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SSD460K & SSD460K-I 2.5" DRAM-less SSD2.5" DRAM-less SSD SSD460K features the SATA III 6Gb/s interface and state-of-the-art 3D NAND technology
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HSD470T Half-Slim SSDsSATA III 6Gb/s interface, a powerful controller, and state-of-the-art 112-layer 3D NAND flash
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MTE662A PCIe M.2 SSDPCI Express (PCIe) Gen 3 x4 interface and compatible with NVM Express (NVMe), 3D NAND technology
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SATA III M.2 SSDs MTS560T & MTS560T-IM.2 DRAM-less SSD MTS560T SATA III 6Gb/s interface 3D NAND technology
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DK310 Elkhart Lake Ultra-Compact Media PlayerElkhart Lake Ultra-Compact Media Player Mid Range Embedded Media Player/PC
Key Features:
- Intel Elkhart Lake Processors
- 1 x HDMI (Max. 4096 x 2160 @60Hz)
- 1 x DP (Max. 4096 x 2160 @60Hz)
- Onboard LPDDR4 4GB (Optional: 8GB)
- 1 x Full-size Mini-PCIe for MSATA
- Onboard eMMC5.1 32GB (Optional: 64GB)
- 1 x Rj45, 1 x M.2 for WiFi/BT, 2 x WiFi Antenna
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ATC3750-IP7-WI8MR NVIDIA Jetson AGX Orin Edge AI ComputerNVIDIA Jetson AGX Orin Edge AI Computer for Rail
Key Features:
- Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8)
- Designed to be IP67-rated, rugged, and compact
- 8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR
- HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
- Wide range operating temperature of -25°C~70°C
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
- 24~110VDC w/ isolation, ignition control & OCP/OVP
- NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
- Military standard of MIL-STD-810H for anti-vibration/shock
- CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT3), EN45545-2 certified
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eBOX671A Fanless Embedded System with LGA1200 Socket 11th/10th GenWith LGA1200 Socket 11th/10th Gen Intel Xeon, Core i9/i7/i5/i3 or Celeron Processor, Intel W480E, 2 HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 48 VDC
Key Features:
- LGA1200 11th/10th gen Intel® Xeon®, Core™ i9/i7/i5/i3 or Celeron® with Intel® W480E chipset (Comet Lake-S)
- 4 GbE LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- 2 HDMI and 1 DisplayPort for triple-view
- -40°C to +70°C wide range operation temperature
- Wide range power input from 9 to 48 VDC
- Flexible I/O window supported via mPCIe modules
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AirLink XR60 Rugged 5G RouterAirLink® XR60, the world’s smallest rugged 5G router is compact yet powerful.
Key Features:
- 4x4 5G + LTE Cat-20
- 2x2 Wi-Fi 6 (optional)
- Dual-Band GNSS
- Single Serial / Single
- Ethernet (1 Gbps) or Dual Ethernet (1 Gbps + 5 Gbps)
- IP64 and MIL-STD-810H Rated
- Powered by AirLink OS and AirLink Complete
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EMS-TGL Fanless Rugged Embedded System 11th Gen11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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BM370A-A01 37" 700nit Android Bar DisplayAndroid 7.1, 1920 × 540 Resolution, Full Metal Shell
Key Features:
- ADSDS Panel Technology
- 1920 × 540 Resolution
- 700nits Brightness
- Android 7.1
- Quad Core SoC
- Slim Design
- Full Metal Shell
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ATC3750-IP7-8M NVIDIA Jetson AGX Orin Edge AI ComputerNVIDIA Jetson AGX Orin Solution Performance Edge AI Computer for Rail
Key Features:
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Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
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Designed to be IP67-rated, rugged, and compact
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8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR sensors
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HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
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Wide range operating temperature of -25°C~70°C
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Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
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Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
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9~36VDC & 24V rail combined, ignition control & OCP/OVP
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NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
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Military standard of MIL-STD-810H for anti-vibration/shock
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CE/FCC, UKCA, E-mark, EN50155 (EN55011, EN50121-3-2, EN61373, OT3) certified
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DDR5-5600 Unbuffered SO-DIMMCompliant with JEDEC standards, Unbuffered long DIMMs and small outline DIMMs are suitable for embedded desktops
Key Features:
- 1.1V low power supply
- Power management IC (PMIC), high energy efficiency
- On-die ECC
- Burst Length: 16, 32
- 16-bit pre-fetch
- Multi-Purpose Command (MPC)
- Decision Feedback Equalization (DFE)
- SPD Hub with Thermal Sensor
- 100% tested for stability, compatibility and performance
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BM370A-M02 37” 700nit Bar Display1920 × 540 Resolution, Multiple External Inputs, Full Metal Shell
Key Features:
- ADSDS Panel Technology
- 1920 × 540 Resolution
- 700nits Brightness
- Multiple External Input
- External Control via RS232
- Slim Design
- Full Metal Shell
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ATC3520-IP7-3M NVIDIA Jetson Orin Nano Edge AI ComputerNVIDIA Jetson Orin Nano Accelerated Edge AI Computer for In-Vehicle/Rail
Key Features:
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Built-in NVIDIA® Jetson Orin™ Nano SOM, up to 40(sparse) INT8 TOPS computer
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3-CH MIPI SerDes, 1080p60/4Kp30 over 15m cable for MIPI CAM
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HEVC/H.265 hardware CODEC, 11x 1080p30 compute power (decoded)
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Wide range operating temperature of -30~70°C
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Rugged, fanless design with an IP67 rating
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Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
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NEXCOM Acceleration Linux (NAL) OS w/ JetPack 5.1.1 integrated
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Expansible for LTE/5G NR & Wi-Fi 5/6
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9~36V DC-in with ignition control & OCP/OVP
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PSD330 2.5" PATA SSDsOffers high-speed UDMA Mode 6, and offers installation flexibility for desktops, laptops or portable devices built around the 2.5" PATA (IDE) storage device standard
Key Features:
- Based on Ultra DMA Mode 4
- Built-in ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Static Data Refresh
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Security Command
- Compliant with RoHS 2.0 standards
- MLC NAND flash
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BQ612 Mini Desktop PC 12th/13th Gen CPUMini-PC with desktop CPU (12th/13th gen.) and nine USB ports
Key Features:
- Intel LGA1700 Socket 12th/13th Gen. Processors
- 1 x HDMI (Max. 4096 x 2160 @60 Hz)
- 1 x VGA, Optional: 1 x DP
- RTC
- Watchdog Timer
- Chassis Intrusion
- Support NVMe SSD
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VTC1920 Atom x7211RE Telematics IoT GatewayIntel Atom® x7211RE Telematics IoT Gateway with Slim and Ruggedized Design
Key Features:
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Super slim and ruggedized design
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Intel Atom® processor x7211RE (1.0GHz)
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Built-in 1 x CAN FD, 1 x CAN 2.0B
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Smart power management with Ignition on/off delay via software control and low voltage protection
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Built-in U-blox M9N GNSS
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Dual SIM cards for WWAN modules
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Wide range DC input from 9 ~ 36V
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Wide operating temperature -40°C ~ 70°C
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Certified by CE/ FCC/ E13 mark
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EPD-2501 Public Information e-Ink DisplayOnboard Intel Celeron SoC BGA Processor N3350
Key Features:
- 25.3” E Ink Black/White/Red/Yellow
- 25.3” E Ink Gallery Plus Full colour 55K (Typ.)
- 25.3" E Ink Kaleido with colour 4096
- Onboard Intel® Celeron® SoC BGA Processor N3350
- DDR3L 1866MTs SO-DIMM up to 8GB,
- 2.5” SATA3 SSD 64GB
- 2 x HDMI, 1 x COM, 2 x LAN, 4 x USB 3.1(Gen1)
- Front Cover Glass, Optional PMMA, support IP54
- Super Slim Bezel Design
- E Ink SDK / API support
- Optional WiFi Module
- Operating Temp 0~40C
Tekdis offers custom built solutions for your application
Tell us what you need
Tekdis offers custom built solutions for your application
Tell us what you need