Find your technical solution below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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SR700-X4D IP65 MXM-GPU Military Computer Xeon E-2276ME w/ GPU
Quadro RTX A2000 GPU with DTL38999 connector, 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz)
Key Features:
- IP65 MXM-GPU MIlitary Computer
- MIL-STD 810 Thermal, shock, vibration, Humidity, EMI
- Quadro® RTX A2000 (CUDA 2560, GDDR6-8GB) ; Options for GTX1050 Ti
- 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz)
- Up to DDR4-64GB, Options for DDR4-128GB
- 9V to 36V DC, Options for MIL-STD-461 18V~36V
- Extended operating temp. -40°C to 60°C
- Dimension : 360 x 230 x 86 mm (WxDxH)
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XPPC10-200 10.1” TFT WXGA Multi-Touch Panel PC
15.6” TFT FHD 16:9 Slim Bezel, Multi Touchscreen Computer Powered by 11th Generation Intel Core Processor
Key Features:
- 10.1” TFT WXGA 16:10 panel
- 10 points P-Cap multi-touch with slim bezel design
- IP65 protection on the front
- Support: VESA/panel/openframe mount
- 11th Generation Intel Tiger Lake-UP3 Core processor SoC
- 1 x DDR4 SO-DIMM up to 32G
- M.2 2280 Key M (PCIe x4) for storage device
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Support power input 12 VDC
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XPPC16-200 15.6” TFT FHD Multi-Touch Panel PC
15.6” TFT FHD 16:9 Slim Bezel, IP65 Front, Multi-touch Computer Powered by 11th Generation Intel Core Processor
Key Features:
- 15.6” TFT FHD 16:9 panel
- 10 Points P-Cap multi-touch with a slim bezel design
- IP65 protection on the front
- VESA/Panel/Openframe Mount
- 11th Generation Intel® Tiger Lake-UP3 Core™ processor SoC
- 1 x 260-pin DDR4 SO-DIMM up to 32G
- Onboard M.2 2280 Key M with PCIe x4 signal for storage module
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Support power input 12 VDC
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XPPC 24-200A 23.8” Fanless Panel PC IP65 Front 11th Gen CPU
23.8” TFT FHD 16:9 Slim Bezel, Multi-touch screen Powered by 11th Generation Intel Core Processor
Key Features:
- 23.8” TFT FHD 16:9 panel
- PCAP 10-point multi-touch with slim bezel design
- IP65-rated front panel
- Support: VESA/panel/open frame mount
- 11th Gen Intel® CoreTM processor (Tiger Lake UP3)
- 1 x 260-pin DDR4 SO-DIMM up to 32G
- On-board M.2 2280 Key M PCIe x4 for storage module
- Support power input 12 VDC
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nROK7271 Fanless Vehicle PC 12/13th Gen CPU
Introducing nROK 7271 (Preliminary): A fanless, rugged rolling stock computer with 12/13th Gen Intel® Core™ CPU, DDR5, 5G/Wi-Fi, and PoE support, designed for industrial computing.
Key Features:
- Powered by 12/13th Gen Intel® Core™ CPU
- Fanless, compact and rugged design
- Designed with DDR5, excellent memory bandwidth, lower latency
- 2 x 2.5” SSD for data integrity (compatible with 15mm disk)
- 5G/Wi-Fi, PoE, 10GbE, daughter board expansion support
- 4 x Independent 10/100/1000/2500 Mbps PoE 802.3af/at, total 60W (nROK 7271-WIC4) / 30W (nROK 7271-WIC4-C8S)
- Additional 8-port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 30W (nROK7271-WIC4-C8S)
- EN 50155, class OT3 conformity
- Wide voltage input 24~110VDC (w/ isolation)
- Optional up to 3-sec protection against temporary voltage dips
- Powered by 12/13th Gen Intel® Core™ CPU
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nROK7270 Fanless Vehicle PC 12/13th Gen CPU
Introducing the nROK 7270: a fanless rolling stock computer with a powerful Intel Core CPU, DDR5 memory, 5G/Wi-Fi, PoE support, and military-standard durability.
Key Features:
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Powered by 12/13th Gen Intel Core CPU
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Fanless, compact and rugged design
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Designed with DDR5, excellent memory bandwidth, lower latency
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2 x 2.5” SSD for data integrity (compatible with 15mm disk)
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5G/Wi-Fi, PoE, 10GbE, daughter board expansion support
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Two video outputs, one VGA and one HDMI
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4 x Independent 10/100/1000/2500 Mbps PoE 802.3 af/at, total 60W (nROK 7270-AC4/nROK 7270-AC4-C8S)
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Additional 8-port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W (nROK 7270-AC4-C8S)
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Military standard for anti-vibration/shock
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EN 50155, class OT3 conformity
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AV600-RH Military IP66 AI Edge GPU Computer
Military IP66 with D38999 connectors VIDIA RTX A1000/A2000, 2048/2560 CUDA
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel 13th Gen. Raptor Lake (H) i7-13800HE/HRE, 14C , 2.5/5.0 GHz Processor
- Up to 64GB DDR5 SO-DIMM, non-ECC and ECC
- NVIDIA RTX A1000/A2000, 2048/2560 CUDA,4GB/8GB GDDR6 RAM
- MIL-STD-461 EMI Filter18V~36V DC-Input
- Extreme Temperature : -40°C to 60°C
- Dimensions : 250(L) x 325 (W) x 100 (H) mm
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Neu-X303mini Edge Computing System 12th Gen CPU
12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
Key Features:
- 12th Generation Intel Core (Alder Lake - PS) processor SoC
- Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
- Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
- Onboard M.2 2280 Key M with PCIe signal for storage modules
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
- 12V DC in
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HID-2334 23.8" Medical Cart Panel PC
23.8” Full HD PCAP Multi touch, 7th Generation Intel® Core Kaby Lake i5 Processor, LED reading light bar
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NDiS-M538 OPS-Based Digital Signage Player 4K2K Resolution 8th Gen
OPS-Based Digital Signage Platform, 4K2K Resolution Embedded Computer Powered by 8th Gen. Intel® Core™ Processor
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NDiS-S538 SDM Embedded Computer Powered by 6th Gen, 4K
Embedded Computer Powered by 6th Gen. Intel® Core™ Processor. Intel® SDM-L Based Digital Signage Platform, Support 4K Resolution
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VTC7270-C8 GEN 12/13 Fanless 8 x POE AI Vehicle Computer
12/13th Gen Intel Core CPU 8 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 4 x Serial, 2 x 2.5” SSD, 2 x CAN FD, 9~36VDC/IGN
Key Features:
- Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
- Rich I/Os, 8 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials
- Up to 4 WWAN/WLAN combinations for mobile router Applications
- 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
- Up to two Hailo AI accelerators (26TOPS workload each) in option
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -40°C~65°C (fanless@35W CPU)
- Military standard for anti-vibration/shock
- CE/FCC, UKCA, Emark Certified
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NISE-70 Celeron/Core Fanless System
Intel Celeron 6305E Processor Dual Core Fanless System
Key Features:
- Onboard Intel Celeron 6305E Processor
- 4 x HDMI
- 3 x USB 3.0, 1 x USB 2.0
- 1 x RS232/422/485, 1 x RS232
- 3 x GbE LAN ports; support WoL, teaming and PXE
- Onboard TPM 2.0 chip
- 1 x M.2 socket for storage/4G LTE/5G modules
- 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
- Support operating temperature from-5 to 55 Celsius degree
- Support+12V to 24VDC input; support ATX power mode
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VTC7270-C4 GEN 12/13 Fanless 4 x POE AI Vehicle Computer
12/13th Gen Intel Core CPU 4 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 4 x Serial, 2 x 2.5” SSD, 2 x CAN FD, 9~36VDC/IGN
Key Features:
- Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
- Rich I/Os, 4 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials
- Up to 4 WWAN/WLAN combinations for mobile router Applications
- 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
- Up to two Hailo AI accelerators (26TOPS workload each) in option
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -40°C~65°C (fanless@35W CPU)
- Military standard for anti-vibration/shock
- CE/FCC, UKCA, Emark Certified
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aROK5510 - EN50155 2U 8/9th Gen CPU Rail Server
Intel Core 8/9th Gen/Xeon CPU with Rich Storage Powerful Platform for AI Application and Storage Server
Key Features:
- Intel Coffee Lake S/Refresh 8th/9th-Gen Core/Xeon LGA1151 socket-type CPU
- 100W power consumption graphics card support
- Eight SIM cards + four WWAN modules support
- LTE/5G WWAN module support
- 6 x External SSD for RAID 0, 1, 5, 10
- PCle 3.0 x4 NVMe 1.3 high-performance SSD support
- EN 50155, class OT4 conformity
- 3 x mini-PCIe + 3 x M.2 socket expansion
- Smart fan design with temperature-based RPMs
- Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+
- Rackmount platform
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VTC7270 Fanless AI Powered Vehicle Computer
12/13th Gen Intel Core CPU 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE
Key Features:
- Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
- Rich I/Os, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE (option)
- 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
- Up to 4 WWAN/WLAN combinations for mobile router applications
- Up to two Hailo AI accelerator (26TOPS workload each) computing power in option
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -40°C~70°C (fanless@35W CPU)
- Military standard for anti-vibration/shock
- CE/FCC, UKCA, Emark Certified
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NDiS-B561 12th Gen Fanless Edge PC PoE Option
Visual Edge PC 12th Gen Core Processor -20~60°C 1 x HDMI 2.1 2 x HDMI 2.0 8 x USB 3.2 4 x COM
Key Features:
- Support 12th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
- Intel Q670E
- Intel integrated UHD graphic engine driven by Xe architecture
- Support 3 independent 4K2K@60Hz display outputs. HDMI 2.1 resolution can be up to 8K@60Hz
- 1 x HDMI 2.1, 2 x HDMI 2.0
- 8 x USB 3.2, 4 x COM,
- 1 x GbE LAN, 2 x 2.5G GbE LAN (PoE for B561-PoE)
- Support M.2 Key B/E/M
- Support extended temperature -20~60°C (B561 only)
- Fanless design
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VTC7260-x Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~65°C (15W TDP)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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VTC7260-5GCIoT/7GCIoT Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU, 4 x 2.5GbE + 1 x GbE, 1 x USB 2.0,
3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGNKey Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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VTC7260-5HCIoT/7HCIoT Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU, 4 x PoE + 1 x GbE, 1 x USB 2.0, 3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGN
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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NDiS-V1100 Fanless Embedded Computer 11th Gen
Fanless Embedded Computer Powered by 11th Gen Intel Core Processor