Find your technical solution below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications
Key Features:
- NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
- 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
- 24 VDC with ignition power control
- Supports eight PoE for IP cameras and LiDAR connectivity
- -30°C to +50°C operating temperature range
- Supports device management and optional OTA deployment powered by Allxon
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IPC960A Fanless Industrial Computer 13th/12th Gen
LGA1700 Socket 13th/12th Gen Core i7/i5/i3/Celeron Processor, H610E/Q670E, Front-access I/O
Key Features:
- Fanless embedded system
- Optional extension system I/O module
- Optional 5G network (Q670E)
- Intelligent power management: Ignition, USB power on/off control
- Supports Intel RAID (Q670E)
- EN61000-6-2 certified
- Optional DIN-rail, bookshelf, and wall mount kits
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ICO330 DIN-Rail Fanless Embedded System
Intel Atom 3 x 2.5GbE LAN Isolated COM & DIO Fanless System
Key Features:
- Cost-effective with fanless design
- Intel Atom® x6212RE or x6414RE processor
- 6 isolated COM, isolated DIO (8-in/8-out), 3 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
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eBOX630A Fanless Embedded System with 11th Gen Core
Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC
Key Features:
- 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
- Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
- Supports 3x 2.5 GbE, 6 USB, 4 COM
- -40°C to +60°C wide operating temperatures
- 9 to 48 VDC wide range DC power input
- Supports triple displays with 2 HDMI, and 1 DisplayPort++
- Intel Iris Xe integrated graphics (i7 & i5 SKUs)
- Trusted platform module (TPM 2.0 onboard)
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eBOX565-52R-FL Fanless Embedded System i5/Celeron
Fanless Embedded System with Intel Core i5-8365UE/Celeron 4305UE Processor, HDMI/DisplayPort++, 2 GbE LAN, 2 COM, 4 USB and 9-36VDC Power Input
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eBOX560-52R-FL Fanless i5/Celeron Palm-Size PC
Fanless Embedded System with Intel® Core™ i5-8365UE/Celeron® 4305UE Processor, HDMI/DisplayPort, 2 GbE LAN, 2 COM, 4 USB
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AIE900-902-FL Fanless Edge AI System Jetson AGX Xavier
Fanless Edge AI System Jetson AGX Xavier™ 4 x POE
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eBOX630-528-FL Fanless Embedded System
Fanless Embedded System with 8th Gen Intel® Core™ i7/i5/i3 & Celeron® ULT Processor, 2 HDMI, 1 VGA, 3 GbE LAN, 6 USB, Dual PCI Express Mini Card Slots and 9 to 36 VDC
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DRPC-230-ULT5 Fanless DIN-Rail Embedded System
Fanless embedded system, Intel Whiskey Lake i5-8365UE 1.6GHz (quad core, TDP 15W), 8GB DDR4 pre-installed memory, HDMI/DP, 3 PCIe GbE, 6 COM, 12~24V DC, PCIex4 extension layer and RoHS
Key Features:
- Whiskey Lake Core i5-8365UE
- Triple GbE LAN Ports
- Multiple USB 3.2 Gen 2 (10Gb/s)
- Multiple COM Ports
- Modulized Flexible Expansion
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eBOX640-521-FL Fanless Embedded System with 9th/8th Gen
Fanless Embedded System with LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM and 8-CH DI/DO
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TANK-870e-H110 High-Performance 6th/7th Gen PC
Ruggedized Fanless embedded system with 6th/7th Gen Intel® Core™ processor platform
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eBOX640-500-FL Fanless Embedded System with 7th/6th Gen
Fanless Embedded System with LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot and 10 to 30 VDC
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eBOX570 Fanless Embedded System with 13th Gen
Fanless Embedded System with 13th Gen Intel Core i7/i5/Celeron Processor, 2 HDMI, 1 DisplayPort++, 2 LANs, 8 USB, 2 COM, and 12 VDC
Key Features:
- 13th gen Intel Core processor (Raptor Lake P)
- Fanless design with operating temperature from -20°C to 60°C
- 1 DDR4 SO-DIMM for up to 32GB of memory
- Supports the USB power on/off control function
- Supports high-speed NVMe storage (M.2 Key M 2280)
- Supports Intel® vPro and TPM 2.0
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IPC920 Fanless Industrial Computer with 13th/12th Gen
Fanless Industrial System with LGA1700 Socket 13th/12th Gen Intel Core i9/i7/i5/i3 or Celeron Processor, Intel H610E/R680E, and Front-access I/O
Key Features:
- Intelligent power management:
- Ignition
- USB power on/off control - Supports Intel® RAID (R680E)
- Easy expansion via flexible I/O window
- Supports connectors with pull-resistance design
- Optional DIN-rail, bookshelf, and wall mount kit
- EN 61000-6-2 certified
- Intelligent power management: