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SSD470P & SSD470P-I 2.5" SATA SSDs
Power Loss Protection (PLP) SSD, SATA III 6Gb/s interface and 112-layer 3D NAND flash
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AIE110-ONA Edge AI Developer Kit with NVIDIA Jetson Orin
Axiomtek AIE110-ONA Edge AI Developer Kit NVIDIA® Jetson Orin™ Nano SoM
Key Features:
- NVIDIA® Jetson Orin™ Nano (up to 40 TOPS)
- 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
- Supports one 15W GbE PoE for camera
- 1 M.2 Key M NVMe SSD slot
- 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
- JetPack supported
- Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
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MTE662P & MTE662P-I PCIe M.2 SSDs
PCI Express (PCIe) Gen 3 x4 interface, compatible with NVM Express (NVMe) 1.3, 3D NAND technology
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AIE100-ONA Fanless Edge AI System with NVIDIA Jetson Orin Nano SoM
Axiomtek AIE100-ONA Fanless NVIDIA® Jetson Orin™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB, Allxon Remote Management
Key Features:
- NVIDIA® Jetson Orin™ Nano, up to 1024-core NVIDIA Ampere GPU
- High AI computing performance for GPU-accelerated processing
- Ideal for edge AI smart city applications
- Supports one 15W GbE PoE for camera
- Wide operating temperature from -20°C to +50°C
- JetPack supported
- Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
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MSA452P mSATA SSDs
SATA III 6Gb/s MSA452P mSATA SSD -20°C to 75°C
Key Features:
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Security Command
- Full drive encryption with Advanced Encryption Standard (AES) (optional)
- Power-saving DevSleep (Device Sleep) mode
- Compliant with RoHS 2.0 standards
- Compliant with JEDEC MO-300A
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
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SCM187 RISC Embedded SMARC v2.1 SoM Quad Core 1.6 GHz SoC, 4GB RAM 8GB eMMC
Axiomtek SCM187 RISC Embedded SMARC v2.1 SoM i.MX 8M Mini Quad Core 1.6 GHz SoC 4GB RAM 8GB eMMC
Key Features:
- SMARC 2.1 (82 x 50 mm)
- NXP i.MX 8M Mini Quad A53 Core processor
- Dual CANbus 2.0B
- Dual-channel 24-bit LVDS
- HDMI up to FHD Resolution (option)
- 10/100/1000 Mbps Ethernet
- USB 2.0
- MIPI-CSI
- Audio
- Yocto 4.0
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MTS952P & MTS952P-I SATA III M.2 SSDs
SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C
Key Features:
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Power-saving DevSleep (Device Sleep) mode
- Compliant with RoHS 2.0 standards
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
- Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
- Supports Transcend Scope Pro software
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SDM510L Intel SDM-L 12th Gen i7/i5/i3
Axiomtek SDM510L Intel® SDM-L 12th Gen Intel® Core™ i7/i5/i3 Intel® Iris® Xe Graphics 8K60Hz
Key Features:
- Intel® Smart Display Module (Intel® SDM) specification
- 12th gen Intel® Core™ i7/i5/i3 or Intel® Celeron processor (Alder Lake-H/P/U series)
- 2 DDR4-3200 SO-DIMM
- M.2 Key E slot
- M.2 Key M slot
- 3 HDMI, 3 USB 3.2 Gen2, 1 USB 2.0, and 1 LAN
- Supports Intel® OpenVINO™ and Intel vPro®
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USD240I microSD Cards
112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card
Key Features:
- Built-in LDPC ECC (Error Correction Code) functionality
- Early Move
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Wear-Levelling
- Compliant with RoHS 2.0 standards
- Electrostatic protection (ESD IEC 61000-4-2)
- Compliant with SD specification 6.1
- Compliant with UHS-I
- Compliant with Video Speed Class 30 (V30)
- Compliant with Application Performance Class 2 (A2)
- Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)
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ICO520 DIN-Rail Fanless Embedded Computer with 12th Gen
Axiomtek ICO520 DIN-Rail Fanless Embedded-System 12th-Gen Intel®-Core™ 4x2.5GbE, 4xIsolated-COM, Isolated DIO (8-in/8-out)
Key Features:
- High performance with fanless and DIN-rail design
- 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
- 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
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Transcend 470K 2.5" SATA SSDs
128GB/256GB/512GB/1TB/2TB/4TB 2.5" SATA SSDs SATA III 6Gb/s 3D NAND DRAM
Hardware Features:
- Compliant with RoHS 2.0 standards
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)
- Supports Transcend Scope Pro software
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eBOX671B Fanless Embedded System with 13th/12th Gen
eBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2
Key Features:
- 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
- processors with Intel R680E chipset (Alder Lake S)
- Dual DDR5 SO-DIMM for up to 64GB of memory
- 4 LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- Supports MXM 3.1 Type A, up to 5 display outputs
- -40 °C to +65 °C wide operating temperatures
- Wide range power input from 9 to 36 VDC
- Flexible I/O window supported via mPCIe modules
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DrivePro Body 70 Body Camera
2K QHD 1440P 64GB Internal Storage 9-hour battery life
Key Features:
- Connect to mobile devices easily and quickly
- Built-in GPS receiver for geotagging videos and images
- Buffering mode captures crucial footage and saves storage space
- Built-in Wi-Fi function for mobile live streaming
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IPC960A Fanless Industrial Computer 13th/12th Gen
LGA1700 Socket 13th/12th Gen Core i7/i5/i3/Celeron Processor, H610E/Q670E, Front-access I/O
Key Features:
- Fanless embedded system
- Optional extension system I/O module
- Optional 5G network (Q670E)
- Intelligent power management: Ignition, USB power on/off control
- Supports Intel RAID (Q670E)
- EN61000-6-2 certified
- Optional DIN-rail, bookshelf, and wall mount kits
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MTE672A PCIe M.2 SSD
PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)
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IPC962A Two-slot Industrial System 12th Gen
LGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel H610E/Q670E, Front-access I/O, and PCIe & PCI Slots
Key Features:
- 2 PCIe/PCI slots
- Optional extension system I/O window
- Optional 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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SSD470A 2.5" SATA SSDs
2.5" SSD SATA III 6Gb/s interface and 112-layer 3D NAND flash
Key Features:
- Compliant with RoHS 2.0 standards
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)
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IPC964A Four-slot Industrial System 12th Gen
LGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel Q670E, Front-access I/O, and PCIe & PCI Slots
Key Features:
- 4 PCIe/PCI slots
- Optional extension system I/O window
- Optional Support 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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MSM362M & MSM362I mSATA mini SSD
16/32/64/128GB mSATA mini SSD
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with JEDEC MO-300B
- MLC NAND flash
- Supports Transcend Scope Pro software
- Promised operational reliability in a wide temperature range (from -40° to 85°C)
- Built-in BCH ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
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AIE110-XNX Edge AI Developer Kit NVIDIA® Jetson Xavier™
AIE110-XNX Edge AI Developer Kit NVIDIA® Jetson Xavier™ 1 x GbE LAN 1 x GbE PoE
Key Features:
- NVIDIA® Jetson Xavier™ NX, 384-core NVIDIA Volta™ GPU
- 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE
- Supports one 15W GbE PoE for camera
- 1 M.2 M-Key NVMe SSD slot and 1 Micro SD slot
- 1 PCI Express Mini Card for Wi-Fi/Bluetooth/LTE/GPS
- JetPack supported
- Supports 24/7 secure remote monitoring, control, and OTA
deployment empowered by Allxon
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USD460T & USD460I microSD Cards
microSD Cards Utilizing top-quality 3D NAND Flash and rated to endure 3K P/E cycles
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ICO330 DIN-Rail Fanless Embedded System
Intel Atom 3 x 2.5GbE LAN Isolated COM & DIO Fanless System
Key Features:
- Cost-effective with fanless design
- Intel Atom® x6212RE or x6414RE processor
- 6 isolated COM, isolated DIO (8-in/8-out), 3 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
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UST500-517-FL Fanless Embedded System 7th/6th Gen
Fanless Embedded System with 7th/6th Gen Intel Core, Pentium and Celeron Processor
Key Features:
- CE, FCC, E-Mark, EN 50155 and EN 45545-2 certified
- LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 65W) with Intel® Q170 (Kaby Lake/Skylake)
- Fanless and Wide operating temperatures from -40°C to +70°C
- Flexible LAN selection, up to 16 RJ-45 GbE PoE LAN ports
- 24 VDC power input
- Intelligent solution of vehicle power management (ACC ignition)
- Convenient and Accessible Storage, two/four 2.5” SATA drive, 1 mSATA