i7-13800HE/HRE, 14C , 2.5/5.0 GHz Processor
- Up to 64GB DDR5 SO-DIMM, non-ECC and ECC
- NVIDIA RTX A1000/A2000, 2048/2560 CUDA,4GB/8GB GDDR6 RAM
- MIL-STD-461 EMI Filter18V~36V DC-Input
- Extreme Temperature : -40°C to 60°C
- Dimensions : 250(L) x 325 (W) x 100 (H) mm
-
R8 8” IP66 Rugged Tablet 12th Gen CPU
8” IP66 Rugged Tablet 12th Gen CPU 800nit
Key Features:
-
8.0” LCD DynaVue SR display with 800 nits
-
12th Generation Intel Core Processor
-
Intel Wi-Fi 6E AX211 & Bluetooth® V5.2
-
Long-life battery up to 16 hours
-
Optional barcode, RFID & smart card reader
-
IP66 CERTIFIED
-
10-point capacitive multi-touch panel
-
Fanless design with four touch modes
-
-
LTE Rugged low Profile MAG mount antenna
Low Profile Antenna 700-3800MHz with Magnetic Base and SMA connector
-
DWMM4-6-60 4x4 MiMo 4G/5G Antenna
4x4 MiMo Solution for Global 4G/5G Networks from 617-6000MHz
Key Features:
- 4x4 MiMo Omnidirectional Antenna
- Wall, mast or desk mount
- Optional GPS/GNSS - 26dB LNA
- Integrated coaxial cables
- 4G/5G LTE Ready
- Covers Wideband 600-6000MHz
- IP66 rated
- Suitable for Indoor or Outdoor Use
-
B4BE[E]-6-60 - 4G/5G Bracket Antenna
The B4BE[E] antenna is a cost effective omnidirectional broad band antenna for 4G/3G/2G and 5G devices from 617-960/1710-6000MHz and is suitable for external or internal installation.
-
S19M, 19" PCAP touch with AC/DC redundant powerEnd of Life
19" SXGA 300cd/m2 Marine Display with AC and DC redundant power, PCAP touch screen, R10
-
S24M, 24" PCAP touch with AC/DC redundant power
24" FHD 300cd/m2 Marine Display with AC and DC redundant power, PCAP touch screen, R10
-
LPB-6-60-2SP 5G/LTE Bolt Mount Salt Shaker 2m Coax SMA M
(Other cable lengths/connectors avail)
LPB-6-60 antenna is a cost-effective Omni-directional panel mount SISO antenna for 4G/3G/2G and 5G devices from 617-960/1710-6000MHz