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19 Items

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  1. Neu-X102-N97 Edge Computing System Powered by Intel N97
    Neu-X102-N97 Edge Computing System Powered by Intel N97

    Edge Computing System Powered by Intel® Processor N97 (Alder Lake-N)

    Key Features: 

    • Intel® processors N97 (Alder Lake-N), Intel 7 process
    • Slim compact chassis and fanless design
    • 1 x DDR4 SO-DIMM socket, max up to 16GB
    • Support 2 x HDMI 1.4b output, 4K@30Hz
    • TPM 2.0 onboard design for security
    • Richful I/O connectivity: 2 x 2.5GbE LAN, 4 x USB 3.2 Gen2
    • 1 x M.2 2242 Key M for supporting PCIe & SATA storage device
    • 1 x mini-PCIe slot supports Wi-Fi and LTE module
    • Support power input 12 VDC
  2. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  3. Neu-X102-N50 Fanless Edge Computing System Powered by Intel N50
    Neu-X102-N50 Fanless Edge Computing System Powered by Intel N50

    Powered by Intel Processor N50 (Alder Lake-N), slim compact chassis and fanless design

    Key Features:

    • Intel processors N50 (Alder Lake-N), Intel 7 process
    • Slim compact chassis and fanless design
    • 1 x DDR4 SO-DIMM socket, max up to 16GB
    • Support 2 x HDMI 1.4b output, 4K@30Hz
    • TPM 2.0 onboard design for security
    • Richful I/O connectivity: 2 x 2.5GbE LAN, 4 x USB 3.2 Gen2
    • 1 x M.2 2242 Key M for supporting PCIe & SATA storage device
    • 1 x mini-PCIe slot supports Wi-Fi and LTE module
    • Support power input 12 VDC
  4. NISE-70 Celeron/Core Fanless System
    NISE-70 Celeron/Core Fanless System

    Intel Celeron 6305E Processor Dual Core Fanless System

    Key Features:

    • Onboard Intel Celeron 6305E Processor
    • 4 x HDMI
    • 3 x USB 3.0, 1 x USB 2.0
    • 1 x RS232/422/485, 1 x RS232
    • 3 x GbE LAN ports; support WoL, teaming and PXE
    • Onboard TPM 2.0 chip
    • 1 x M.2 socket for storage/4G LTE/5G modules
    • 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
    • Support operating temperature from-5 to 55 Celsius degree
    • Support+12V to 24VDC input; support ATX power mode
  5. NDiS-B560 8/9th Gen Fanless Embedded PC
    NDiS-B560 8/9th Gen Fanless Embedded PC

    Wide Temp Fanless Embedded PC - 8th/9th Gen Intel Core - 3 x HDMI

    Key Features:

    • Support 9th and 8th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
    • Intel integrated UHD 630 graphic engine
    • Support 3 x independent 4K2K 60Hz display output
    • 3 x HDMI 2.0, 6 x USB 3.0, 2 x GbE LAN, 4 x COM, 1 x Line-out, 1 x Mic-in
    • Support M.2 Key B/E/M
    • Fanless design
    • Support extended temperature -20~60°C
  6. eBOX560-512-FL Fanless Embedded System
    eBOX560-512-FL Fanless Embedded System

    Fanless Embedded System with Intel Core i5-7300U & Celeron 3965U, 2 HDMI, 2 GbE LANs, 4 USB 3.0 and PCI Express Mini Card Slot

    Key Features:

    • Intel Core i5-7300U 2.6 GHz/i3-7100U 2.4 GHz & Celeron 3965U 2.2 GHz
    • Supports 2 COM, 2 GbE LAN, and 4 USB 3.0
    • One swappable 2.5" HDD drive bay
    • 2 HDMI with dual-view supported
    • AMS.AXView intelligent remote monitoring software for IIoT
    • Ultra-compact enclosure design
    • Trusted Platform Module 1.2 (TPM 1.2)
  7. eBOX560-500-FL Fanless Embedded System
    eBOX560-500-FL Fanless Embedded System

    Fanless Embedded System with Intel® Core™ i7-6600U/i5-6300U/i3-6100U & Celeron® 3955U, 2 HDMI, 2 GbE LANs, 4 USB 3.0, 2 COM and PCI Express Mini Card Slot

    Key Features:

    • Intel Core i7-6600U 3.4 GHz/i5-6300U 3 GHz/i3-6100U 2.3 GHz & Celeron® 3955U 2.0 GHz (Skylake ULT SoC)
    • 260-pin DDR4 SO-DIMM for up to 16GB of memory
    • 12 VDC power input
    • Supports 2 HDMI, 2 GbE LAN, 2 COM, and 4 USB 3.0
    • Supports Jumbo Frame (9.5K), WoL, PXE and Teaming
    • Ultra-compact enclosure design
  8. eBOX570 Fanless Embedded System with 13th Gen
    eBOX570 Fanless Embedded System with 13th Gen

    Fanless Embedded System with 13th Gen Intel Core i7/i5/Celeron Processor, 2 HDMI, 1 DisplayPort++, 2 LANs, 8 USB, 2 COM, and 12 VDC

    Key Features:

    • 13th gen Intel Core processor (Raptor Lake P)
    • Fanless design with operating temperature from -20°C to 60°C
    • 1 DDR4 SO-DIMM for up to 32GB of memory
    • Supports the USB power on/off control function
    • Supports high-speed NVMe storage (M.2 Key M 2280)
    • Supports Intel® vPro and TPM 2.0
  9. IFB122 Robust RISC-based DIN-rail Fanless Embedded System
    IFB122 Robust RISC-based DIN-rail Fanless Embedded System

    Robust RISC-based DIN-rail Fanless Embedded System with i.MX 6UL Processor, 2 COM, 2 LANs and DIO (2-In/1-Out)

    Key Features:

    • RISC-based (i.MX 6UltraLite) processor 528 MHz

    • 256MB DDR3 SDRAM onboard

    • 8GB eMMC flash onboard

    • 1 PCI Express Mini Card slot (Wi-Fi or 3G/4G)

    • 2 digital inputs and 1 digital output

    • Power input range of 9V to 48V DC with terminal block

    • Embedded Linux operating system (Yocto)

    • Fanless and compact design

    • Wide operating temperature range from -40°C to +70°C

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Tekdis offers custom built solutions for your application

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