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49-72 of 157 Items

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  1. MSM362M & MSM362I mSATA mini SSD
    MSM362M & MSM362I mSATA mini SSD

    16/32/64/128GB mSATA mini SSD

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Compliant with JEDEC MO-300B
    • MLC NAND flash
    • Supports Transcend Scope Pro software
    • Promised operational reliability in a wide temperature range (from -40° to 85°C)
    • Built-in BCH ECC (Error Correction Code) functionality
    • Advanced Global Wear-Leveling and Block management for reliability
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
  2. VTC7270-C8 GEN 12/13 Fanless 8 x POE AI Vehicle Computer
    VTC7270-C8 GEN 12/13 Fanless 8 x POE AI Vehicle Computer

    12/13th Gen Intel Core CPU 8 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 4 x Serial, 2 x 2.5” SSD, 2 x CAN FD, 9~36VDC/IGN

    Key Features:

    • Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
    • Rich I/Os, 8 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials
    • Up to 4 WWAN/WLAN combinations for mobile router Applications
    • 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
    • Up to two Hailo AI accelerators (26TOPS workload each) in option
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -40°C~65°C (fanless@35W CPU)
    • Military standard for anti-vibration/shock
    • CE/FCC, UKCA, Emark Certified
  3. ATC3750-A6CR NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-A6CR NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail

    Key Features:

    • Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8) performance
    • Designed with rugged, compact and hybrid cooling solutions
    • 6-port GbE PoE+ (X-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (X-coded)
    • HEVC/H.265 hardware DECODE up to 7 x 4K30 performance
    • Wide range operating temperature of -20°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24V DC-IN for rail, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
  4. VTC7270-C4 GEN 12/13 Fanless 4 x POE AI Vehicle Computer
    VTC7270-C4 GEN 12/13 Fanless 4 x POE AI Vehicle Computer

    12/13th Gen Intel Core CPU 4 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 4 x Serial, 2 x 2.5” SSD, 2 x CAN FD, 9~36VDC/IGN

    Key Features:

    • Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
    • Rich I/Os, 4 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials
    • Up to 4 WWAN/WLAN combinations for mobile router Applications
    • 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
    • Up to two Hailo AI accelerators (26TOPS workload each) in option
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -40°C~65°C (fanless@35W CPU)
    • Military standard for anti-vibration/shock
    • CE/FCC, UKCA, Emark Certified
  5. VTC7270 Fanless AI Powered Vehicle Computer
    VTC7270 Fanless AI Powered Vehicle Computer

    12/13th Gen Intel Core CPU 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE

    Key Features:

    • Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
    • Rich I/Os, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE (option)
    • 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
    • Up to 4 WWAN/WLAN combinations for mobile router applications
    • Up to two Hailo AI accelerator (26TOPS workload each) computing power in option
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -40°C~70°C (fanless@35W CPU)
    • Military standard for anti-vibration/shock
    • CE/FCC, UKCA, Emark Certified
  6. VTC7260-x Fanless AI-Aided Vehicle Computer
    VTC7260-x Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~65°C (15W TDP)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  7. ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail

    Key Features:

    • Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
    • Designed with rugged, compact and the hybrid thermal solutions
    • 6-port GbE PoE+ (x-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (x-coded)
    • HEVC/H.265 hardware DECODE@ 6 x 4K30 performance
    • Wide range operating temperature of -30°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24V DC-IN for rail, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
  8. XPPC10-200 10.1” TFT WXGA Multi-Touch Panel PC
    XPPC10-200 10.1” TFT WXGA Multi-Touch Panel PC

    15.6” TFT FHD 16:9 Slim Bezel, Multi Touchscreen Computer Powered by 11th Generation Intel Core Processor

    Key Features:

    • 10.1” TFT WXGA 16:10 panel
    • 10 points P-Cap multi-touch with slim bezel design
    • IP65 protection on the front
    • Support: VESA/panel/openframe mount
    • 11th Generation Intel Tiger Lake-UP3 Core processor SoC
    • 1 x DDR4 SO-DIMM up to 32G
    • M.2 2280 Key M (PCIe x4) for storage device
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Support power input 12 VDC
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Tekdis offers custom built solutions for your application

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Tekdis offers custom built solutions for your application

Tell us what you need