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Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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97-120 of 223 Items

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  1. NF21 12.2" Rugged Tablet
    NF21 12.2" Rugged Tablet

    12.2" IP65 Rugged Tablet with Intel® Core™ i5/i7 and hot swap battery

    Key Features:

    • 7th Generation Intel® Core™ i5/i7 ™ Processor

    • MIL-STD 810G tested, 4 F't/1.2m drop proof.

    • IP65, one-meter 1000 times tumble test.

    • Hot swap battery, 6000mAh battery pack.

    • Hardware TPM 2.0.

    • Gb ethernet port with PXE support for reliable communication & maintenance.

    • Windows® Hello & optional finger print authentication support for biometric security system

  2. ARCHMI-924BP/R(H) 23.8" 8th Gen. Intel Fanless Industrial Compact Panel PC
    ARCHMI-924BP/R(H) 23.8" 8th Gen. Intel Fanless Industrial Compact Panel PC

    Aplex ARCHMI-924BP/R(H) 23.8" 8th Gen. Intel Fanless Industrial Compact Panel PC IP66 Fanless Touchscreen

    Key Features:

    • 23.8" Industrial Compact Size Panel PC
    • Flat Front Panel Touch Screen with IP66 Front Bezel
    • Fanless Design
    • 8th Gen. Intel Core i3/i5, CPU built-in
    • 1 x 260-pin SO-DIMM DDR4 slot, up to 32GB 2400MHz
    • DC 9~36V Wide-Ranging Power Input
    • Support Expansion via Full-size Mini PCIe and M.2 slots
    • Support TPM2.0 Hardware Security
    • High Brightness 1,000 nits for option

     

    ARCHMI-924BP
    23.8" FHD fanless HMI barebone with Intel 8th Gen. Core i3-8145UE/i5-8365UE, 1 x DDR4 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.

    ARCHMI-924BP(H)
    23.8" High brightness FHD fanless HMI barebone with Intel 8th Gen. Core i3-8145UE/i5-8365UE, 1 x DDR4 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.

  3. ARCHMI-921BP/R(H) 21.5" 8th Gen. Intel Fanless Industrial Compact Panel PC
    ARCHMI-921BP/R(H) 21.5" 8th Gen. Intel Fanless Industrial Compact Panel PC

    Aplex ARCHMI-921BP/R(H) 21.5" 8th Gen. Intel Fanless Industrial Compact Panel PC IP66 Fanless Touchscreen

    Key Features:

    • 21" Industrial Compact Size Panel PC
    • Flat Front Panel Touch Screen with IP66 Front Bezel
    • Fanless Design
    • 8th Gen. Intel Core i3/i5, CPU built-in
    • 1 x 260-pin SO-DIMM DDR4 slot, up to 32GB 2400MHz
    • DC 9~36V Wide-Ranging Power Input
    • Support Expansion via Full-size Mini PCIe and M.2 slots
    • Support TPM2.0 Hardware Security
    • High Brightness 1,000 nits for option

     

    ARCHMI-921BP
    21.5" FHD fanless HMI barebone with Intel 8th Gen. Core i3-8145UE/i5-8365UE, 1 x DDR4 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.

    ARCHMI-921BR
    21.5" FHD fanless HMI barebone with Intel 8th Gen. Core i3-8145UE/i5-8365UE, 1 x DDR4 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.

    ARCHMI-921BP(H)
    21.5" High brightness FHD fanless HMI barebone with Intel 8th Gen. Core i3-8145UE/i5-8365UE, 1 x DDR4 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.

    ARCHMI-921BR(H)
    21.5" High brightness FHD fanless HMI barebone with Intel 8th Gen. Core i3-8145UE/i5-8365UE, 1 x DDR4 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.

  4. ICO520 DIN-Rail Fanless Embedded Computer with 12th Gen
    ICO520 DIN-Rail Fanless Embedded Computer with 12th Gen

    Axiomtek ICO520 DIN-Rail Fanless Embedded-System 12th-Gen Intel®-Core™ 4x2.5GbE, 4xIsolated-COM, Isolated DIO (8-in/8-out)

    Key Features:

    • High performance with fanless and DIN-rail design
    • 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
    • 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
    • Wide operating temperature range from -40°C to +70°C
    • 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
    • Supports TPM 2.0
    • Supports cold boot at -40°C
  5. VTC7260-xC4 Fanless AI-Aided Vehicle Computer
    VTC7260-xC4 Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0&2 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  6. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  7. eBOX671B Fanless Embedded System with 13th/12th Gen
    eBOX671B Fanless Embedded System with 13th/12th Gen

    eBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2

    Key Features:

    • 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
    • processors with Intel R680E chipset (Alder Lake S)
    • Dual DDR5 SO-DIMM for up to 64GB of memory
    • 4 LAN with optional PoE supported
    • Dual 2.5" SATA HDD drive bays with RAID 0 & 1
    • Supports MXM 3.1 Type A, up to 5 display outputs
    • -40 °C to +65 °C wide operating temperatures
    • Wide range power input from 9 to 36 VDC
    • Flexible I/O window supported via mPCIe modules
  8. ATC8110/8110-F i7 Mobile Expandable AI PC
    ATC8110/8110-F i7 Mobile Expandable AI PC

    Intel Coffee Lake S/Refresh + Inference Accelerator AI Powered for Autonomous and Machine Vision

    Key Features:

    • In-vehicle AI recognition and machine vision applications
    • Fanless/fan flexibility design
    • Up to 8-core Intel® Coffee Lake S/Refresh processing power
    • 3 x PCIe 3.0 slots for Discrete Graphics/Inference/Frame Grabber cards
    • Ultra-fast U.2/M.2 NVMe media for high-speed multi-cameras image capture
    • RAID 0/1/5/10 configurable for data secure and integrity
    • Wide-range 9~36VDC input with Ignition management
    • Rich communication ports, 5 x USB 3.1, 2 x GbE and 4 x RS232/422/485
    • Telemetric functionality of WWAN/5G NR, WLAN and GNSS with up to 4 x 4 MIMO and 4 SIM slots
    • Compliant with E-mark, CE/FCC ClassA and MIL-STD-810G for anti-vibration/shock w/ graphics card installed
    • Realize M-2-M through CAT-M (NB-IoT & eMTC)
  9. ATC8010-7  - 8 x POE, T1000 MXM Kit Option
    ATC8010-7 - 8 x POE, T1000 MXM Kit Option

    Intel Core 8th Gen. CPU Powerful Intelligent Platform for ADAS and ANPR/AFR

    Key Features:

    • Intel Core 8th Gen. i7-8700T, 2.4GHz, 6 Core
    • 8 x Independent Intel I210-IT 10/100/1000 PoE 802.3af/at
    • AI accelerator MXM module supported
    • ultraONE+ for 10-Meter video + audio output
    • 2 x External SSD and 2 x mSATA for RAID 0, 1, 5, 10
    • 2 x WWAN module and 3 x SIM socket with eSIM option
    • Fanless design
    • 3 x mini-PCIe and 1 x M.2
    • CE/FCC/E mark
  10. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
  11. eBOX710A Fanless Embedded System 11th/10th Gen
    eBOX710A Fanless Embedded System 11th/10th Gen

    Fanless Embedded System with LGA1200 Socket 11th/10th Gen Intel Core i9/i7/i5/i3 or Celeron Processor, Intel H420E, HDMI, DisplayPort, 6 USB, 4 LAN, PCIe x4 slot, and 9 to 48 VDC

    Key Features:

    • 10th/11th gen Intel Core i9/i7/i5/i3 or Celeron processor up to 65W
    • 4 GbE LAN and 4 COM ports
    • Dual 2.5" SATA HDD drive bays
    • 2 HDMI and 1 DisplayPort with dual view supported
    • -40 °C to +70 °C wide operating temperatures
    • Wide range power input from 9 to 48 VDC
    • 1 PCIe x4 slot for I/O card
    • Flexible I/O window slot for mPCIe modules
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