Filter  
  1. CPU Intel Core Remove This Item
  2. CPU ARM Remove This Item
  3. DIN-Mountable Yes Remove This Item
  4. LAN Ports 2-3 Remove This Item
Clear All
Category  
  1. Partners 19 items
  1. AU Optronics 0 items
  2. Avalue Technology Inc. 1 item
  3. Axiomtek 16 items
  4. BOE 0 items
  5. Dataprobe 0 items
  6. Durabook 0 items
  7. Estecom 0 items
  8. Giada Technology Inc. 0 items
  9. GPI Korea 0 items
  10. IEI Integration Corp. 2 items
  11. JDI 0 items
  12. Leopard Imaging 0 items
  13. Milesight IOT 0 items
  14. Mio 0 items
  15. Nexcom 0 items
  16. ORing 0 items
  17. OutdoorLink 0 items
  18. Panorama Antennas 0 items
  19. Philips 0 items
  20. Quectel 0 items
  21. Semtech (formely Sierra Wireless) 0 items
  22. Transcend 0 items
CPU  
Intel Gen.  
DIN-Mountable  
Fanless  
PCIe Expansion  
AI Enabled  
Operating Temp  
Memory  
LAN Ports  
POE Ports  
brand  

19 Items

Set Descending Direction
  1. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  2. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
  3. AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
    AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin

    Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications

    Key Features:

    • NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
    • 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
    • 24 VDC with ignition power control
    • Supports eight PoE for IP cameras and LiDAR connectivity
    • -30°C to +50°C operating temperature range
    • Supports device management and optional OTA deployment powered by Allxon
  4. eBOX560-512-FL Fanless Embedded System
    eBOX560-512-FL Fanless Embedded System

    Fanless Embedded System with Intel Core i5-7300U & Celeron 3965U, 2 HDMI, 2 GbE LANs, 4 USB 3.0 and PCI Express Mini Card Slot

    Key Features:

    • Intel Core i5-7300U 2.6 GHz/i3-7100U 2.4 GHz & Celeron 3965U 2.2 GHz
    • Supports 2 COM, 2 GbE LAN, and 4 USB 3.0
    • One swappable 2.5" HDD drive bay
    • 2 HDMI with dual-view supported
    • AMS.AXView intelligent remote monitoring software for IIoT
    • Ultra-compact enclosure design
    • Trusted Platform Module 1.2 (TPM 1.2)
  5. eBOX560-500-FL Fanless Embedded System
    eBOX560-500-FL Fanless Embedded System

    Fanless Embedded System with Intel® Core™ i7-6600U/i5-6300U/i3-6100U & Celeron® 3955U, 2 HDMI, 2 GbE LANs, 4 USB 3.0, 2 COM and PCI Express Mini Card Slot

    Key Features:

    • Intel Core i7-6600U 3.4 GHz/i5-6300U 3 GHz/i3-6100U 2.3 GHz & Celeron® 3955U 2.0 GHz (Skylake ULT SoC)
    • 260-pin DDR4 SO-DIMM for up to 16GB of memory
    • 12 VDC power input
    • Supports 2 HDMI, 2 GbE LAN, 2 COM, and 4 USB 3.0
    • Supports Jumbo Frame (9.5K), WoL, PXE and Teaming
    • Ultra-compact enclosure design
  6. eBOX570 Fanless Embedded System with 13th Gen
    eBOX570 Fanless Embedded System with 13th Gen

    Fanless Embedded System with 13th Gen Intel Core i7/i5/Celeron Processor, 2 HDMI, 1 DisplayPort++, 2 LANs, 8 USB, 2 COM, and 12 VDC

    Key Features:

    • 13th gen Intel Core processor (Raptor Lake P)
    • Fanless design with operating temperature from -20°C to 60°C
    • 1 DDR4 SO-DIMM for up to 32GB of memory
    • Supports the USB power on/off control function
    • Supports high-speed NVMe storage (M.2 Key M 2280)
    • Supports Intel® vPro and TPM 2.0
  7. IFB122 Robust RISC-based DIN-rail Fanless Embedded System
    IFB122 Robust RISC-based DIN-rail Fanless Embedded System

    Robust RISC-based DIN-rail Fanless Embedded System with i.MX 6UL Processor, 2 COM, 2 LANs and DIO (2-In/1-Out)

    Key Features:

    • RISC-based (i.MX 6UltraLite) processor 528 MHz

    • 256MB DDR3 SDRAM onboard

    • 8GB eMMC flash onboard

    • 1 PCI Express Mini Card slot (Wi-Fi or 3G/4G)

    • 2 digital inputs and 1 digital output

    • Power input range of 9V to 48V DC with terminal block

    • Embedded Linux operating system (Yocto)

    • Fanless and compact design

    • Wide operating temperature range from -40°C to +70°C

per page

Tekdis offers custom built solutions for your application

Tell us what you need

Tekdis offers custom built solutions for your application

Tell us what you need