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25-48 of 150 Items

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  1. Neu-X102-N97 Edge Computing System Powered by Intel N97
    Neu-X102-N97 Edge Computing System Powered by Intel N97

    Edge Computing System Powered by Intel® Processor N97 (Alder Lake-N)

    Key Features: 

    • Intel® processors N97 (Alder Lake-N), Intel 7 process
    • Slim compact chassis and fanless design
    • 1 x DDR4 SO-DIMM socket, max up to 16GB
    • Support 2 x HDMI 1.4b output, 4K@30Hz
    • TPM 2.0 onboard design for security
    • Richful I/O connectivity: 2 x 2.5GbE LAN, 4 x USB 3.2 Gen2
    • 1 x M.2 2242 Key M for supporting PCIe & SATA storage device
    • 1 x mini-PCIe slot supports Wi-Fi and LTE module
    • Support power input 12 VDC
  2. AIE100-ONA Fanless Edge AI System with NVIDIA Jetson Orin Nano SoM
    AIE100-ONA Fanless Edge AI System with NVIDIA Jetson Orin Nano SoM

    Axiomtek AIE100-ONA Fanless NVIDIA® Jetson Orin™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB, Allxon Remote Management

    Key Features:

    • NVIDIA® Jetson Orin™ Nano, up to 1024-core NVIDIA Ampere GPU
    • High AI computing performance for GPU-accelerated processing
    • Ideal for edge AI smart city applications
    • Supports one 15W GbE PoE for camera
    • Wide operating temperature from -20°C to +50°C
    • JetPack supported
    • Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
  3. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  4. MTS952P & MTS952P-I SATA III M.2 SSDs
    MTS952P & MTS952P-I SATA III M.2 SSDs

    SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C

    Key Features:

    • Dynamic thermal throttling
    • Built-in LDPC ECC (Error Correction Code) functionality
    • Advanced Garbage Collection
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
    • NCQ command for better performance
    • Power-saving DevSleep (Device Sleep) mode
    • Compliant with RoHS 2.0 standards
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • DDR3 DRAM Cache embedded
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
    • Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
    • Supports Transcend Scope Pro software
  5. Neu-X102-N50 Fanless Edge Computing System Powered by Intel N50
    Neu-X102-N50 Fanless Edge Computing System Powered by Intel N50

    Powered by Intel Processor N50 (Alder Lake-N), slim compact chassis and fanless design

    Key Features:

    • Intel processors N50 (Alder Lake-N), Intel 7 process
    • Slim compact chassis and fanless design
    • 1 x DDR4 SO-DIMM socket, max up to 16GB
    • Support 2 x HDMI 1.4b output, 4K@30Hz
    • TPM 2.0 onboard design for security
    • Richful I/O connectivity: 2 x 2.5GbE LAN, 4 x USB 3.2 Gen2
    • 1 x M.2 2242 Key M for supporting PCIe & SATA storage device
    • 1 x mini-PCIe slot supports Wi-Fi and LTE module
    • Support power input 12 VDC
  6. USD240I microSD Cards
    USD240I microSD Cards

    112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card

    Key Features:

    • Built-in LDPC ECC (Error Correction Code) functionality
    • Early Move
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • Wear-Levelling
    • Compliant with RoHS 2.0 standards
    • Electrostatic protection (ESD IEC 61000-4-2)
    • Compliant with SD specification 6.1
    • Compliant with UHS-I
    • Compliant with Video Speed Class 30 (V30)
    • Compliant with Application Performance Class 2 (A2)
    • Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
  7. eBOX671B Fanless Embedded System with 13th/12th Gen
    eBOX671B Fanless Embedded System with 13th/12th Gen

    eBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2

    Key Features:

    • 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
    • processors with Intel R680E chipset (Alder Lake S)
    • Dual DDR5 SO-DIMM for up to 64GB of memory
    • 4 LAN with optional PoE supported
    • Dual 2.5" SATA HDD drive bays with RAID 0 & 1
    • Supports MXM 3.1 Type A, up to 5 display outputs
    • -40 °C to +65 °C wide operating temperatures
    • Wide range power input from 9 to 36 VDC
    • Flexible I/O window supported via mPCIe modules
  8. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  9. MSM362M & MSM362I mSATA mini SSD
    MSM362M & MSM362I mSATA mini SSD

    16/32/64/128GB mSATA mini SSD

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Compliant with JEDEC MO-300B
    • MLC NAND flash
    • Supports Transcend Scope Pro software
    • Promised operational reliability in a wide temperature range (from -40° to 85°C)
    • Built-in BCH ECC (Error Correction Code) functionality
    • Advanced Global Wear-Leveling and Block management for reliability
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
  10. AIE110-XNX Edge AI Developer Kit NVIDIA® Jetson Xavier™
    AIE110-XNX Edge AI Developer Kit NVIDIA® Jetson Xavier™

    AIE110-XNX Edge AI Developer Kit NVIDIA® Jetson Xavier™ 1 x GbE LAN 1 x GbE PoE

    Key Features:

    • NVIDIA® Jetson Xavier™ NX, 384-core NVIDIA Volta™ GPU
    • 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE
    • Supports one 15W GbE PoE for camera
    • 1 M.2 M-Key NVMe SSD slot and 1 Micro SD slot
    • 1 PCI Express Mini Card for Wi-Fi/Bluetooth/LTE/GPS
    • JetPack supported
    • Supports 24/7 secure remote monitoring, control, and OTA
      deployment empowered by Allxon
  11. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
  12. AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
    AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin

    Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications

    Key Features:

    • NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
    • 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
    • 24 VDC with ignition power control
    • Supports eight PoE for IP cameras and LiDAR connectivity
    • -30°C to +50°C operating temperature range
    • Supports device management and optional OTA deployment powered by Allxon
  13. AIE100-ONX Fanless Edge AI System w/ NVIDIA Jetson Orin NX SoM
    AIE100-ONX Fanless Edge AI System w/ NVIDIA Jetson Orin NX SoM

    Fanless Edge AI System with NVIDIA Jetson Orin NX SoM, 1 x HDMI, 1 x GbE LAN, 1 x GbE PoE and 2 x USB, Remote Management Service Empowered by Allxon

    Key Features:

    • NVIDIA Jetson Orin NX with 1024-core NVIDIA Ampere GPU
    • High AI computing performance for GPU-accelerated processing
    • Ideal for edge AI smart city applications
    • Supports one 15W GbE PoE for camera
    • Wide operating temperature from -30°C to +50°C
    • JetPack supported
    • Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
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Tekdis offers custom built solutions for your application

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Tekdis offers custom built solutions for your application

Tell us what you need