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IMBA-Q470 ATX Motherboard LGA1200 10th Gen Core/Cele/Pent
ATX motherboard LGA1200 Intel 10th Generation Core i9/i7/i5/i3, Celeron and Pentium processor, DDR4, triple independent displays, dual 2.5GbE LAN, M.2, USB 3.2, SATA 6Gb/s, HD Audio and RoHS
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VTC7270 Fanless AI Powered Vehicle Computer
12/13th Gen Intel Core CPU 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE
Key Features:
- Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
- Rich I/Os, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE (option)
- 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
- Up to 4 WWAN/WLAN combinations for mobile router applications
- Up to two Hailo AI accelerator (26TOPS workload each) computing power in option
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -40°C~70°C (fanless@35W CPU)
- Military standard for anti-vibration/shock
- CE/FCC, UKCA, Emark Certified
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VTC7260-x Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~65°C (15W TDP)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer
NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail
Key Features:
- Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
- Designed with rugged, compact and the hybrid thermal solutions
- 6-port GbE PoE+ (x-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (x-coded)
- HEVC/H.265 hardware DECODE@ 6 x 4K30 performance
- Wide range operating temperature of -30°C~70°C
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
- 24V DC-IN for rail, ignition control & OCP/OVP
- NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
- Military standard of MIL-STD-810H for anti-vibration/shock
- CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
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XPPC10-200 10.1” TFT WXGA Multi-Touch Panel PC
15.6” TFT FHD 16:9 Slim Bezel, Multi Touchscreen Computer Powered by 11th Generation Intel Core Processor
Key Features:
- 10.1” TFT WXGA 16:10 panel
- 10 points P-Cap multi-touch with slim bezel design
- IP65 protection on the front
- Support: VESA/panel/openframe mount
- 11th Generation Intel Tiger Lake-UP3 Core processor SoC
- 1 x DDR4 SO-DIMM up to 32G
- M.2 2280 Key M (PCIe x4) for storage device
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Support power input 12 VDC
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DRPC-230-ULT5 Fanless DIN-Rail Embedded System
Fanless embedded system, Intel Whiskey Lake i5-8365UE 1.6GHz (quad core, TDP 15W), 8GB DDR4 pre-installed memory, HDMI/DP, 3 PCIe GbE, 6 COM, 12~24V DC, PCIex4 extension layer and RoHS
Key Features:
- Whiskey Lake Core i5-8365UE
- Triple GbE LAN Ports
- Multiple USB 3.2 Gen 2 (10Gb/s)
- Multiple COM Ports
- Modulized Flexible Expansion
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VTC7260-5GCIoT/7GCIoT Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU, 4 x 2.5GbE + 1 x GbE, 1 x USB 2.0,
3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGNKey Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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VTC7260-5HCIoT/7HCIoT Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU, 4 x PoE + 1 x GbE, 1 x USB 2.0, 3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGN
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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VTC7260-5HBIoT/7HBIoT Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU 9~36V DC-IN with ignition control
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~65°C (15W TDP)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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PPC-FW15C-Q370 15.6" Panel PCEnd of Life
15.6" 400cd/m² 1366 x 768 AI modular Panel PC, 8th Generation LGA 1151 Intel® Core™ i7/i5/i3 and Pentium® processor, TDP 35W, two PCIe x4 and two PCIe x8 slots, four HDD bays, 250W PSU
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NISE-70 Celeron/Core Fanless System
Intel Celeron 6305E Processor Dual Core Fanless System
Key Features:
- Onboard Intel Celeron 6305E Processor
- 4 x HDMI
- 3 x USB 3.0, 1 x USB 2.0
- 1 x RS232/422/485, 1 x RS232
- 3 x GbE LAN ports; support WoL, teaming and PXE
- Onboard TPM 2.0 chip
- 1 x M.2 socket for storage/4G LTE/5G modules
- 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
- Support operating temperature from-5 to 55 Celsius degree
- Support+12V to 24VDC input; support ATX power mode
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PPC-F15C-Q370 15" Panel PCEnd of Life
15" 450cd/m² 1024 x768 AI modular Panel PC , LGA 1151 Intel® Core™ i7/i5/i3 and Pentium, TDP 35W, two PCIe x4 and two PCIe x8 slots, four HDD bays, 250W PSU
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AFL3-W19C-ULT5 PoE Panel PC
Wide 18.5”250 cd/m² 1366x768 Panel PC with Intel® 14nm 8th Whiskey Lake Core™ i5-8365UE (15W) on-board Processor (ULT) , POE option , 802.11a/b/g/n/ac WiFi module, PCAP touch, 2M camera, microphone,1*4GB DDR4 RAM , with AG, R10
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NDiS-B561 12th Gen Fanless Edge PC PoE Option
Visual Edge PC 12th Gen Core Processor -20~60°C 1 x HDMI 2.1 2 x HDMI 2.0 8 x USB 3.2 4 x COM
Key Features:
- Support 12th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
- Intel Q670E
- Intel integrated UHD graphic engine driven by Xe architecture
- Support 3 independent 4K2K@60Hz display outputs. HDMI 2.1 resolution can be up to 8K@60Hz
- 1 x HDMI 2.1, 2 x HDMI 2.0
- 8 x USB 3.2, 4 x COM,
- 1 x GbE LAN, 2 x 2.5G GbE LAN (PoE for B561-PoE)
- Support M.2 Key B/E/M
- Support extended temperature -20~60°C (B561 only)
- Fanless design
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TANK-880-Q370 High-Performance 8th/9th Gen PC
Ruggedized Fanless embedded system with Intel® i7-9700TE 1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS
Key Features:
- 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
- Dual independent displays with high-resolution support
- Rich high-speed I/O interfaces
- On-board internal power connector for providing power to add-on cards
- Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
- Great flexibility for hardware expansion
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VTC7260-xC4 Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0&2 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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NDiS-V1100 Fanless Embedded Computer 11th Gen
Fanless Embedded Computer Powered by 11th Gen Intel Core Processor
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AIEdge-X500 Industrial AI Computer 8th/9th Gen - Optional NVIDIA Graphics
Industrial AI Computer Powered by 8th/9th Gen Intel Core Processor, with Large Storage and Optional NVIDIA Graphics Card
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XPPC16-200 15.6” TFT FHD Multi-Touch Panel PC
15.6” TFT FHD 16:9 Slim Bezel, IP65 Front, Multi-touch Computer Powered by 11th Generation Intel Core Processor
Key Features:
- 15.6” TFT FHD 16:9 panel
- 10 Points P-Cap multi-touch with a slim bezel design
- IP65 protection on the front
- VESA/Panel/Openframe Mount
- 11th Generation Intel® Tiger Lake-UP3 Core™ processor SoC
- 1 x 260-pin DDR4 SO-DIMM up to 32G
- Onboard M.2 2280 Key M with PCIe x4 signal for storage module
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Support power input 12 VDC
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WAFER-ULT3 3.5” SBC 6th Gen i7/i5/i3/Celeron
3.5” SBC supports Intel® 6th Generation ULT Processor with DDR4 SO-DIMM/On-board Memory Support