-
CFX602 & CFX602I CFast Cards
Transcend CFast 2.0 CFX602 Memory Cards boast high data transfer rates and extra large storage capacity, perfect for serving as bootable disks.
-
CF180 & CF180I CompactFlash Cards
Transcend's SLC Mode CF180 CompactFlash cards are perfect for embedded systems, medical instruments, road surveillance systems, and other industrial applications having high performance and capacity demands.
-
SSD460K & SSD460K-I 2.5" DRAM-less SSD
2.5" DRAM-less SSD SSD460K features the SATA III 6Gb/s interface and state-of-the-art 3D NAND technology
-
HSD470T Half-Slim SSDs
SATA III 6Gb/s interface, a powerful controller, and state-of-the-art 112-layer 3D NAND flash
-
MTE662A PCIe M.2 SSD
PCI Express (PCIe) Gen 3 x4 interface and compatible with NVM Express (NVMe), 3D NAND technology
-
SATA III M.2 SSDs MTS560T & MTS560T-I
M.2 DRAM-less SSD MTS560T SATA III 6Gb/s interface 3D NAND technology
-
MTS970P SATA III M.2 PLP SSD
Transcend's MTS970P M.2 SSD combines Power Loss Protection (PLP) with a SATA III 6Gb/s interface, 3D NAND technology at 112 layers, and various durability features for enhanced storage efficiency and reliability in mission-critical applications.
Key Features:
- Compliant with RoHS 2.0 standards
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)
-
EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
-
DDR5-5600 Unbuffered SO-DIMM
Compliant with JEDEC standards, Unbuffered long DIMMs and small outline DIMMs are suitable for embedded desktops
Key Features:
- 1.1V low power supply
- Power management IC (PMIC), high energy efficiency
- On-die ECC
- Burst Length: 16, 32
- 16-bit pre-fetch
- Multi-Purpose Command (MPC)
- Decision Feedback Equalization (DFE)
- SPD Hub with Thermal Sensor
- 100% tested for stability, compatibility and performance
-
NUC-APL-SLIM Fanless NUC Slim System J3455/N3350
Intel Apollo Lake J3455/N3350 Up to 8GB DDR3
Key Features:
- Onboard Intel Celeron Processor J3455/N3350
- Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
- Rich I/O, 1 x COM, 2 x HDMI, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
- Expansion Slot, M.2 Key-B, M.2 Key-E
- Fanless Operating from 0°C ~ 50°C
- DC Power Input +12V
- Compact Size, 115mm x 111mm x 45mm
- Supports VESA/Din-Rail Kit
- TPM 2.0 (Factory Option)
-
PSD330 2.5" PATA SSDs
Offers high-speed UDMA Mode 6, and offers installation flexibility for desktops, laptops or portable devices built around the 2.5" PATA (IDE) storage device standard
Key Features:
- Based on Ultra DMA Mode 4
- Built-in ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Static Data Refresh
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Security Command
- Compliant with RoHS 2.0 standards
- MLC NAND flash
-
NUC-APL Fanless NUC System J3455/N3350
Intel Apollo Lake Celeron Processor J3455/N3350 Up to 8GB DDR3
Key Features:
- Onboard Intel Celeron Processor J3455/N3350
- Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
- Rich I/O, 2 x COM, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
- Triple Display, 2 x HDMI, 1 x DP (DVI-I/VGA Factory Option)
- Expansion Slot, M.2 Key-B, M.2 Key-E
- Fanless Operating from 0°C ~ 60°C
- DC Power Input +12V
- Compact Size, 115mm x 111mm x 58mm
- Supports VESA/Din-Rail Kit
- TPM 2.0 (Factory Option)
-
SSD910T 2.5" SATA & PATA SSD
Lightning-fast, reliable 2.5" Enterprise SSD for data centres and high-performance servers
Key Features:
- Compliant with RoHS standards
- DRAM Cache embedded
- High-quality 3D NAND flash
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
-
EPD-2501 Public Information e-Ink Display
Onboard Intel Celeron SoC BGA Processor N3350
Key Features:
- 25.3” E Ink Black/White/Red/Yellow
- 25.3” E Ink Gallery Plus Full colour 55K (Typ.)
- 25.3" E Ink Kaleido with colour 4096
- Onboard Intel® Celeron® SoC BGA Processor N3350
- DDR3L 1866MTs SO-DIMM up to 8GB,
- 2.5” SATA3 SSD 64GB
- 2 x HDMI, 1 x COM, 2 x LAN, 4 x USB 3.1(Gen1)
- Front Cover Glass, Optional PMMA, support IP54
- Super Slim Bezel Design
- E Ink SDK / API support
- Optional WiFi Module
- Operating Temp 0~40C
-
JDI LCD Modules/Displays 3.5" to 15.8"
JDI Industrial Display Solutions 2024 Catalogue
Key Features:
-
Evolving LCD Technology
-
Made for harsh conditions
-
LTPS Technology
-
IPS
-
High brightness 800-1500nit
-
-
UTE210T U.2 SSD
PCIe Gen 4x4 interface, 112-layer 3D NAND flash, Power Loss Protection (PLP)
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.4
- Compliant with PCI Express specification 4.0
- PCIe Gen 4 x4 interface
- DDR4 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
-
FPC-1736 17" 8th/9th Gen CPU Rugged Multi-touch Panel PC
17" 8th/9th Gen Intel Generation Core Pentium i7/ i5/ i3 Processors Full-falt Rugged Multi-touch Panel PC With Active Cooling and Expansion Slot
Key Features:
- Intel LGA1151 Socket Supports 8th /9th refresh Generation Core™ Pentium /i7/ i5/ i3 Processors (Max. TDP at 65W)
- 2 x Memory Socket, Max. Up to 64GB DDR4 2133/2400/2666 MHz
- 4 x USB3.0, 1 x USB2.0(Internal for dongle)
- 3 x RS232, 2 x LAN,1 x HDMI 1.4b, 1 x VGA
- 1 x Storage, 2.5” Drive Bay, 1 x M.2 SSD
- 1 x M.2 Key-E for Wi-Fi, Bluetooth
- Support 1 x PCIex4 Expansion Slot (option for 2 x PCI slot)
- Wide Voltage DC input +12V ~ +24V
- Front IP65, Panel Mounting Kits
- CE, FCC Class A, CCC