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  1. Yes 8 items
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  1. 0 to 499 cd/m2 1 item
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  1. Hailo 1 item
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  1. Panel Mount 1 item
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  1. Projected Capacitive 1 item
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  1. 2-3 17 items
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17 Items

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  1. BQ611 High-end Fat-Client with Desktop CPU
    BQ611 High-end Fat-Client with Desktop CPU

    Rocket Lake-S High-end Fat Client with Desktop CPU

    View Product
  2. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
    View Product
  3. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
    View Product
  4. XPPC 24-200A 23.8” Fanless Panel PC IP65 Front 11th Gen CPU
    XPPC 24-200A 23.8” Fanless Panel PC IP65 Front 11th Gen CPU

    23.8” TFT FHD 16:9 Slim Bezel, Multi-touch screen Powered by 11th Generation Intel Core Processor

    Key Features:

    • 23.8” TFT FHD 16:9 panel
    • PCAP 10-point multi-touch with slim bezel design
    • IP65-rated front panel
    • Support: VESA/panel/open frame mount
    • 11th Gen Intel® CoreTM processor (Tiger Lake UP3)
    • 1 x 260-pin DDR4 SO-DIMM up to 32G
    • On-board M.2 2280 Key M PCIe x4 for storage module
    • Support power input 12 VDC
    View Product
  5. PCIE-Q470 Full-size PICMG 1.3 10th/11th Gen CPU
    PCIE-Q470 Full-size PICMG 1.3 10th/11th Gen CPU

    Full-size PICMG 1.3 CPU Card i9/i7/i5/i3Pent/Celeron, DDR4, HDMI, Dual 2.5GbE, USB 3.2, SATA 6Gb/s, M.2, IAUDIO and RoHS

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  6. HPCIE-Q470 Half-size PICMG 10th/11th Gen CPU
    HPCIE-Q470 Half-size PICMG 10th/11th Gen CPU

    Half-size PICMG 1.3 CPU Card LGA1200 10th/11th Gen Intel Core i9/i7/i5/i3/Pentium/Celeron with Intel Q470/Q470E, DDR4 SO-DIMM, HDMI, Dual Intel 2.5GbE, USB 3.2 Gen 2, SATA 6Gb/s, M.2, IAUDIO, and RoHS

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  7. IMBA-Q471 ATX Motherboard LGA1200 Intel 10th Gen Core/Cele/Pent
    IMBA-Q471 ATX Motherboard LGA1200 Intel 10th Gen Core/Cele/Pent

    ATX industrial motherboard supporting 10th/11th Intel Core i9/i7/i5/i3, Celeron, Pentium processors

    View Product
  8. IMBA-Q470 ATX Motherboard LGA1200 10th Gen Core/Cele/Pent
    IMBA-Q470 ATX Motherboard LGA1200 10th Gen Core/Cele/Pent

    ATX motherboard LGA1200 Intel 10th Generation Core i9/i7/i5/i3, Celeron and Pentium processor, DDR4, triple independent displays, dual 2.5GbE LAN, M.2, USB 3.2, SATA 6Gb/s, HD Audio and RoHS

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  9. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
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  10. VTC7260-x Fanless AI-Aided Vehicle Computer
    VTC7260-x Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~65°C (15W TDP)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
    View Product
  11. VTC7260-5HBIoT/7HBIoT Fanless AI-Aided Vehicle Computer
    VTC7260-5HBIoT/7HBIoT Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU 9~36V DC-IN with ignition control

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~65°C (15W TDP)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
    View Product
  12. NISE-70 Celeron/Core Fanless System
    NISE-70 Celeron/Core Fanless System

    Intel Celeron 6305E Processor Dual Core Fanless System

    Key Features:

    • Onboard Intel Celeron 6305E Processor
    • 4 x HDMI
    • 3 x USB 3.0, 1 x USB 2.0
    • 1 x RS232/422/485, 1 x RS232
    • 3 x GbE LAN ports; support WoL, teaming and PXE
    • Onboard TPM 2.0 chip
    • 1 x M.2 socket for storage/4G LTE/5G modules
    • 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
    • Support operating temperature from-5 to 55 Celsius degree
    • Support+12V to 24VDC input; support ATX power mode
    View Product
  13. VTC7260-xC4 Fanless AI-Aided Vehicle Computer
    VTC7260-xC4 Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0&2 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
    View Product
  14. DSP511 4K Signage Player with 11th Gen i5/i3/Celeron
    DSP511 4K Signage Player with 11th Gen i5/i3/Celeron

    DSP511 Digital Signage Player with 11th Gen Intel® Core™ i5/i & Celeron® Processor, 4 HDMI, 4 USB and 2.5G LAN

    Key Features:

    • 11th gen Intel® Core™ i5/i3 & Celeron® processor (Tiger Lake)
    • 2 DDR4-3200 SO-DIMM for up to 64GB
    • 4 HDMI 2.0 w/4K supported
    • 4 USB, 1 2.5G LAN and 1 GbE LAN
    • 1 M.2 Key E 2230 for Wi-Fi/BT
    • 1 M.2 Key B 3052 for 5G/4G LTE
    • 1 M.2 Key M 2280 for storage
    View Product
  15. NDiS-V1100 Fanless Embedded Computer 11th Gen
    NDiS-V1100 Fanless Embedded Computer 11th Gen

    Fanless Embedded Computer Powered by 11th Gen Intel Core Processor

    View Product
  16. IPC964-525 4-slot 8/9th Gen, NVIDIA GPU, up to 125W
    IPC964-525 4-slot 8/9th Gen, NVIDIA GPU, up to 125W

    Fanless 4 Slot, 8th/9th Gen supporting NVIDIA® GPU card, up to 125W

    View Product
  17. NDiS-B360 11th Gen Core Slim Wide Temp Embedded Computer
    NDiS-B360 11th Gen Core Slim Wide Temp Embedded Computer

    11th Gen Core Wide Temp -20~60°C embedded PC

    Key Features:

    • 11th Generation Intel Tiger Lake-UP3 Core processor SoC
    • Dual 4K@60Hz display output, DP++, HDMI 2.0
    • Support 4K@60Hz eDP display output
    • Compact and slim design (H: 36mm)
    • Dual LAN ports and USB3.0 ports for easy connection
    • On-board M.2 Key M 2280 with PCIex4/SATA signal for storage module
    • On-board M.2 Key E 2230 for optional WiFi modules
    View Product
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  1. Yes 2 items
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  1. Light Duty 1 item
  2. Heavy Duty 1 item
Fanless
  1. Yes 8 items
Brightness
  1. 0 to 499 cd/m2 1 item
PCIe Expansion
  1. 1 3 items
  2. 2-3 3 items
  3. 6-8 1 item
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  1. Hailo 1 item
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  1. Panel Mount 1 item
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  3. Open Frame Kit 1 item
Touchscreen Technology
  1. Projected Capacitive 1 item
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  1. IP65 Front 1 item
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  1. <50°C 2 items
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  3. +60°C 8 items
  4. +70°C 1 item
Memory
  1. Up to 2GB 11 items
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  4. Up to 16GB 13 items
  5. Up to 32GB 13 items
  6. Up to 64GB 12 items
  7. Up to 128GB 3 items
LAN Ports
  1. 2-3 17 items
  2. 1 2 items
  3. 4-5 2 items
  4. 6-8 1 item
POE Ports
  1. 4-5 1 item
Screen Ratio
  1. 16:9 1 item
Operating System
  1. Windows 3 items
  2. Linux 3 items
Board Type
  1. PICMG 2 items
  2. ATX 2 items
brand
  1. Avalue Technology Inc 2 items
  2. Axiomtek 3 items
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  1. 23.6-24" 1 item
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  3. 11th 17 items
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  8. 6th 10 items
DIN-Mountable
  1. Yes 2 items
Application
  1. Light Duty 1 item
  2. Heavy Duty 1 item
Fanless
  1. Yes 8 items
Brightness
  1. 0 to 499 cd/m2 1 item
PCIe Expansion
  1. 1 3 items
  2. 2-3 3 items
  3. 6-8 1 item
AI Enabled
  1. Hailo 1 item
Mounting
  1. Panel Mount 1 item
  2. VESA Mount 1 item
  3. Open Frame Kit 1 item
Touchscreen Technology
  1. Projected Capacitive 1 item
IP Rating
  1. IP65 Front 1 item
Operating Temp
  1. <50°C 2 items
  2. +50°C 3 items
  3. +60°C 8 items
  4. +70°C 1 item
Memory
  1. Up to 2GB 11 items
  2. Up to 4GB 13 items
  3. Up to 8GB 13 items
  4. Up to 16GB 13 items
  5. Up to 32GB 13 items
  6. Up to 64GB 12 items
  7. Up to 128GB 3 items
LAN Ports
  1. 2-3 17 items
  2. 1 2 items
  3. 4-5 2 items
  4. 6-8 1 item
POE Ports
  1. 4-5 1 item
Screen Ratio
  1. 16:9 1 item
Operating System
  1. Windows 3 items
  2. Linux 3 items
Board Type
  1. PICMG 2 items
  2. ATX 2 items
brand
  1. Avalue Technology Inc 2 items
  2. Axiomtek 3 items
  3. Giada Technology Inc. 1 item
  4. IEI Integration Corp. 4 items
  5. Nexcom 7 items

Tekdis offers custom built solutions for your application

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