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  22. Transcend 54 items
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49-72 of 257 Items

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  1. Transcend 470K 2.5" SATA SSDs
    Transcend 470K 2.5" SATA SSDs

    128GB/256GB/512GB/1TB/2TB/4TB 2.5" SATA SSDs SATA III 6Gb/s 3D NAND DRAM

    Hardware Features:

    • Compliant with RoHS 2.0 standards
    • DDR3 DRAM Cache embedded
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
    • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
    • Supports Transcend Scope Pro software
  2. LP[G]AM-BC3G-26 Compact Low Profile MiMo 2G/3G/4G Antenna
    LP[G]AM-BC3G-26 Compact Low Profile MiMo 2G/3G/4G Antenna

    2x2 698-960/1710-3800MHz, 1562-1612 26dB LNA, 3x 3m RG174 SMA Plug (m)

    Key Features:

    • Compact low-profile MiMo LTE antenna,
    • High performance in a distinctive design,
    • Optional GNSS version available
    • Covers all 2G/3G/4G/5G LTE cellular bands,
    • Weatherproof design,
    • Single-hole mount with a small footprint
    • Provides MiMo LTE capability in a compact antenna,
    • Easy to install with integrated cables,
    • Can perform on or off a conductive surface
  3. eBOX671B Fanless Embedded System with 13th/12th Gen
    eBOX671B Fanless Embedded System with 13th/12th Gen

    eBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2

    Key Features:

    • 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
    • processors with Intel R680E chipset (Alder Lake S)
    • Dual DDR5 SO-DIMM for up to 64GB of memory
    • 4 LAN with optional PoE supported
    • Dual 2.5" SATA HDD drive bays with RAID 0 & 1
    • Supports MXM 3.1 Type A, up to 5 display outputs
    • -40 °C to +65 °C wide operating temperatures
    • Wide range power input from 9 to 36 VDC
    • Flexible I/O window supported via mPCIe modules
  4. MTE672A PCIe M.2 SSD
    MTE672A PCIe M.2 SSD

    PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Compliant with NVM Express specification 1.3
    • Compliant with PCI Express specification 3.1
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • PCIe Gen 3 x4 interface
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Anti-sulfur technology implemented to prevent sulfurization in the environment
    • Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
    • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
  5. SSD470A 2.5" SATA SSDs
    SSD470A 2.5" SATA SSDs

    2.5" SSD SATA III 6Gb/s interface and 112-layer 3D NAND flash

    Key Features:

    • Compliant with RoHS 2.0 standards
    • DDR3 DRAM Cache embedded
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Anti-sulfur technology implemented to prevent sulfurization in the environment
    • Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
    • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
  6. MSM362M & MSM362I mSATA mini SSD
    MSM362M & MSM362I mSATA mini SSD

    16/32/64/128GB mSATA mini SSD

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Compliant with JEDEC MO-300B
    • MLC NAND flash
    • Supports Transcend Scope Pro software
    • Promised operational reliability in a wide temperature range (from -40° to 85°C)
    • Built-in BCH ECC (Error Correction Code) functionality
    • Advanced Global Wear-Leveling and Block management for reliability
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
  7. AIE110-XNX Edge AI Developer Kit NVIDIA® Jetson Xavier™
    AIE110-XNX Edge AI Developer Kit NVIDIA® Jetson Xavier™

    AIE110-XNX Edge AI Developer Kit NVIDIA® Jetson Xavier™ 1 x GbE LAN 1 x GbE PoE

    Key Features:

    • NVIDIA® Jetson Xavier™ NX, 384-core NVIDIA Volta™ GPU
    • 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE
    • Supports one 15W GbE PoE for camera
    • 1 M.2 M-Key NVMe SSD slot and 1 Micro SD slot
    • 1 PCI Express Mini Card for Wi-Fi/Bluetooth/LTE/GPS
    • JetPack supported
    • Supports 24/7 secure remote monitoring, control, and OTA
      deployment empowered by Allxon
  8. UST500-517-FL Fanless Embedded System 7th/6th Gen
    UST500-517-FL Fanless Embedded System 7th/6th Gen

    Fanless Embedded System with 7th/6th Gen Intel Core, Pentium and Celeron Processor

    Key Features:

    • CE, FCC, E-Mark, EN 50155 and EN 45545-2 certified
    • LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 65W) with Intel® Q170 (Kaby Lake/Skylake)
    • Fanless and Wide operating temperatures from -40°C to +70°C
    • Flexible LAN selection, up to 16 RJ-45 GbE PoE LAN ports
    • 24 VDC power input
    • Intelligent solution of vehicle power management (ACC ignition)
    • Convenient and Accessible Storage, two/four 2.5” SATA drive, 1 mSATA
  9. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
  10. ICO120-E3350 DIN-rail Fanless Embedded System Celeron N3350
    ICO120-E3350 DIN-rail Fanless Embedded System Celeron N3350

    DIN-rail Fanless Embedded System with Intel Celeron Processor N3350, COM/CAN/DIO, 2 LAN, 2 USB, and HDMI

    Key Features:

    • Extreme cost-effective with fanless and cableless design
    • Intel Celeron processor N3350, reliable F1 stepping version CPU
    • COM/CAN/DIO, 2 USB, and 2 GbE LAN
    • Wide operating temperature range from -40°C to +70°C
    • 9 to 36 VDC wide range power input (typical: 12-24 VDC)
    • OVP, UVP, OCP, RPP power protection design
    • eAPI for intelligent remote monitoring software integration
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Tekdis offers custom built solutions for your application

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Tekdis offers custom built solutions for your application

Tell us what you need