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SSD460K & SSD460K-I 2.5" DRAM-less SSD
2.5" DRAM-less SSD SSD460K features the SATA III 6Gb/s interface and state-of-the-art 3D NAND technology
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MTE662A PCIe M.2 SSD
PCI Express (PCIe) Gen 3 x4 interface and compatible with NVM Express (NVMe), 3D NAND technology
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SATA III M.2 SSDs MTS560T & MTS560T-I
M.2 DRAM-less SSD MTS560T SATA III 6Gb/s interface 3D NAND technology
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AIE900-XNX Fanless Edge AI System NVIDIA Jetson Xavier NX PoE
NVIDIA Jetson Xavier NX, 1 HDMI, 1 GbE LAN, 4 GbE PoE, 8-CH DI/DO, and 2 COM/CAN for 5G and AMR Applications
Key Features:
- NVIDIA Jetson Xavier NX with Volta GPU architecture with 384 NVIDIA CUDA cores
- Advanced edge AI platform for AMR, AGV, and computer vision
- Wide power input ranges from 9 to 36 VDC (ignition power control for option)
- Supports four GbE PoE for GigE camera and LiDAR connectivity
- Wide operating temperature range from -30°C to +60°C
- One M.2 Key B slot for 5G
- One 8-CH DI/DO and two DB9 for RS-232/422/485/CAN ports
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AIE510-ONX Fanless Edge AI System with NVIDIA Jetson Orin NX
NVIDIA Jetson Orin NX 16GB, 1 HDMI, 1 GbE PoE, 1 2.5 GbE PoE, 2 USB, 1 COM/CAN, and 8-CH DIO for AMR & Robotics
Key Features:
- NVIDIA Jetson Orin NX (100 TOPS)
- Seamless speed: 5G, Wi-Fi 6E, and 2.5 GbE combined
- Easily manage: USB and PoE device power control
- Supports dual PoE for camera & sensor connectivity
- -25°C to +60°C operating temperature range
- Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
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AV600-RH Military IP66 AI Edge GPU Computer
Military IP66 with D38999 connectors VIDIA RTX A1000/A2000, 2048/2560 CUDA
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel 13th Gen. Raptor Lake (H) i7-13800HE/HRE, 14C , 2.5/5.0 GHz Processor
- Up to 64GB DDR5 SO-DIMM, non-ECC and ECC
- NVIDIA RTX A1000/A2000, 2048/2560 CUDA,4GB/8GB GDDR6 RAM
- MIL-STD-461 EMI Filter18V~36V DC-Input
- Extreme Temperature : -40°C to 60°C
- Dimensions : 250(L) x 325 (W) x 100 (H) mm
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Neu-X303mini Edge Computing System 12th Gen CPU
12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
Key Features:
- 12th Generation Intel Core (Alder Lake - PS) processor SoC
- Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
- Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
- Onboard M.2 2280 Key M with PCIe signal for storage modules
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
- 12V DC in
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AIE110-ONX Edge AI Developer Kit with NVIDIA® Jetson Orin™
Axiomtek AIE110-ONX Edge AI Developer Kit NVIDIA® Jetson Orin™ SoM
Key Features:
- NVIDIA® Jetson Orin™ NX (up to 100 TOPS)
- 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
- Supports one 15W GbE PoE for camera
- 1 M.2 Key M NVMe SSD slot
- 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
- JetPack supported
- Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
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AIE110-ONA Edge AI Developer Kit with NVIDIA Jetson Orin
Axiomtek AIE110-ONA Edge AI Developer Kit NVIDIA® Jetson Orin™ Nano SoM
Key Features:
- NVIDIA® Jetson Orin™ Nano (up to 40 TOPS)
- 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
- Supports one 15W GbE PoE for camera
- 1 M.2 Key M NVMe SSD slot
- 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
- JetPack supported
- Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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NUC-APL Fanless NUC System J3455/N3350
Intel Apollo Lake Celeron Processor J3455/N3350 Up to 8GB DDR3
Key Features:
- Onboard Intel Celeron Processor J3455/N3350
- Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
- Rich I/O, 2 x COM, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
- Triple Display, 2 x HDMI, 1 x DP (DVI-I/VGA Factory Option)
- Expansion Slot, M.2 Key-B, M.2 Key-E
- Fanless Operating from 0°C ~ 60°C
- DC Power Input +12V
- Compact Size, 115mm x 111mm x 58mm
- Supports VESA/Din-Rail Kit
- TPM 2.0 (Factory Option)
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ICO520 DIN-Rail Fanless Embedded Computer with 12th Gen
Axiomtek ICO520 DIN-Rail Fanless Embedded-System 12th-Gen Intel®-Core™ 4x2.5GbE, 4xIsolated-COM, Isolated DIO (8-in/8-out)
Key Features:
- High performance with fanless and DIN-rail design
- 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
- 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
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MTE662P & MTE662P-I PCIe M.2 SSDs
PCI Express (PCIe) Gen 3 x4 interface, compatible with NVM Express (NVMe) 1.3, 3D NAND technology
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IPC960A Fanless Industrial Computer 13th/12th Gen
LGA1700 Socket 13th/12th Gen Core i7/i5/i3/Celeron Processor, H610E/Q670E, Front-access I/O
Key Features:
- Fanless embedded system
- Optional extension system I/O module
- Optional 5G network (Q670E)
- Intelligent power management: Ignition, USB power on/off control
- Supports Intel RAID (Q670E)
- EN61000-6-2 certified
- Optional DIN-rail, bookshelf, and wall mount kits
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IPC962A Two-slot Industrial System 12th Gen
LGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel H610E/Q670E, Front-access I/O, and PCIe & PCI Slots
Key Features:
- 2 PCIe/PCI slots
- Optional extension system I/O window
- Optional 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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IPC964A Four-slot Industrial System 12th Gen
LGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel Q670E, Front-access I/O, and PCIe & PCI Slots
Key Features:
- 4 PCIe/PCI slots
- Optional extension system I/O window
- Optional Support 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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USD240I microSD Cards
112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card
Key Features:
- Built-in LDPC ECC (Error Correction Code) functionality
- Early Move
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Wear-Levelling
- Compliant with RoHS 2.0 standards
- Electrostatic protection (ESD IEC 61000-4-2)
- Compliant with SD specification 6.1
- Compliant with UHS-I
- Compliant with Video Speed Class 30 (V30)
- Compliant with Application Performance Class 2 (A2)
- Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)
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MSM362M & MSM362I mSATA mini SSD
16/32/64/128GB mSATA mini SSD
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with JEDEC MO-300B
- MLC NAND flash
- Supports Transcend Scope Pro software
- Promised operational reliability in a wide temperature range (from -40° to 85°C)
- Built-in BCH ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
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UST500-517-FL Fanless Embedded System 7th/6th Gen
Fanless Embedded System with 7th/6th Gen Intel Core, Pentium and Celeron Processor
Key Features:
- CE, FCC, E-Mark, EN 50155 and EN 45545-2 certified
- LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 65W) with Intel® Q170 (Kaby Lake/Skylake)
- Fanless and Wide operating temperatures from -40°C to +70°C
- Flexible LAN selection, up to 16 RJ-45 GbE PoE LAN ports
- 24 VDC power input
- Intelligent solution of vehicle power management (ACC ignition)
- Convenient and Accessible Storage, two/four 2.5” SATA drive, 1 mSATA
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eBOX630A Fanless Embedded System with 11th Gen Core
Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC
Key Features:
- 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
- Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
- Supports 3x 2.5 GbE, 6 USB, 4 COM
- -40°C to +60°C wide operating temperatures
- 9 to 48 VDC wide range DC power input
- Supports triple displays with 2 HDMI, and 1 DisplayPort++
- Intel Iris Xe integrated graphics (i7 & i5 SKUs)
- Trusted platform module (TPM 2.0 onboard)
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USD460T & USD460I microSD Cards
microSD Cards Utilizing top-quality 3D NAND Flash and rated to endure 3K P/E cycles