Find your technical solution below

Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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1-24 of 93 Items

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  1. SR700-X4D IP65 MXM-GPU Military Computer Xeon E-2276ME w/ GPU
    SR700-X4D IP65 MXM-GPU Military Computer Xeon E-2276ME w/ GPU

    Quadro RTX A2000 GPU with DTL38999 connector, 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz) 

    Key Features:

    • IP65 MXM-GPU MIlitary Computer 
    • MIL-STD 810 Thermal, shock, vibration, Humidity, EMI 
    • Quadro® RTX A2000 (CUDA 2560, GDDR6-8GB) ; Options for GTX1050 Ti
    • 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz) 
    • Up to DDR4-64GB, Options for DDR4-128GB
    • 9V to 36V DC, Options for MIL-STD-461 18V~36V
    • Extended operating temp. -40°C to 60°C
    • Dimension : 360 x 230 x 86 mm (WxDxH)
  2. XPPC10-200 10.1” TFT WXGA Multi-Touch Panel PC
    XPPC10-200 10.1” TFT WXGA Multi-Touch Panel PC

    15.6” TFT FHD 16:9 Slim Bezel, Multi Touchscreen Computer Powered by 11th Generation Intel Core Processor

    Key Features:

    • 10.1” TFT WXGA 16:10 panel
    • 10 points P-Cap multi-touch with slim bezel design
    • IP65 protection on the front
    • Support: VESA/panel/openframe mount
    • 11th Generation Intel Tiger Lake-UP3 Core processor SoC
    • 1 x DDR4 SO-DIMM up to 32G
    • M.2 2280 Key M (PCIe x4) for storage device
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Support power input 12 VDC
  3. XPPC16-200 15.6” TFT FHD Multi-Touch Panel PC
    XPPC16-200 15.6” TFT FHD Multi-Touch Panel PC

    15.6” TFT FHD 16:9 Slim Bezel, IP65 Front, Multi-touch Computer Powered by 11th Generation Intel Core Processor

    Key Features:

    • 15.6” TFT FHD 16:9 panel
    • 10 Points P-Cap multi-touch with a slim bezel design
    • IP65 protection on the front
    • VESA/Panel/Openframe Mount
    • 11th Generation Intel® Tiger Lake-UP3 Core™ processor SoC
    • 1 x 260-pin DDR4 SO-DIMM up to 32G
    • Onboard M.2 2280 Key M with PCIe x4 signal for storage module
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Support power input 12 VDC
  4. AV600-RH Military IP66 AI Edge GPU Computer
    AV600-RH Military IP66 AI Edge GPU Computer

    Military IP66 with D38999 connectors VIDIA RTX A1000/A2000, 2048/2560 CUDA 

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel 13th Gen. Raptor Lake (H) i7-13800HE/HRE, 14C , 2.5/5.0 GHz Processor
    • Up to 64GB DDR5 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX A1000/A2000, 2048/2560 CUDA,4GB/8GB GDDR6 RAM
    • MIL-STD-461 EMI Filter18V~36V DC-Input 
    • Extreme Temperature : -40°C to 60°C
    • Dimensions : 250(L) x 325 (W) x 100 (H) mm
  5. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  6. NISE-70 Celeron/Core Fanless System
    NISE-70 Celeron/Core Fanless System

    Intel Celeron 6305E Processor Dual Core Fanless System

    Key Features:

    • Onboard Intel Celeron 6305E Processor
    • 4 x HDMI
    • 3 x USB 3.0, 1 x USB 2.0
    • 1 x RS232/422/485, 1 x RS232
    • 3 x GbE LAN ports; support WoL, teaming and PXE
    • Onboard TPM 2.0 chip
    • 1 x M.2 socket for storage/4G LTE/5G modules
    • 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
    • Support operating temperature from-5 to 55 Celsius degree
    • Support+12V to 24VDC input; support ATX power mode
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