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  1. Neu-X304 Edge Computer System 13/12th Gen CPU
    Neu-X304 Edge Computer System 13/12th Gen CPU

    Unleash the potential of multiple AI and edge applications with the Neu-X304

    Key Features:

    • 13/12th Gen Intel® Core™ i9/i7/i5/i3 processors, up to 35W
    • Dual channel DDR5 SO-DIMM, max up to 64GB
    • Support 3 x HDMI 2.0 output, 4K@60Hz
    • Dual Intel® LAN ports
    • Rich Interface : 2 x COM ports, 8 x USB port, Mic-in, Line-out
    • TPM 2.0 onboard
    • Support Intel® AMT technology (Q670E only)
    • Multiple expansion slots: M.2 2280 Key M for storage, M. 2 2230 Key E for Wi-Fi module,
    • M.2 3052 Key B for LTE/5G module
    • Power Input:12V DC or 12~24V DC (Q670E only)
  2. MTS952P & MTS952P-I SATA III M.2 SSDs
    MTS952P & MTS952P-I SATA III M.2 SSDs

    SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C

    Key Features:

    • Dynamic thermal throttling
    • Built-in LDPC ECC (Error Correction Code) functionality
    • Advanced Garbage Collection
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
    • NCQ command for better performance
    • Power-saving DevSleep (Device Sleep) mode
    • Compliant with RoHS 2.0 standards
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • DDR3 DRAM Cache embedded
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
    • Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
    • Supports Transcend Scope Pro software
  3. USD240I microSD Cards
    USD240I microSD Cards

    112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card

    Key Features:

    • Built-in LDPC ECC (Error Correction Code) functionality
    • Early Move
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • Wear-Levelling
    • Compliant with RoHS 2.0 standards
    • Electrostatic protection (ESD IEC 61000-4-2)
    • Compliant with SD specification 6.1
    • Compliant with UHS-I
    • Compliant with Video Speed Class 30 (V30)
    • Compliant with Application Performance Class 2 (A2)
    • Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
  4. MTE672A PCIe M.2 SSD
    MTE672A PCIe M.2 SSD

    PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Compliant with NVM Express specification 1.3
    • Compliant with PCI Express specification 3.1
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • PCIe Gen 3 x4 interface
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Anti-sulfur technology implemented to prevent sulfurization in the environment
    • Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
    • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
  5. MSM362M & MSM362I mSATA mini SSD
    MSM362M & MSM362I mSATA mini SSD

    16/32/64/128GB mSATA mini SSD

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Compliant with JEDEC MO-300B
    • MLC NAND flash
    • Supports Transcend Scope Pro software
    • Promised operational reliability in a wide temperature range (from -40° to 85°C)
    • Built-in BCH ECC (Error Correction Code) functionality
    • Advanced Global Wear-Leveling and Block management for reliability
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
  6. XPPC10-200 10.1” TFT WXGA Multi-Touch Panel PC
    XPPC10-200 10.1” TFT WXGA Multi-Touch Panel PC

    15.6” TFT FHD 16:9 Slim Bezel, Multi Touchscreen Computer Powered by 11th Generation Intel Core Processor

    Key Features:

    • 10.1” TFT WXGA 16:10 panel
    • 10 points P-Cap multi-touch with slim bezel design
    • IP65 protection on the front
    • Support: VESA/panel/openframe mount
    • 11th Generation Intel Tiger Lake-UP3 Core processor SoC
    • 1 x DDR4 SO-DIMM up to 32G
    • M.2 2280 Key M (PCIe x4) for storage device
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Support power input 12 VDC
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Tekdis offers custom built solutions for your application

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