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  1. AIE900-XNX Fanless Edge AI System NVIDIA Jetson Xavier NX PoE
    AIE900-XNX Fanless Edge AI System NVIDIA Jetson Xavier NX PoE

    NVIDIA Jetson Xavier NX, 1 HDMI, 1 GbE LAN, 4 GbE PoE, 8-CH DI/DO, and 2 COM/CAN for 5G and AMR Applications

    Key Features:

    • NVIDIA Jetson Xavier NX with Volta GPU architecture with 384 NVIDIA CUDA cores
    • Advanced edge AI platform for AMR, AGV, and computer vision
    • Wide power input ranges from 9 to 36 VDC (ignition power control for option)
    • Supports four GbE PoE for GigE camera and LiDAR connectivity
    • Wide operating temperature range from -30°C to +60°C
    • One M.2 Key B slot for 5G
    • One 8-CH DI/DO and two DB9 for RS-232/422/485/CAN ports
  2. AIE510-ONX Fanless Edge AI System with NVIDIA Jetson Orin NX
    AIE510-ONX Fanless Edge AI System with NVIDIA Jetson Orin NX

    NVIDIA Jetson Orin NX 16GB, 1 HDMI, 1 GbE PoE, 1 2.5 GbE PoE, 2 USB, 1 COM/CAN, and 8-CH DIO for AMR & Robotics

    Key Features:

    • NVIDIA Jetson Orin NX (100 TOPS)
    • Seamless speed: 5G, Wi-Fi 6E, and 2.5 GbE combined
    • Easily manage: USB and PoE device power control
    • Supports dual PoE for camera & sensor connectivity
    • -25°C to +60°C operating temperature range
    • Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
  3. AV600-RH Military IP66 AI Edge GPU Computer
    AV600-RH Military IP66 AI Edge GPU Computer

    Military IP66 with D38999 connectors VIDIA RTX A1000/A2000, 2048/2560 CUDA 

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel 13th Gen. Raptor Lake (H) i7-13800HE/HRE, 14C , 2.5/5.0 GHz Processor
    • Up to 64GB DDR5 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX A1000/A2000, 2048/2560 CUDA,4GB/8GB GDDR6 RAM
    • MIL-STD-461 EMI Filter18V~36V DC-Input 
    • Extreme Temperature : -40°C to 60°C
    • Dimensions : 250(L) x 325 (W) x 100 (H) mm
  4. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  5. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  6. NUC-APL Fanless NUC System J3455/N3350
    NUC-APL Fanless NUC System J3455/N3350

    Intel Apollo Lake Celeron Processor J3455/N3350 Up to 8GB DDR3

    Key Features:

    • Onboard Intel Celeron Processor J3455/N3350
    • Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
    • Rich I/O, 2 x COM, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
    • Triple Display, 2 x HDMI, 1 x DP (DVI-I/VGA Factory Option)
    • Expansion Slot,  M.2 Key-B,  M.2 Key-E
    • Fanless Operating from 0°C ~ 60°C
    • DC Power Input +12V
    • Compact Size, 115mm x 111mm x 58mm
    • Supports VESA/Din-Rail Kit
    • TPM 2.0 (Factory Option)
  7. ICO520 DIN-Rail Fanless Embedded Computer with 12th Gen
    ICO520 DIN-Rail Fanless Embedded Computer with 12th Gen

    Axiomtek ICO520 DIN-Rail Fanless Embedded-System 12th-Gen Intel®-Core™ 4x2.5GbE, 4xIsolated-COM, Isolated DIO (8-in/8-out)

    Key Features:

    • High performance with fanless and DIN-rail design
    • 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
    • 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
    • Wide operating temperature range from -40°C to +70°C
    • 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
    • Supports TPM 2.0
    • Supports cold boot at -40°C
  8. USD240I microSD Cards
    USD240I microSD Cards

    112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card

    Key Features:

    • Built-in LDPC ECC (Error Correction Code) functionality
    • Early Move
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • Wear-Levelling
    • Compliant with RoHS 2.0 standards
    • Electrostatic protection (ESD IEC 61000-4-2)
    • Compliant with SD specification 6.1
    • Compliant with UHS-I
    • Compliant with Video Speed Class 30 (V30)
    • Compliant with Application Performance Class 2 (A2)
    • Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
  9. MSM362M & MSM362I mSATA mini SSD
    MSM362M & MSM362I mSATA mini SSD

    16/32/64/128GB mSATA mini SSD

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Compliant with JEDEC MO-300B
    • MLC NAND flash
    • Supports Transcend Scope Pro software
    • Promised operational reliability in a wide temperature range (from -40° to 85°C)
    • Built-in BCH ECC (Error Correction Code) functionality
    • Advanced Global Wear-Leveling and Block management for reliability
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
  10. UST500-517-FL Fanless Embedded System 7th/6th Gen
    UST500-517-FL Fanless Embedded System 7th/6th Gen

    Fanless Embedded System with 7th/6th Gen Intel Core, Pentium and Celeron Processor

    Key Features:

    • CE, FCC, E-Mark, EN 50155 and EN 45545-2 certified
    • LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 65W) with Intel® Q170 (Kaby Lake/Skylake)
    • Fanless and Wide operating temperatures from -40°C to +70°C
    • Flexible LAN selection, up to 16 RJ-45 GbE PoE LAN ports
    • 24 VDC power input
    • Intelligent solution of vehicle power management (ACC ignition)
    • Convenient and Accessible Storage, two/four 2.5” SATA drive, 1 mSATA
  11. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
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Tekdis offers custom built solutions for your application

Tell us what you need