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DMM4-6-60 4x4 MiMo 4G/5G Desk Mount Antenna
The DMM4 antenna provides a long-term solution for Cat 18/20 4G and 5G devices.
Key Features:
- 4G/5G CAT18/20 LTE ready with fallback to 2G/3G
- Desk, window and wall-mountable design
- Lightweight portable plug-and-play solution
- 4G/5G CAT18/20 LTE Ready
- 4x4 MiMo
- Up to 5dBi peak gain
- Multiple mounting options
- Integrated coax with connector terminations
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CFX602 & CFX602I CFast Cards
Transcend CFast 2.0 CFX602 Memory Cards boast high data transfer rates and extra large storage capacity, perfect for serving as bootable disks.
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CF180 & CF180I CompactFlash Cards
Transcend's SLC Mode CF180 CompactFlash cards are perfect for embedded systems, medical instruments, road surveillance systems, and other industrial applications having high performance and capacity demands.
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SSD460K & SSD460K-I 2.5" DRAM-less SSD
2.5" DRAM-less SSD SSD460K features the SATA III 6Gb/s interface and state-of-the-art 3D NAND technology
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HSD470T Half-Slim SSDs
SATA III 6Gb/s interface, a powerful controller, and state-of-the-art 112-layer 3D NAND flash
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MTE662A PCIe M.2 SSD
PCI Express (PCIe) Gen 3 x4 interface and compatible with NVM Express (NVMe), 3D NAND technology
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SATA III M.2 SSDs MTS560T & MTS560T-I
M.2 DRAM-less SSD MTS560T SATA III 6Gb/s interface 3D NAND technology
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VTC1030 Atom Fanless In-Vehicle Computer
Intel Atom x6211E Dual-Core Processor Fanless In-Vehicle Computer
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VTC210 Fanless In-Vehicle Computer with ARM Quad-core Cortex-A53
Fanless In-Vehicle Computer with ARM Quad-core Cortex-A53
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LGMM-EXT-R-SLT Thick or Ribbed Panel Adapter for LGMM/LPMM
Thick or Ribbed Panel Adapter for the LGMM/LPMM low profile MIMO antenna series
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VIP 1000 In-Vehicle Dual HDMI Extender Over IP Full HD 9-36VDC
In-Vehicle Dual HDMI Extender Over IP Full HD 9-36VDC
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VTC1021-BHIoT/CHIoT Atom E3940 Fanless In-Vehicle Computer PoE
VTC 1021-BHIoT/CHIoT Intel Atom x5- E3940 Fanless In-Vehicle Computer w/Hailo AI Edge Telematics Solution, PoE Enabled (CHIoT)
Key Features:
- Intel Atom x5-E3940 processor quad core 1.6GHz
- Built-in Hailo AI module
- Built-in U-blox M8N GPS, optional dead reckoning support
- Built-in CAN 2.0B. optional OBD2 SAE J1708/SAE J1939
- 2 x PoE support, total 60W (VTC 1021-CHIoT only)
- 2 x RJ45 10/100/1000 Fast Ethernet with LED
- 3 x DI and 3 x DO support
- Smart power management with ignition on/off delay via software control and low voltage protection
- Variety of wireless communication options
- Certified by CE/FCC/E13 mark
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ATC3750-IP7-WI8MR NVIDIA Jetson AGX Orin Edge AI Computer
NVIDIA Jetson AGX Orin Edge AI Computer for Rail
Key Features:
- Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8)
- Designed to be IP67-rated, rugged, and compact
- 8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR
- HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
- Wide range operating temperature of -25°C~70°C
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
- 24~110VDC w/ isolation, ignition control & OCP/OVP
- NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
- Military standard of MIL-STD-810H for anti-vibration/shock
- CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT3), EN45545-2 certified
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eBOX671A Fanless Embedded System with LGA1200 Socket 11th/10th Gen
With LGA1200 Socket 11th/10th Gen Intel Xeon, Core i9/i7/i5/i3 or Celeron Processor, Intel W480E, 2 HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 48 VDC
Key Features:
- LGA1200 11th/10th gen Intel® Xeon®, Core™ i9/i7/i5/i3 or Celeron® with Intel® W480E chipset (Comet Lake-S)
- 4 GbE LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- 2 HDMI and 1 DisplayPort for triple-view
- -40°C to +70°C wide range operation temperature
- Wide range power input from 9 to 48 VDC
- Flexible I/O window supported via mPCIe modules
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MTS970P SATA III M.2 PLP SSD
Transcend's MTS970P M.2 SSD combines Power Loss Protection (PLP) with a SATA III 6Gb/s interface, 3D NAND technology at 112 layers, and various durability features for enhanced storage efficiency and reliability in mission-critical applications.
Key Features:
- Compliant with RoHS 2.0 standards
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)