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19 Items

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  1. NUC-APL-SLIM Fanless NUC Slim System J3455/N3350
    NUC-APL-SLIM Fanless NUC Slim System J3455/N3350

    Intel Apollo Lake J3455/N3350 Up to 8GB DDR3

    Key Features:

    • Onboard Intel Celeron Processor J3455/N3350
    • Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
    • Rich I/O, 1 x COM, 2 x HDMI, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
    • Expansion Slot,  M.2 Key-B,  M.2 Key-E
    • Fanless Operating from 0°C ~ 50°C
    • DC Power Input +12V
    • Compact Size, 115mm x 111mm x 45mm
    • Supports VESA/Din-Rail Kit
    • TPM 2.0 (Factory Option)
  2. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  3. MTS952P & MTS952P-I SATA III M.2 SSDs
    MTS952P & MTS952P-I SATA III M.2 SSDs

    SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C

    Key Features:

    • Dynamic thermal throttling
    • Built-in LDPC ECC (Error Correction Code) functionality
    • Advanced Garbage Collection
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
    • NCQ command for better performance
    • Power-saving DevSleep (Device Sleep) mode
    • Compliant with RoHS 2.0 standards
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • DDR3 DRAM Cache embedded
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
    • Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
    • Supports Transcend Scope Pro software
  4. USD240I microSD Cards
    USD240I microSD Cards

    112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card

    Key Features:

    • Built-in LDPC ECC (Error Correction Code) functionality
    • Early Move
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • Wear-Levelling
    • Compliant with RoHS 2.0 standards
    • Electrostatic protection (ESD IEC 61000-4-2)
    • Compliant with SD specification 6.1
    • Compliant with UHS-I
    • Compliant with Video Speed Class 30 (V30)
    • Compliant with Application Performance Class 2 (A2)
    • Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
  5. MSM362M & MSM362I mSATA mini SSD
    MSM362M & MSM362I mSATA mini SSD

    16/32/64/128GB mSATA mini SSD

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Compliant with JEDEC MO-300B
    • MLC NAND flash
    • Supports Transcend Scope Pro software
    • Promised operational reliability in a wide temperature range (from -40° to 85°C)
    • Built-in BCH ECC (Error Correction Code) functionality
    • Advanced Global Wear-Leveling and Block management for reliability
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
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Tekdis offers custom built solutions for your application

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