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1-24 of 54 Items

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  1. ATC3750-IP7-WI8MR NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-IP7-WI8MR NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Edge AI Computer for Rail

    Key Features:

    • Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8)
    • Designed to be IP67-rated, rugged, and compact
    • 8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR
    • HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
    • Wide range operating temperature of -25°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24~110VDC w/ isolation, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT3), EN45545-2 certified
  2. ATC3750-IP7-8M NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-IP7-8M NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computer for Rail

    Key Features:

    • Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance

    • Designed to be IP67-rated, rugged, and compact

    • 8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR sensors

    • HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30

    • Wide range operating temperature of -25°C~70°C

    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity

    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6

    • 9~36VDC & 24V rail combined, ignition control & OCP/OVP

    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1

    • Military standard of MIL-STD-810H for anti-vibration/shock

    • CE/FCC, UKCA, E-mark, EN50155 (EN55011, EN50121-3-2, EN61373, OT3) certified

  3. ATC3520-IP7-3M NVIDIA Jetson Orin Nano Edge AI Computer
    ATC3520-IP7-3M NVIDIA Jetson Orin Nano Edge AI Computer

    NVIDIA Jetson Orin Nano Accelerated Edge AI Computer for In-Vehicle/Rail

    Key Features:

    • Built-in NVIDIA® Jetson Orin™ Nano SOM, up to 40(sparse) INT8 TOPS computer

    • 3-CH MIPI SerDes, 1080p60/4Kp30 over 15m cable for MIPI CAM

    • HEVC/H.265 hardware CODEC, 11x 1080p30 compute power (decoded)

    • Wide range operating temperature of -30~70°C

    • Rugged, fanless design with an IP67 rating

    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity

    • NEXCOM Acceleration Linux (NAL) OS w/ JetPack 5.1.1 integrated

    • Expansible for LTE/5G NR & Wi-Fi 5/6

    • 9~36V DC-in with ignition control & OCP/OVP

  4. PSD330 2.5" PATA SSDs
    PSD330 2.5" PATA SSDs

    Offers high-speed UDMA Mode 6, and offers installation flexibility for desktops, laptops or portable devices built around the 2.5" PATA (IDE) storage device standard

    Key Features:

    • Based on Ultra DMA Mode 4
    • Built-in ECC (Error Correction Code) functionality
    • Advanced Global Wear-Leveling and Block management for reliability
    • Static Data Refresh
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • Security Command
    • Compliant with RoHS 2.0 standards
    • MLC NAND flash
  5. VTC1920 Atom x7211RE Telematics IoT Gateway
    VTC1920 Atom x7211RE Telematics IoT Gateway

    Intel Atom® x7211RE Telematics IoT Gateway with Slim and Ruggedized Design

    Key Features:

    • Super slim and ruggedized design

    • Intel Atom® processor x7211RE (1.0GHz)

    • Built-in 1 x CAN FD, 1 x CAN 2.0B

    • Smart power management with Ignition on/off delay via software control and low voltage protection

    • Built-in U-blox M9N GNSS

    • Dual SIM cards for WWAN modules

    • Wide range DC input from 9 ~ 36V

    • Wide operating temperature -40°C ~ 70°C

    • Certified by CE/ FCC/ E13 mark

  6. VMC320 10.1" Rugged Vehicle Mount Computer
    VMC320 10.1" Rugged Vehicle Mount Computer

    10.1" Rugged Vehicle Mount Computer with i.MX 8M Plus Processor, PCAP Touch Screen

    Key Features:

    • 10.1" TFT LCD monitor with projected capacitive touchscreen

    • Wide viewing angle with high resolution 1280 x 800

    • Touch panel cover thickness 3mm for IK08 protection

    • 1,000nits brightness with sunlight-readable capability

    • Built-in NXP i.MX 8M Plus low-power processor, 4-core

    • HDMI output for 2nd display

    • On-screen F1 ~ F5 programmable function keys

    • Wide range DC input 9V ~ 60V

    • Front panel IP65 rating

    • Optional backup battery available

  7. Neu-X304 Edge Computer System 13/12th Gen CPU
    Neu-X304 Edge Computer System 13/12th Gen CPU

    Unleash the potential of multiple AI and edge applications with the Neu-X304

    Key Features:

    • 13/12th Gen Intel® Core™ i9/i7/i5/i3 processors, up to 35W
    • Dual channel DDR5 SO-DIMM, max up to 64GB
    • Support 3 x HDMI 2.0 output, 4K@60Hz
    • Dual Intel® LAN ports
    • Rich Interface : 2 x COM ports, 8 x USB port, Mic-in, Line-out
    • TPM 2.0 onboard
    • Support Intel® AMT technology (Q670E only)
    • Multiple expansion slots: M.2 2280 Key M for storage, M. 2 2230 Key E for Wi-Fi module,
    • M.2 3052 Key B for LTE/5G module
    • Power Input:12V DC or 12~24V DC (Q670E only)
  8. MTS952P & MTS952P-I SATA III M.2 SSDs
    MTS952P & MTS952P-I SATA III M.2 SSDs

    SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C

    Key Features:

    • Dynamic thermal throttling
    • Built-in LDPC ECC (Error Correction Code) functionality
    • Advanced Garbage Collection
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
    • NCQ command for better performance
    • Power-saving DevSleep (Device Sleep) mode
    • Compliant with RoHS 2.0 standards
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • DDR3 DRAM Cache embedded
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
    • Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
    • Supports Transcend Scope Pro software
  9. USD240I microSD Cards
    USD240I microSD Cards

    112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card

    Key Features:

    • Built-in LDPC ECC (Error Correction Code) functionality
    • Early Move
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • Wear-Levelling
    • Compliant with RoHS 2.0 standards
    • Electrostatic protection (ESD IEC 61000-4-2)
    • Compliant with SD specification 6.1
    • Compliant with UHS-I
    • Compliant with Video Speed Class 30 (V30)
    • Compliant with Application Performance Class 2 (A2)
    • Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
  10. ATC3520-IP7-4C/AI4CR NVIDIA Jetson Orin Nano
    ATC3520-IP7-4C/AI4CR NVIDIA Jetson Orin Nano

    Discover the ATC3520-IP7-4C/AI4CR: Your Edge AI computing solution with NVIDIA Jetson Orin Nano, IP67 design, and certifications for industrial needs.

    Key Features:

    • Edge AI in-vehicle/rail computer
    • Built-in NVIDIA Jetson Orin Nano SOM, up to 40(sparse) INT8 TOPS
    • 4-Port GbE PoE+ for IP CAM/LiDAR sensors
    • HEVC/H.265 hardware CODEC, 11x 1080p30 compute power (decoded)
    • Wide range operating temperature of -30~70°C
    • Rugged, fanless design with an IP67 rating
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • NEXCOM Acceleration Linux (NAL) OS w/ JetPack 5.1.1 integrated
    • Expansible for LTE/5G NR & Wi-Fi 5/6
    • 9~36V DC-in with ignition control & OCP/OVP
    • CE/FCC, UKCA, Emark/EN50155 certified
  11. nROK7271 Fanless Vehicle PC 12/13th Gen CPU
    nROK7271 Fanless Vehicle PC 12/13th Gen CPU

    Introducing nROK 7271 (Preliminary): A fanless, rugged rolling stock computer with 12/13th Gen Intel® Core™ CPU, DDR5, 5G/Wi-Fi, and PoE support, designed for industrial computing.

    Key Features:

    • Powered by 12/13th Gen Intel® Core™ CPU
    • Fanless, compact and rugged design
    • Designed with DDR5, excellent memory bandwidth, lower latency
    • 2 x 2.5” SSD for data integrity (compatible with 15mm disk)
    • 5G/Wi-Fi, PoE, 10GbE, daughter board expansion support
    • 4 x Independent 10/100/1000/2500 Mbps PoE 802.3af/at, total 60W (nROK 7271-WIC4) / 30W (nROK 7271-WIC4-C8S)
    • Additional 8-port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 30W (nROK7271-WIC4-C8S)
    • EN 50155, class OT3 conformity
    • Wide voltage input 24~110VDC (w/ isolation)
    • Optional up to 3-sec protection against temporary voltage dips
  12. nROK7270 Fanless Vehicle PC 12/13th Gen CPU
    nROK7270 Fanless Vehicle PC 12/13th Gen CPU

    Introducing the nROK 7270: a fanless rolling stock computer with a powerful Intel Core CPU, DDR5 memory, 5G/Wi-Fi, PoE support, and military-standard durability.

    Key Features:

    • Powered by 12/13th Gen Intel Core CPU

    • Fanless, compact and rugged design

    • Designed with DDR5, excellent memory bandwidth, lower latency

    • 2 x 2.5” SSD for data integrity (compatible with 15mm disk)

    • 5G/Wi-Fi, PoE, 10GbE, daughter board expansion support

    • Two video outputs, one VGA and one HDMI

    • 4 x Independent 10/100/1000/2500 Mbps PoE 802.3 af/at, total 60W (nROK 7270-AC4/nROK 7270-AC4-C8S)

    • Additional 8-port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W (nROK 7270-AC4-C8S)

    • Military standard for anti-vibration/shock

    • EN 50155, class OT3 conformity

  13. MTE672A PCIe M.2 SSD
    MTE672A PCIe M.2 SSD

    PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Compliant with NVM Express specification 1.3
    • Compliant with PCI Express specification 3.1
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • PCIe Gen 3 x4 interface
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Anti-sulfur technology implemented to prevent sulfurization in the environment
    • Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
    • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
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Tekdis offers custom built solutions for your application

Tell us what you need