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SSD460K & SSD460K-I 2.5" DRAM-less SSD
2.5" DRAM-less SSD SSD460K features the SATA III 6Gb/s interface and state-of-the-art 3D NAND technology
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HSD470T Half-Slim SSDs
SATA III 6Gb/s interface, a powerful controller, and state-of-the-art 112-layer 3D NAND flash
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MTE662A PCIe M.2 SSD
PCI Express (PCIe) Gen 3 x4 interface and compatible with NVM Express (NVMe), 3D NAND technology
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SATA III M.2 SSDs MTS560T & MTS560T-I
M.2 DRAM-less SSD MTS560T SATA III 6Gb/s interface 3D NAND technology
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DDR5-5600 Unbuffered SO-DIMM
Compliant with JEDEC standards, Unbuffered long DIMMs and small outline DIMMs are suitable for embedded desktops
Key Features:
- 1.1V low power supply
- Power management IC (PMIC), high energy efficiency
- On-die ECC
- Burst Length: 16, 32
- 16-bit pre-fetch
- Multi-Purpose Command (MPC)
- Decision Feedback Equalization (DFE)
- SPD Hub with Thermal Sensor
- 100% tested for stability, compatibility and performance
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SSD470P & SSD470P-I 2.5" SATA SSDs
Power Loss Protection (PLP) SSD, SATA III 6Gb/s interface and 112-layer 3D NAND flash
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Neu-X304 Edge Computer System 13/12th Gen CPU
Unleash the potential of multiple AI and edge applications with the Neu-X304
Key Features:
- 13/12th Gen Intel® Core™ i9/i7/i5/i3 processors, up to 35W
- Dual channel DDR5 SO-DIMM, max up to 64GB
- Support 3 x HDMI 2.0 output, 4K@60Hz
- Dual Intel® LAN ports
- Rich Interface : 2 x COM ports, 8 x USB port, Mic-in, Line-out
- TPM 2.0 onboard
- Support Intel® AMT technology (Q670E only)
- Multiple expansion slots: M.2 2280 Key M for storage, M. 2 2230 Key E for Wi-Fi module,
- M.2 3052 Key B for LTE/5G module
- Power Input:12V DC or 12~24V DC (Q670E only)
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MTE662P & MTE662P-I PCIe M.2 SSDs
PCI Express (PCIe) Gen 3 x4 interface, compatible with NVM Express (NVMe) 1.3, 3D NAND technology
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MTS952P & MTS952P-I SATA III M.2 SSDs
SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C
Key Features:
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Power-saving DevSleep (Device Sleep) mode
- Compliant with RoHS 2.0 standards
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
- Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
- Supports Transcend Scope Pro software
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USD240I microSD Cards
112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card
Key Features:
- Built-in LDPC ECC (Error Correction Code) functionality
- Early Move
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Wear-Levelling
- Compliant with RoHS 2.0 standards
- Electrostatic protection (ESD IEC 61000-4-2)
- Compliant with SD specification 6.1
- Compliant with UHS-I
- Compliant with Video Speed Class 30 (V30)
- Compliant with Application Performance Class 2 (A2)
- Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)
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MTE672A PCIe M.2 SSD
PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)
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MSM362M & MSM362I mSATA mini SSD
16/32/64/128GB mSATA mini SSD
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with JEDEC MO-300B
- MLC NAND flash
- Supports Transcend Scope Pro software
- Promised operational reliability in a wide temperature range (from -40° to 85°C)
- Built-in BCH ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
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USD460T & USD460I microSD Cards
microSD Cards Utilizing top-quality 3D NAND Flash and rated to endure 3K P/E cycles
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MTE460T & MTE460T-I PCIe M.2 SSDs
128GB/256GB/512GB/1TB PCIe M.2 SSD PCIe Gen 3x2 112-layer 3D NAND flash
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XPPC16-101 15.6” TFT FHD Multi-Touch Panel PC
15.6” TFT FHD 16:9 Slim Bezel, Multi Touchscreen Computer Powered by Intel Celeron Processor J3455
Key Features:
- 15.6” TFT FHD 16:9 Panel
- 10 points P-Cap multi-touch with slim bezel design
- IP65 protection on the front
- Support: VESA/panel/openframe mount
- Intel Celeron processor J3455, 1.50GHz, 2M cache
- 1 x DDR3L up to 8GB, M.2 2242 Key M for storage device
- Support power input 19 VDC
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XPPC10-100-1 10.1” TFT WXGA Multi-Touch Panel PC
10.1” TFT WXGA 16:10 Slim Bezel, Multi Touchscreen Computer Powered by Intel® Celeron® Processor J3455
Key Features:
- 10.1” TFT WXGA 16:10 panel
- 10-point PCAP multi-touch with a slim bezel design
- IP65 protection on the front
- Support: VESA/panel/openframe mount
- Intel Celeron processor J3455
- 1 x DDR3L up to 8GB, M.2 2242 Key M for storage device
- Support power input 19 VDC
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XPPC22-100A 21.5” TFT FHD Multi-Touch Panel PC
21.5” TFT FHD 16:9 Slim Bezel, Multi Touchscreen Computer Powered by Intel Celeron Processor J3455
Key Features:
- 21.5” TFT FHD 16:9 panel
- 10 Points P-Cap multi-touch with slim bezel design
- IP65 protection on the front
- Support: VESA/panel/openframe mount
- Onboard Intel Celeron processor J3455
- 1 x DDR3L up to 8GB, M.2 2242 Key M for storage device
- Support power input 19 VDC
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MTS970T & MTS970T-I SATA III M.2 SSD
128GB/256GB/512GB/1TB/2TB/4TB SATA III M.2 SSD 112 layers of 3D NAND flash 30µ" gold finger
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XPPC24-100 23.8” TFT FHD Multi-Touch Panel PC
23.8” TFT FHD 16:9 Slim Bezel, Multi Touchscreen Computer Powered by Intel Apollo Lake J3455 Processor
Key Features:
- 23.8” TFT FHD 16:9 panel
- 10 Points P-Cap multi-touch with slim bezel design
- IP65 protection on the front
- Support: VESA/panel/openframe mount
- Intel Celeron processor J3455, quad core, 1.50 GHz
- 1 x DDR3L up to 8GB, M.2 M-key 2242 for storage device
- Support power input 19 VDC
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XPPC10-200 10.1” TFT WXGA Multi-Touch Panel PC
15.6” TFT FHD 16:9 Slim Bezel, Multi Touchscreen Computer Powered by 11th Generation Intel Core Processor
Key Features:
- 10.1” TFT WXGA 16:10 panel
- 10 points P-Cap multi-touch with slim bezel design
- IP65 protection on the front
- Support: VESA/panel/openframe mount
- 11th Generation Intel Tiger Lake-UP3 Core processor SoC
- 1 x DDR4 SO-DIMM up to 32G
- M.2 2280 Key M (PCIe x4) for storage device
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Support power input 12 VDC