VTC6222-GCIoT - Google Cloud AI Edge In-Vehicle Solution

In stock
VTC6222-GCIoT - Google Cloud AI Edge In-Vehicle Solution
Brand: Nexcom

Intel Atom® processor E3950 up to 2.0GHz CPU, 4GB DDR3L SODIMM, Google Edge TPU, DC input 9~48 VDC

Enquire Now
Enquire about this product:

·         Built-in Google Edge TPU ML accelerator coprocessor

·         Intel Atom® processor quad core E3950, up to 2.0GHz

·         4 x PoE (802.3af/at, max. 60W)

·         Built-in u-blox-M8N GPS

·         Built-in CAN Bus 2.0B

·         Three video outputs, one VGA and two HDMI

·         E Mark conformity

·         3 x mini-PCIe socket expansion

·         Dual external storage (compatible with 15mm disk)

·         1 x USB DOM to run OS

·         1 x SD card for exporting and backing up data

This product is listed in Industrial Automation, Mining, Transport, Nexcom, Mobile Computing

ŒIntelAtom® processor quad core E3950, up to 2.0GHz, 12W, 4 core

Œ1 x 204-pin DDR3L SO-DIMM socket support 1866MHz up to 8GB.
Default 4GB

Google Edge TPU (Coral ML Accelerator Card)
ŒHardware interface: mini-PCIe (half size)
ŒSerial interface: PCIe Gen2 x1
ŒPerformance: 4TOPS @2Watt
ŒOperating voltage: 3.3V +/- 10 %
ŒDimensions: 30mm x 26.8mm x 2.5 mm

Video Output
ŒChipset Intel® HD graphics 505
Œ2 x HDMI 1.4b up to 4096 x 2160 @30Hz
Œ1 x VGA up to 1920 x 1200 @60Hz

Œ2 x 2.5" SSD/HDD SATA 3.0 (compatible with 15mm drive)
Œ1 x SD memory card 3.0 (externally accessible)

Œ1 x Full size mini-PCIe socket (USB 2.0), BOM optional M.2 Key B
(USB2.0 + USB 3.0) with 2 x external SIM
Œ1 x Full size mini-PCIe socket (USB 2.0 + PCIe 2.0)
Œ1 x Half size mini-PCIe socket (USB 2.0 + PCIe 2.0)

GNSS and On Board Sensor
Œ1 x Default U-blox NEO-M8N GNSS for GPS/Glonass/QZSS/Galileo/
ŒG Sensor (3-axis, 10-bit resolution)
ŒTPM 2.0 (optional)

LAN and Power over Ethernet
Œ4-Port LAN, 10/100/1000 Mbps I210-IT GbE, PoE 802.3af/at, max. 60W
Œ1-Port LAN, 10/100/1000 Mbps I210-IT GbE

I/O Interface-Front
Œ12 x LED indicators (including 3 x programmable LED)
Œ2 x Externally accessible SIM card socket with cover
Œ2 x 2.5" removable SSD tray
Œ1 x Externally accessible SD card socket with cover
Œ1 x Reset button
Œ1 x Power button
Œ1 x USB 3.0 type A (5V/0.9A)
Œ2 x HDMI 1.4b
Œ1 x Mic-in, 1 x Line-out

I/O Interface-Rear
Œ1 x 3-pin terminal block for 9V~48V DC
Œ1 x RJ45 10/100/1000 Mbps
Œ4 x PoE 802.3af/at (max. 60W)
Œ1 x VGA
Œ1 x DB9 full RS-232
Œ4 x SMA antenna
Œ2 x USB 2.0 type A (5V/0.5A)
Œ1 x Line-out
Œ1 x DB15 (DIO)
- 4 x DI with isolation
- 4 x DO with isolation
- Vin, GND for GPIO
- 1 x RS422/RS485
- 1 x RS232 (TX/RX)
- 1 x CAN 2.0B
- 1 x 12VDC, 2A output (Vout, GND)

Power Management
ŒPower input 9~48 VDC
ŒSelectable boot-up & shut-down voltage for low power protection by software
ŒSetting 8-level power on/off delay time by software
ŒSupport S3/S4 suspend mode
Œ10~255 seconds WDT support, setup by software
ŒSDK (Windows/Linux) including utility and sample code

Operating System
ŒDebian Linux and other variants

Œ260mm (W) x 196mm (D) x 66.5mm (H)


ŒOperating temperatures: -20°C~60°C (w/ Google Edge TPU & industrial SSD) with air flow
ŒStorage temperatures: -40°C to 80°C
ŒRelative humidity: 10% to 90% (non-condensing)
ŒVibration (SSD)
- Operating: MIL-STD-810G, Method 514.6, Category 4, common
carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum
integrity test
ŒShock (SSD)
- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash
hazard shock test=75g

ΠFCC Class A
ΠE13 mark