Tekdis offers technologically advanced, innovative solutions for mining industry. We can also customise products to suit your needs. Get in touch to know more.
-
HSD450T SATA III, Half-slim SSD
Equipped with a SATA III 6Gb/s interface and a powerful controller, Transcend's HSD450T Half-Slim SSD delivers outstanding transfer speeds in a compact form factor.
-
ICO120-83D DIN-Rail Fanless Embedded System
Robust DIN-rail Fanless Embedded System with Intel Celeron Processor N3350, COM or CAN, 2 LAN, 2 USB and DIO
Key Features:
- Extreme cost-effective with fanless and cableless design
- Intel Celeron processor N3350, reliable F1 stepping version CPU
- 1 COM or CAN, 2 USB, 2 GbE LAN
- 8-bit programmable DIO for IoT gateway applications
- Wide operating temperature range from -20°C to +70°C
- 12 to 24 VDC wide range power input
- Supports SocketCAN
- AMS. AXView intelligent remote monitoring software for IIoT
-
ICO100-839 DIN-Rail Fanless Embedded System
DIN-rail Fanless Embedded System with Intel Celeron Processor N3350, 2 COM, LAN, 2 USB, and DIO
Key Features:
- Extreme cost-effective with fanless and cableless design
- Intel Celeron processor N3350, reliable F1 stepping version CPU
- 2 COM, 2 USB, and GbE LAN
- 8-bit programmable DIO for IoT gateway applications
- Wide operating temperature range from -20°C to +70°C
- 12 to 24 VDC wide range power input
- Supports SocketCAN
- AMS.AXView intelligent remote monitoring software for IIoT
-
AIE100-903-FL-NX Fanless Edge AI System with NVIDIA Jetson Xavier
Fanless Edge AI System with NVIDIA® JETSON™ Xavier NX SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE and 2 USB
-
AIE100-903-FL Fanless Edge AI System with NVIDIA Jetson Nano
Fanless Edge AI System with NVIDIA® JETSON™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE and 2 USB
-
U11I 11.6" Rugged Tablet
Built for All. All in One.
Key Features:
-
11.6” FHD DynaVue® SR display with 1000 nits
-
10th Generation Intel® Core™ Processor
-
24 hrs. Hi-Cap hot-swappable battery
-
10-point capacitive multi-touch panel with four touch modes
-
Multiple I/O options for various applications
-
Fanless and quick-release SSD design
-
-
CAPA13R 3.5” Embedded SBC with AMD Ryzen Embedded
3.5” Embedded SBC with AMD® RYZEN™ Embedded V1807B/V1605B APU, DisplayPort, 2 HDMI, LVDS and 4 GbE LAN
Key Features:
- AMD® RYZEN™ Embedded V1807B and V1605B APU
- 1x DDR4 SO-DIMM for up to 16GB of memory
- 4x GbE LAN
- Supports quad-view
- M.2 Key E
- M.2 Key B
-
AX61120TB - 1U Rackmount Chassis
PICMG 1.3 SBC structure with 2 expansion slots
Internal two 3.5" HDD drive bays
Slim-line CD-ROM disk bay for ease of system installation
Special cooling system design for supporting Intel® Pentium® 4 processor
-
eBOX640-521-FL Fanless Embedded System with 9th/8th Gen
Fanless Embedded System with LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM and 8-CH DI/DO
-
MSata SSD MSA452T-I
DRAM Cache embedded, Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed, Wide-temperature model available (from -40℃ to 85℃), Built-in ECC (Error Correction Code) functionality
-
Expansion Module - RJ- 45/RS232 & Smart Card Reader
Expansion Module - RJ- 45/RS232 & Smart Card Reader to suit R11 and R11 L
-
Expansion Module - MSR + Smart Card Reader
Expansion Module - MSR + Smart Card Reader to suit R11 and R11 L
-
EM06 - LTE-A Cat 6 M.2 Module
LTE-A Cat 6 module with M.2 form factor, optimized for M2M, Support LTE-A carrier aggregation ,Worldwide LTE-A and UMTS/HSPA(+) coverage, Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment, Feature refinements: supports DFOTA and DTMF, MIMO technology meets demands for data rate and link reliability in modem wireless communication systems.
-
EC25 - LTE Cat 4 mPCIe Module
LTE category 4 module optimized for broadband IoT applications, Worldwide LTE, UMTS/HSPA(+) and GSM/GPRS/EDGE coverage, Standard PCI Express® Mini Card form factor (Mini PCIe) ideal for manufacturers to easily integrate wireless connectivity into their devices, MIMO technology meets demands for data rate and link reliability in modem wireless communication systems.
-
MC7430 - LTE CAT 6 mPCIe Module
Small form factor, Enable location based services and incorporate cloud connected solutions.