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1-24 of 69 Items

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  1. NUC-APL-SLIM Fanless NUC Slim System J3455/N3350
    NUC-APL-SLIM Fanless NUC Slim System J3455/N3350

    Intel Apollo Lake J3455/N3350 Up to 8GB DDR3

    Key Features:

    • Onboard Intel Celeron Processor J3455/N3350
    • Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
    • Rich I/O, 1 x COM, 2 x HDMI, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
    • Expansion Slot,  M.2 Key-B,  M.2 Key-E
    • Fanless Operating from 0°C ~ 50°C
    • DC Power Input +12V
    • Compact Size, 115mm x 111mm x 45mm
    • Supports VESA/Din-Rail Kit
    • TPM 2.0 (Factory Option)
  2. GOT317B-ADL-TRD 17" Fanless Touch Panel PC 13th/12th Gen
    GOT317B-ADL-TRD 17" Fanless Touch Panel PC 13th/12th Gen

    17" SXGA Fanless Touch Panel Computer with LGA1700 Socket 13th/12th Gen Intel® Core™ i7/i5/i3 or Pentium® Processor

    Key Features:

    • 17” SXGA LCD with 350 nits of brightness
    • 5-wire resistive touch
    • Supports one 2.5” SATA HDD/SSD
    • Flat front panel touch screen with rugged IP65 front bezel
    • Fanless design
    • Supports WLAN module and antenna (optional)
    • Supports 4 USB and 2COM ports
    • TPM 2.0 onboard
    • Swappable HDD Tray
    • Supports panel mount, VESA mount, desktop stand, and wall mount
  3. Neu-X102-N97 Edge Computing System Powered by Intel N97
    Neu-X102-N97 Edge Computing System Powered by Intel N97

    Edge Computing System Powered by Intel® Processor N97 (Alder Lake-N)

    Key Features: 

    • Intel® processors N97 (Alder Lake-N), Intel 7 process
    • Slim compact chassis and fanless design
    • 1 x DDR4 SO-DIMM socket, max up to 16GB
    • Support 2 x HDMI 1.4b output, 4K@30Hz
    • TPM 2.0 onboard design for security
    • Richful I/O connectivity: 2 x 2.5GbE LAN, 4 x USB 3.2 Gen2
    • 1 x M.2 2242 Key M for supporting PCIe & SATA storage device
    • 1 x mini-PCIe slot supports Wi-Fi and LTE module
    • Support power input 12 VDC
  4. AIE100-ONA Fanless Edge AI System with NVIDIA Jetson Orin Nano SoM
    AIE100-ONA Fanless Edge AI System with NVIDIA Jetson Orin Nano SoM

    Axiomtek AIE100-ONA Fanless NVIDIA® Jetson Orin™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB, Allxon Remote Management

    Key Features:

    • NVIDIA® Jetson Orin™ Nano, up to 1024-core NVIDIA Ampere GPU
    • High AI computing performance for GPU-accelerated processing
    • Ideal for edge AI smart city applications
    • Supports one 15W GbE PoE for camera
    • Wide operating temperature from -20°C to +50°C
    • JetPack supported
    • Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
  5. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  6. MTS952P & MTS952P-I SATA III M.2 SSDs
    MTS952P & MTS952P-I SATA III M.2 SSDs

    SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C

    Key Features:

    • Dynamic thermal throttling
    • Built-in LDPC ECC (Error Correction Code) functionality
    • Advanced Garbage Collection
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
    • NCQ command for better performance
    • Power-saving DevSleep (Device Sleep) mode
    • Compliant with RoHS 2.0 standards
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • DDR3 DRAM Cache embedded
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
    • Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
    • Supports Transcend Scope Pro software
  7. Neu-X102-N50 Fanless Edge Computing System Powered by Intel N50
    Neu-X102-N50 Fanless Edge Computing System Powered by Intel N50

    Powered by Intel Processor N50 (Alder Lake-N), slim compact chassis and fanless design

    Key Features:

    • Intel processors N50 (Alder Lake-N), Intel 7 process
    • Slim compact chassis and fanless design
    • 1 x DDR4 SO-DIMM socket, max up to 16GB
    • Support 2 x HDMI 1.4b output, 4K@30Hz
    • TPM 2.0 onboard design for security
    • Richful I/O connectivity: 2 x 2.5GbE LAN, 4 x USB 3.2 Gen2
    • 1 x M.2 2242 Key M for supporting PCIe & SATA storage device
    • 1 x mini-PCIe slot supports Wi-Fi and LTE module
    • Support power input 12 VDC
  8. USD240I microSD Cards
    USD240I microSD Cards

    112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card

    Key Features:

    • Built-in LDPC ECC (Error Correction Code) functionality
    • Early Move
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • Wear-Levelling
    • Compliant with RoHS 2.0 standards
    • Electrostatic protection (ESD IEC 61000-4-2)
    • Compliant with SD specification 6.1
    • Compliant with UHS-I
    • Compliant with Video Speed Class 30 (V30)
    • Compliant with Application Performance Class 2 (A2)
    • Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
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Tekdis offers custom built solutions for your application

Tell us what you need