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16 Items

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  1. ATC3750-IP7-WI8MR NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-IP7-WI8MR NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Edge AI Computer for Rail

    Key Features:

    • Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8)
    • Designed to be IP67-rated, rugged, and compact
    • 8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR
    • HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
    • Wide range operating temperature of -25°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24~110VDC w/ isolation, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT3), EN45545-2 certified
  2. ATC3750-IP7-8M NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-IP7-8M NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computer for Rail

    Key Features:

    • Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance

    • Designed to be IP67-rated, rugged, and compact

    • 8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR sensors

    • HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30

    • Wide range operating temperature of -25°C~70°C

    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity

    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6

    • 9~36VDC & 24V rail combined, ignition control & OCP/OVP

    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1

    • Military standard of MIL-STD-810H for anti-vibration/shock

    • CE/FCC, UKCA, E-mark, EN50155 (EN55011, EN50121-3-2, EN61373, OT3) certified

  3. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
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Tekdis offers custom built solutions for your application

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