VTC7260-xC4 Fanless AI-Aided Vehicle Computer

Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

Key Features:

Intel 11th Gen Tiger Lake UP3, cost-efficient performance
Compact, rugged and fanless design
Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0&2 x RS232/422/485
1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
Triple display, VGA, HDMI and DP for multi video-out
9~36V DC-IN with ignition control & OCP/OVP
Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
Military standard of anti-vibration/shock for OHV applications
CE/FCC, UKCA, Emark Certified

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VTC1031/-C2 Atom 6413E Fanless In-Vehicle Computer

Intel Atom 6413E Processor Fanless In-Vehicle Computer

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VTC1030 Atom Fanless In-Vehicle Computer

Intel Atom x6211E Dual-Core Processor Fanless In-Vehicle Computer

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VTC210 Fanless In-Vehicle Computer with ARM Quad-core Cortex-A53

Fanless In-Vehicle Computer with ARM Quad-core Cortex-A53

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VIP 1000 In-Vehicle Dual HDMI Extender Over IP Full HD 9-36VDC

In-Vehicle Dual HDMI Extender Over IP Full HD 9-36VDC

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VTC1021-BHIoT/CHIoT Atom E3940 Fanless In-Vehicle Computer PoE

VTC 1021-BHIoT/CHIoT Intel Atom x5- E3940 Fanless In-Vehicle Computer w/Hailo AI Edge Telematics Solution, PoE Enabled (CHIoT)

Key Features:

Intel Atom x5-E3940 processor quad core 1.6GHz
Built-in Hailo AI module
Built-in U-blox M8N GPS, optional dead reckoning support
Built-in CAN 2.0B. optional OBD2 SAE J1708/SAE J1939
2 x PoE support, total 60W (VTC 1021-CHIoT only)
2 x RJ45 10/100/1000 Fast Ethernet with LED
3 x DI and 3 x DO support
Smart power management with ignition on/off delay via software control and low voltage protection
Variety of wireless communication options
Certified by CE/FCC/E13 mark

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ATC3540 NVIDIA Jetson Orin NXEdge AI Computer

NVIDIA Jetson Orin NX Solution Accelerated Edge AI Computing

Key Features:

Edge AI in-vehicle/rail computer
Built-in NVIDIA® Jetson Orin™ NX SOM, up to 100 INT8 TOPS compute
4-port GbE PoE+ for IP CAM/LiDAR sensors
HEVC/H.265 hardware CODEC, 18 x 1080p30 compute power (decoded)
Wide range operating temperature of -30~70°C
The rugged, fanless design with an IP67 rating
Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
NEXCOM Acceleration Linux (NAL) OS w/ JetPack 5.1.1 integrated
Expansible for LTE/5G NR & Wi-Fi 5/6
9~36V DC-in with ignition control & OCP/OVP
CE/FCC, UKCA, Emark/EN50155 certified

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Neu-X303mini Edge Computing System 12th Gen CPU

12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

Key Features:

12th Generation Intel Core (Alder Lake - PS) processor SoC
Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
Onboard M.2 2280 Key M with PCIe signal for storage modules
Onboard M.2 2230 Key E for optional Wi-Fi modules
Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
12V DC in

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EMS-TGL Fanless Rugged Embedded System 11th Gen

11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

Key Features:

On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
CE, FCC Class B, IP50
Wide range DC power input from +9~32V
Support HW TPM 2.0
Support vPro

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NUC-APL-SLIM Fanless NUC Slim System J3455/N3350

Intel Apollo Lake J3455/N3350 Up to 8GB DDR3

Key Features:

Onboard Intel Celeron Processor J3455/N3350
Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
Rich I/O, 1 x COM, 2 x HDMI, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
Expansion Slot, M.2 Key-B, M.2 Key-E
Fanless Operating from 0°C ~ 50°C
DC Power Input +12V
Compact Size, 115mm x 111mm x 45mm
Supports VESA/Din-Rail Kit
TPM 2.0 (Factory Option)

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NUC-APL Fanless NUC System J3455/N3350

Intel Apollo Lake Celeron Processor J3455/N3350 Up to 8GB DDR3

Key Features:

Onboard Intel Celeron Processor J3455/N3350
Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
Rich I/O, 2 x COM, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
Triple Display, 2 x HDMI, 1 x DP (DVI-I/VGA Factory Option)
Expansion Slot, M.2 Key-B, M.2 Key-E
Fanless Operating from 0°C ~ 60°C
DC Power Input +12V
Compact Size, 115mm x 111mm x 58mm
Supports VESA/Din-Rail Kit
TPM 2.0 (Factory Option)

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VTC7270-C8 GEN 12/13 Fanless 8 x POE AI Vehicle Computer

12/13th Gen Intel Core CPU 8 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 4 x Serial, 2 x 2.5” SSD, 2 x CAN FD, 9~36VDC/IGN

Key Features:

Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
Rich I/Os, 8 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials
Up to 4 WWAN/WLAN combinations for mobile router Applications
2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
Up to two Hailo AI accelerators (26TOPS workload each) in option
9~36V DC-IN with ignition control & OCP/OVP
Wide range operating temperature of -40°C~65°C (fanless@35W CPU)
Military standard for anti-vibration/shock
CE/FCC, UKCA, Emark Certified

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EPD-2501 Public Information e-Ink Display

Onboard Intel Celeron SoC BGA Processor N3350

Key Features:

25.3” E Ink Black/White/Red/Yellow
25.3” E Ink Gallery Plus Full colour 55K (Typ.)
25.3" E Ink Kaleido with colour 4096
Onboard Intel® Celeron® SoC BGA Processor N3350
DDR3L 1866MTs SO-DIMM up to 8GB,
2.5” SATA3 SSD 64GB
2 x HDMI, 1 x COM, 2 x LAN, 4 x USB 3.1(Gen1)
Front Cover Glass, Optional PMMA, support IP54
Super Slim Bezel Design
E Ink SDK / API support
Optional WiFi Module
Operating Temp 0~40C

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FPC-1736 17" 8th/9th Gen CPU Rugged Multi-touch Panel PC

17" 8th/9th Gen Intel Generation Core Pentium i7/ i5/ i3 Processors Full-falt Rugged Multi-touch Panel PC With Active Cooling and Expansion Slot

Key Features:

Intel LGA1151 Socket Supports 8th /9th refresh Generation Core™ Pentium /i7/ i5/ i3 Processors (Max. TDP at 65W)
2 x Memory Socket, Max. Up to 64GB DDR4 2133/2400/2666 MHz
4 x USB3.0, 1 x USB2.0（Internal for dongle）
3 x RS232, 2 x LAN,1 x HDMI 1.4b, 1 x VGA
1 x Storage, 2.5” Drive Bay, 1 x M.2 SSD
1 x M.2 Key-E for Wi-Fi, Bluetooth
Support 1 x PCIex4 Expansion Slot (option for 2 x PCI slot)
Wide Voltage DC input +12V ~ +24V
Front IP65, Panel Mounting Kits
CE, FCC Class A, CCC

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OFT-15W04 15.6" Open Frame Tablet

15.6" Open Frame Tablet

Key Features:

Intel Celeron Processor J3455
4GB RAM
32GB eMMC
Projective Capacitive Touch
10/100/1000 Ethernet
M.2 B-Key(3042) connector socket
802.11 a/b/g/n/ac Wireless LAN
Windows 10 supported
DC 12~24V Input

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ACS10-TGU 11th Gen Intel Fanless Compact System

Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

Key Features:

11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
Intel Iris Xe/ UHD Graphics Engine
1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
2-COM Port (RS-232/422/485 & RS-232)
2-Audio Jack (Line-Out & Mic-In)
2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
2-Expansion Slot (M.2 Key-E, Key-B)
6-USB Port (3-USB 3.2 & 3-USB 2.0)
CE, FCC Class A, UKCA

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ATC3750-A6CR NVIDIA Jetson AGX Orin Edge AI Computer

NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail

Key Features:

Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8) performance
Designed with rugged, compact and hybrid cooling solutions
6-port GbE PoE+ (X-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (X-coded)
HEVC/H.265 hardware DECODE up to 7 x 4K30 performance
Wide range operating temperature of -20°C~70°C
Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
24V DC-IN for rail, ignition control & OCP/OVP
NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
Military standard of MIL-STD-810H for anti-vibration/shock
CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified

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VTC7270-C4 GEN 12/13 Fanless 4 x POE AI Vehicle Computer

12/13th Gen Intel Core CPU 4 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 4 x Serial, 2 x 2.5” SSD, 2 x CAN FD, 9~36VDC/IGN

Key Features:

Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
Rich I/Os, 4 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials
Up to 4 WWAN/WLAN combinations for mobile router Applications
2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
Up to two Hailo AI accelerators (26TOPS workload each) in option
9~36V DC-IN with ignition control & OCP/OVP
Wide range operating temperature of -40°C~65°C (fanless@35W CPU)
Military standard for anti-vibration/shock
CE/FCC, UKCA, Emark Certified

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VTC7270 Fanless AI Powered Vehicle Computer

12/13th Gen Intel Core CPU 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE

Key Features:

Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
Rich I/Os, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE (option)
2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
Up to 4 WWAN/WLAN combinations for mobile router applications
Up to two Hailo AI accelerator (26TOPS workload each) computing power in option
9~36V DC-IN with ignition control & OCP/OVP
Wide range operating temperature of -40°C~70°C (fanless@35W CPU)
Military standard for anti-vibration/shock
CE/FCC, UKCA, Emark Certified

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VTC7260-x Fanless AI-Aided Vehicle Computer

Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

Key Features:

Intel 11th Gen Tiger Lake UP3, cost-efficient performance
Compact, rugged and fanless design
Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
Triple display, VGA, HDMI and DP for multi video-out
9~36V DC-IN with ignition control & OCP/OVP
Wide range operating temperature of -30°C~65°C (15W TDP)
Military standard of anti-vibration/shock for OHV applications
CE/FCC, UKCA, Emark Certified

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ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer

NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail

Key Features:

Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
Designed with rugged, compact and the hybrid thermal solutions
6-port GbE PoE+ (x-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (x-coded)
HEVC/H.265 hardware DECODE@ 6 x 4K30 performance
Wide range operating temperature of -30°C~70°C
Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
24V DC-IN for rail, ignition control & OCP/OVP
NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
Military standard of MIL-STD-810H for anti-vibration/shock
CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified