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1-24 of 123 Items

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  1. VTC7260-xC4 Fanless AI-Aided Vehicle Computer
    VTC7260-xC4 Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0&2 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  2. nROK1030 Atom x6211E Dual-Core Fanless Rolling Stock Computer
    nROK1030 Atom x6211E Dual-Core Fanless Rolling Stock Computer

    Intel Atom x6211E Dual-Core Processor Fanless Rolling Stock Computer

    Key Features:

    • Intel Atom x6211E dual-core processor, 6W
    • Compact and fanless design
    • 5G NR and Wi-Fi 6/6E wireless communication options
    • Built-in GNSS receiver with optional dead reckoning function
    • Built-in 1 x CAN bus 2.0B (optional SAE J1939)
    • Smart power management with ignition on/off delay via software control and low voltage protection
    • Dual display outputs and 2.5GbE LAN ports
    • 1 x mini-PCIe + 2 x M.2 socket expansion
    • Certified by CE, FCC, EN 50155 class OT4
  3. AV600-RH Military IP66 AI Edge GPU Computer
    AV600-RH Military IP66 AI Edge GPU Computer

    Military IP66 with D38999 connectors VIDIA RTX A1000/A2000, 2048/2560 CUDA 

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel 13th Gen. Raptor Lake (H) i7-13800HE/HRE, 14C , 2.5/5.0 GHz Processor
    • Up to 64GB DDR5 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX A1000/A2000, 2048/2560 CUDA,4GB/8GB GDDR6 RAM
    • MIL-STD-461 EMI Filter18V~36V DC-Input 
    • Extreme Temperature : -40°C to 60°C
    • Dimensions : 250(L) x 325 (W) x 100 (H) mm
  4. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  5. D613 Intel 13th Gen with vPro Technology
    D613 Intel 13th Gen with vPro Technology

    Giada D613 Intel 13th Gen vPro 5G Simultaneous 4K

    Key Features:

    • Intel® 13th Gen. Raptor Lake Processors provide high computing performance and efficiency.
    • Giada D613 supports four display outputs, allowing for simultaneous 4K video playback.
    • Intel® vPro Technology offers integrated hardware-based PC protection, including below-the-OS security and advanced threat detection.
    • The D613 is compatible with a 5G cellular network, providing significantly faster speeds, low latency, and increased capacity.
    • The combination of high-performance cores and efficient cores in the processors optimizes power consumption without sacrificing processing power.
  6. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  7. ICO520 DIN-Rail Fanless Embedded Computer with 12th Gen
    ICO520 DIN-Rail Fanless Embedded Computer with 12th Gen

    Axiomtek ICO520 DIN-Rail Fanless Embedded-System 12th-Gen Intel®-Core™ 4x2.5GbE, 4xIsolated-COM, Isolated DIO (8-in/8-out)

    Key Features:

    • High performance with fanless and DIN-rail design
    • 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
    • 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
    • Wide operating temperature range from -40°C to +70°C
    • 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
    • Supports TPM 2.0
    • Supports cold boot at -40°C
  8. VTC7270-C8 GEN 12/13 Fanless 8 x POE AI Vehicle Computer
    VTC7270-C8 GEN 12/13 Fanless 8 x POE AI Vehicle Computer

    12/13th Gen Intel Core CPU 8 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 4 x Serial, 2 x 2.5” SSD, 2 x CAN FD, 9~36VDC/IGN

    Key Features:

    • Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
    • Rich I/Os, 8 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials
    • Up to 4 WWAN/WLAN combinations for mobile router Applications
    • 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
    • Up to two Hailo AI accelerators (26TOPS workload each) in option
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -40°C~65°C (fanless@35W CPU)
    • Military standard for anti-vibration/shock
    • CE/FCC, UKCA, Emark Certified
  9. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  10. ATC3750-A6CR NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-A6CR NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail

    Key Features:

    • Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8) performance
    • Designed with rugged, compact and hybrid cooling solutions
    • 6-port GbE PoE+ (X-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (X-coded)
    • HEVC/H.265 hardware DECODE up to 7 x 4K30 performance
    • Wide range operating temperature of -20°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24V DC-IN for rail, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
  11. VTC7270-C4 GEN 12/13 Fanless 4 x POE AI Vehicle Computer
    VTC7270-C4 GEN 12/13 Fanless 4 x POE AI Vehicle Computer

    12/13th Gen Intel Core CPU 4 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 4 x Serial, 2 x 2.5” SSD, 2 x CAN FD, 9~36VDC/IGN

    Key Features:

    • Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
    • Rich I/Os, 4 x 2.5GbE PoE+, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials
    • Up to 4 WWAN/WLAN combinations for mobile router Applications
    • 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
    • Up to two Hailo AI accelerators (26TOPS workload each) in option
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -40°C~65°C (fanless@35W CPU)
    • Military standard for anti-vibration/shock
    • CE/FCC, UKCA, Emark Certified
  12. VTC7270 Fanless AI Powered Vehicle Computer
    VTC7270 Fanless AI Powered Vehicle Computer

    12/13th Gen Intel Core CPU 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE

    Key Features:

    • Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
    • Rich I/Os, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE (option)
    • 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
    • Up to 4 WWAN/WLAN combinations for mobile router applications
    • Up to two Hailo AI accelerator (26TOPS workload each) computing power in option
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -40°C~70°C (fanless@35W CPU)
    • Military standard for anti-vibration/shock
    • CE/FCC, UKCA, Emark Certified
  13. VTC7260-x Fanless AI-Aided Vehicle Computer
    VTC7260-x Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~65°C (15W TDP)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  14. ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail

    Key Features:

    • Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
    • Designed with rugged, compact and the hybrid thermal solutions
    • 6-port GbE PoE+ (x-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (x-coded)
    • HEVC/H.265 hardware DECODE@ 6 x 4K30 performance
    • Wide range operating temperature of -30°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24V DC-IN for rail, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
  15. UST500-517-FL Fanless Embedded System 7th/6th Gen
    UST500-517-FL Fanless Embedded System 7th/6th Gen

    Fanless Embedded System with 7th/6th Gen Intel Core, Pentium and Celeron Processor

    Key Features:

    • CE, FCC, E-Mark, EN 50155 and EN 45545-2 certified
    • LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 65W) with Intel® Q170 (Kaby Lake/Skylake)
    • Fanless and Wide operating temperatures from -40°C to +70°C
    • Flexible LAN selection, up to 16 RJ-45 GbE PoE LAN ports
    • 24 VDC power input
    • Intelligent solution of vehicle power management (ACC ignition)
    • Convenient and Accessible Storage, two/four 2.5” SATA drive, 1 mSATA
  16. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
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Tekdis offers custom built solutions for your application

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